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HCTS374KMSR の電気的特性と機能

HCTS374KMSRのメーカーはIntersil Corporationです、この部品の機能は「Radiation Hardened Octal D-Type Flip-Flop/ Three-State/ Positive Edge Triggered」です。


製品の詳細 ( Datasheet PDF )

部品番号 HCTS374KMSR
部品説明 Radiation Hardened Octal D-Type Flip-Flop/ Three-State/ Positive Edge Triggered
メーカ Intersil Corporation
ロゴ Intersil Corporation ロゴ 




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HCTS374KMSR Datasheet, HCTS374KMSR PDF,ピン配置, 機能
HCTS4002MS
August 1995
Radiation Hardened
Dual 4-Input NOR Gate
Features
Pinouts
• 3 Micron Radiation Hardened CMOS SOS
• Total Dose 200K RAD (Si)
• SEP Effective LET No Upsets: >100 MEV-cm2/mg
• Single Event Upset (SEU) Immunity < 2 x 10-9 Errors/Bit-Day
(Typ)
• Dose Rate Survivability: >1 x 1012 RAD (Si)/s
• Dose Rate Upset >1010 RAD (Si)/s 20ns Pulse
• Latch-Up Free Under Any Conditions
• Military Temperature Range: -55oC to +125oC
• Significant Power Reduction Compared to LSTTL ICs
14 LEAD CERAMIC DUAL-IN-LINE METAL SEAL
PACKAGE (SBDIP) MIL-STD-1835 CDIP2-T14
TOP VIEW
Y1 1
A1 2
B1 3
C1 4
D1 5
NC 6
GND 7
14 VCC
13 Y2
12 D2
11 C2
10 B2
9 A2
8 NC
• DC Operating Voltage Range: 4.5V to 5.5V
• LSTTL Input Compatibility
- VIL = 0.8V Max
- VIH = VCC/2 Min
• Input Current Levels Ii 5µA at VOL, VOH
Description
The Intersil HCTS4002MS is a Radiation Hardened Dual 4-Input
NOR Gate. A high on any input forces the output to a low state.
The HCTS4002MS utilizes advanced CMOS/SOS technology to
achieve high-speed operation. This device is a member of
radiation hardened, high-speed, CMOS/SOS Logic Family.
The HCTS4002MS is supplied in a 14 lead Ceramic flatpack (K
suffix) or a SBDIP Package (D suffix).
14 LEAD CERAMIC METAL SEAL FLATPACK PACKAGE
(FLATPACK) MIL-STD-1835 CDFP3-F14
TOP VIEW
Y1
A1
B1
C1
D1
NC
GND
1 14
2 13
3 12
4 11
5 10
69
78
VCC
Y2
D2
C2
B2
A2
NC
Functional Diagram
An
Ordering Information
PART
NUMBER
TEMPERATURE SCREENING
RANGE
LEVEL
PACKAGE
HCTS4002DMSR -55oC to +125oC Intersil Class 14 Lead SBDIP
S Equivalent
HCTS4002KMSR -55oC to +125oC Intersil Class
S Equivalent
14 Lead
Ceramic
Flatpack
HCTS4002D/
Sample
+25oC
Sample
14 Lead SBDIP
HCTS4002K/
Sample
+25oC
Sample
14 Lead
Ceramic
Flatpack
HCTS4002HMSR
+25oC
Die
Die
Bn
Yn
Cn
Dn
TRUTH TABLE
INPUTS
OUTPUTS
An Bn Cn Dn
Yn
LLLL
H
HXXX
L
XHXX
L
XXHX
L
XXXH
L
NOTE: L = Logic Level Low, H = Logic level High,
X = Don’t Care
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
http://www.intersil.com or 407-727-9207 | Copyright © Intersil Corporation 1999
718
Spec Number 518632
File Number 3075.1

1 Page





HCTS374KMSR pdf, ピン配列
Specifications HCTS4002MS
TABLE 2. AC ELECTRICAL PERFORMANCE CHARACTERISTICS
PARAMETER
Input to Output
SYMBOL
TPHL,
TPLH
(NOTES 1, 2)
CONDITIONS
VCC = 4.5V
GROUP
A SUB-
GROUPS
9
10, 11
TEMPERATURE
+25oC
+125oC, -55oC
NOTES:
1. All voltages referenced to device GND.
2. AC measurements assume RL = 500, CL = 50pF, Input TR = TF = 3ns, VIL = GND, VIH = 3V.
LIMITS
MIN MAX UNITS
2 22 ns
2 25 ns
TABLE 3. ELECTRICAL PERFORMANCE CHARACTERISTICS
LIMITS
PARAMETER
Capacitance Power
Dissipation
SYMBOL
CPD
CONDITIONS
VCC = 5.0V, f = 1MHz
Input Capacitance
CIN VCC = Open, f = 1MHz
Output Transition
Time
TTHL
TTLH
VCC = 4.5V
NOTES
1
1
1
1
1
1
TEMPERATURE
+25oC
+125oC
+25oC
+125oC
+25oC
+125oC
MIN MAX UNITS
- 38 pF
- 47 pF
- 10 pF
- 10 pF
- 15 ns
- 22 ns
NOTE:
1. The parameters listed in Table 3 are controlled via design or process parameters. Min and Max Limits are guaranteed but not directly
tested. These parameters are characterized upon initial design release and upon design changes which affect these characteristics.
TABLE 4. DC POST RADIATION ELECTRICAL PERFORMANCE CHARACTERISTICS
PARAMETER
Quiescent Current
Output Current (Sink)
Output Current (Source)
Output Voltage Low
Output Voltage High
Input Leakage Current
Noise Immunity
Functional Test
Input to Output
SYMBOL
(NOTES 1, 2)
CONDITIONS
ICC VCC = 5.5V, VIN = VCC or GND
IOL VCC = 4.5V, VIN = VCC or GND,
VOUT = 0.4V
IOH VCC = 4.5V, VIN = VCC or GND,
VOUT = VCC -0.4V
VOL VCC = 4.5V or 5.5V, VIH = VCC/2,
VIL = 0.8V, IOL = 50µA
VOH
VCC = 4.5V or 5.5V, VIH =VCC/2,
VIL = 0.8V, IOH = -50µA
IIN VCC = 5.5V, VIN = VCC or GND
FN VCC = 4.5V, VIH = 2.25V,
VIL = 0.8V at 200K RAD,
(Note 3)
TPHL,
TPLH
VCC = 4.5V
TEMPERATURE
+25oC
+25oC
+25oC
+25oC
+25oC
+25oC
+25oC
+25oC
NOTES:
1. All voltages referenced to device GND.
2. AC measurements assume RL = 500, CL = 50pF, Input TR = TF = 3ns, VIL = GND, VIH = 3V.
3. For functional tests VO 4.0V is recognized as a logic “1”, and VO 0.5V is recognized as a logic “0”.
200K RAD
LIMITS
MIN MAX
- 0.2
4.0 -
-4.0 -
- 0.1
VCC
-0.1
-
-
-
±5
-
2 25
UNITS
mA
mA
mA
V
V
µA
-
ns
Spec Number 518632
720


3Pages


HCTS374KMSR 電子部品, 半導体
HCTS4002MS
Intersil Space Level Product Flow - ‘MS’
Wafer Lot Acceptance (All Lots) Method 5007
(Includes SEM)
GAMMA Radiation Verification (Each Wafer) Method 1019,
4 Samples/Wafer, 0 Rejects
100% Nondestructive Bond Pull, Method 2023
Sample - Wire Bond Pull Monitor, Method 2011
Sample - Die Shear Monitor, Method 2019 or 2027
100% Internal Visual Inspection, Method 2010, Condition A
100% Temperature Cycle, Method 1010, Condition C,
10 Cycles
100% Constant Acceleration, Method 2001, Condition per
Method 5004
100% PIND, Method 2020, Condition A
100% External Visual
100% Serialization
100% Initial Electrical Test (T0)
100% Static Burn-In 1, Condition A or B, 24 hrs. min.,
+125oC min., Method 1015
100% Interim Electrical Test 1 (T1)
100% Delta Calculation (T0-T1)
100% Static Burn-In 2, Condition A or B, 24 hrs. min.,
+125oC min., Method 1015
100% Interim Electrical Test 2 (T2)
100% Delta Calculation (T0-T2)
100% PDA 1, Method 5004 (Notes 1and 2)
100% Dynamic Burn-In, Condition D, 240 hrs., +125oC or
Equivalent, Method 1015
100% Interim Electrical Test 3 (T3)
100% Delta Calculation (T0-T3)
100% PDA 2, Method 5004 (Note 2)
100% Final Electrical Test
100% Fine/Gross Leak, Method 1014
100% Radiographic, Method 2012 (Note 3)
100% External Visual, Method 2009
Sample - Group A, Method 5005 (Note 4)
100% Data Package Generation (Note 5)
NOTES:
1. Failures from Interim electrical test 1 and 2 are combined for determining PDA 1.
2. Failures from subgroup 1, 7, 9 and deltas are used for calculating PDA. The maximum allowable PDA = 5% with no more than 3% of the
failures from subgroup 7.
3. Radiographic (X-Ray) inspection may be performed at any point after serialization as allowed by Method 5004.
4. Alternate Group A testing may be performed as allowed by MIL-STD-883, Method 5005.
5. Data Package Contents:
• Cover Sheet (Intersil Name and/or Logo, P.O. Number, Customer Part Number, Lot Date Code, Intersil Part Number, Lot Number, Quan-
tity).
• Wafer Lot Acceptance Report (Method 5007). Includes reproductions of SEM photos with percent of step coverage.
• GAMMA Radiation Report. Contains Cover page, disposition, Rad Dose, Lot Number, Test Package used, Specification Numbers, Test
equipment, etc. Radiation Read and Record data on file at Intersil.
• X-Ray report and film. Includes penetrometer measurements.
• Screening, Electrical, and Group A attributes (Screening attributes begin after package seal).
• Lot Serial Number Sheet (Good units serial number and lot number).
• Variables Data (All Delta operations). Data is identified by serial number. Data header includes lot number and date of test.
• The Certificate of Conformance is a part of the shipping invoice and is not part of the Data Book. The Certificate of Conformance is signed
by an authorized Quality Representative.
Spec Number 518632
723

6 Page



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部品番号部品説明メーカ
HCTS374KMSR

Radiation Hardened Octal D-Type Flip-Flop/ Three-State/ Positive Edge Triggered

Intersil Corporation
Intersil Corporation


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