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PDF TL2FL-LL1L Data sheet ( Hoja de datos )
| Número de pieza | TL2FL-LL1L | |
| Descripción | LED Lamps | |
| Fabricantes | Toshiba | |
| Logotipo |  |
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LED Lamps InGaN and Phosphor
TL2FL-LL1,L
1. Applications
• General Lighting
2. Features
(1) Size: 3.0 (L) mm × 1.4 (W) mm × 0.67 (H) mm
(2) High luminous flux LED: 19.6 lm (typ.) @IF = 65 mA
(3) Color: White (color temperature: 2700 K (typ.))
(4) Operating temperature range: Topr = -40 to 100
(5) Reflow-soldering is available.
3. Packaging and Pin Assignment
4-1J1A
TL2FL-LL1,L
1: Cathode
2: Anode
Start of commercial production
2014-02
1 2014-02-10
Rev.2.0
1 page  
TL2FL-LL1,L
Fig. 7.1 Chromaticity Rank (Note)
Note: Test conditions: IF = 65 mA, Ta = 25 , Tolerance: ±0.01
5 2014-02-10
Rev.2.0
5 Page 
TL2FL-LL1,L
10. Mounting
10.1. Mounting Precautions
• Do not apply mechanical stress to the resin body at high temperature.
The time taken for a device to return to the room temperature after reflow soldering depends on the
mounting board and environmental conditions.
• The resin body is easily scratched. Avoid friction against hard materials.
• When installing an assembled board into equipment, ensure that the devices on the board do not contact
with other components.
10.2. Soldering
Following show examples of reflow soldering.
• Temperature Profile (see following figures.)
Fig. 10.2.1 Temperature Profile for
Lead(Pb)-free Soldering (example)
Table 10.2.1 Temperature Profile for
Lead(Pb)-free Soldering (example)
• The product is evaluated using above reflow soldering conditions. No additional test is performed exceed
the condition as a evaluation. Please perform reflow soldering under the above conditions.
• Please perform the first reflow soldering with reference to the above temperature profile and within 4
weeks of opening the package.
• If a second reflow process is necessary, reflow soldering should be performed within 168 h of the first
reflow under the above conditions. Storage conditions before the second reflow soldering: 30 , 60 % RH
(max)
• Do not perform wave soldering.
• When any soldering corrections are made manually, a hot-plate should be used.
(only once at each soldering point)
10.3. Land Pattern Dimensions (for reference only)
Fig. 10.3.1 (Unit: mm)
11
2014-02-10
Rev.2.0
11 Page | ||
| Páginas | Total 17 Páginas | |
| PDF Descargar | [ Datasheet TL2FL-LL1L.PDF ] | |
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