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PDF HCS164K Data sheet ( Hoja de datos )
| Número de pieza | HCS164K | |
| Descripción | Radiation Hardened 8-Bit Serial-In/Parallel-Out Register | |
| Fabricantes | Intersil Corporation | |
| Logotipo |  |
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HCS164MS
September 1995
Radiation Hardened
8-Bit Serial-In/Parallel-Out Register
Features
Pinouts
• 3 Micron Radiation Hardened CMOS SOS
• Total Dose 200K RAD (Si)
• SEP Effective LET No Upsets: >100 MEV-cm2/mg
• Single Event Upset (SEU) Immunity < 2 x 10-9 Errors/
Bit-Day (Typ)
• Dose Rate Survivability: >1 x 1012 RAD (Si)/s
• Dose Rate Upset >1010 RAD (Si)/s 20ns Pulse
• Latch-Up-Free Under Any Conditions
• Fanout (Over Temperature Range)
- Standard Outputs - 10 LSTTL Loads
• Military Temperature Range: -55oC to +125oC
14 LEAD CERAMIC DUAL-IN-LINE
METAL SEAL PACKAGE (SBDIP)
MIL-STD-1835 CDIP2-T14, LEAD FINISH C
TOP VIEW
DS1 1
DS2 2
Q0 3
Q1 4
Q2 5
Q3 6
GND 7
14 VCC
13 Q7
12 Q6
11 Q5
10 Q4
9 MR
8 CP
• Significant Power Reduction Compared to LSTTL ICs
• DC Operating Voltage Range: 4.5V to 5.5V
• Input Logic Levels
- VIL = 0.3 VCC Max
- VIH = 0.7 VCC Min
• Input Current Levels Ii ≤ 5µA at VOL, VOH
Description
The Intersil HCS164MS is a Radiation Hardened 8-bit
Serial-In/Parallel-Out Shift Register that has fully synchro-
nous serial data entry and an asynchronous master reset.
The HCS164MS utilizes advanced CMOS/SOS technology
to achieve high-speed operation. This device is a member of
radiation hardened, high-speed, CMOS/SOS Logic Family.
14 LEAD CERAMIC METAL SEAL
FLATPACK PACKAGE (FLATPACK)
MIL-STD-1835 CDFP3-F14, LEAD FINISH C
TOP VIEW
DS1
DS2
Q0
Q1
Q2
Q3
GND
1 14
2 13
3 12
4 11
5 10
69
78
VCC
Q7
Q6
Q5
Q4
MR
CP
The HCS164MS is supplied in a 14 lead Ceramic flatpack
(K suffix) or a SBDIP Package (D suffix).
Ordering Information
PART NUMBER
HCS164DMSR
HCS164KMSR
HCS164D/Sample
HCS164K/Sample
HCS164HMSR
TEMPERATURE RANGE
-55oC to +125oC
-55oC to +125oC
+25oC
+25oC
+25oC
SCREENING LEVEL
Intersil Class S Equivalent
Intersil Class S Equivalent
Sample
Sample
Die
PACKAGE
14 Lead SBDIP
14 Lead Ceramic Flatpack
14 Lead SBDIP
14 Lead Ceramic Flatpack
Die
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 321-724-7143 | Copyright © Intersil Corporation 1999
230
Spec Number 518756
File Number 2465.2
1 page  
Specifications HCS164MS
TABLE 4. DC POST RADIATION ELECTRICAL PERFORMANCE CHARACTERISTICS (Continued)
PARAMETER
Noise Immunity
Functional Test
CP to Qn
MR to Qn
SYMBOL
(NOTES 1, 2)
CONDITIONS
FN VCC = 4.5V, VIH = 0.70(VCC),
VIL = 0.30(VCC), (Note 3)
TPHL
TPLH
VCC = 4.5V
TPHL VCC = 4.5V
TEMPERATURE
+25oC
200K RAD
LIMITS
MIN MAX UNITS
---
+25oC
2 37 ns
+25oC
2 37 ns
NOTES:
1. All voltages referenced to device GND.
2. AC measurements assume RL = 500Ω, CL = 50pF, Input TR = TF = 3ns, VIL = GND, VIH = VCC.
3. For functional tests VO ≥ 4.0V is recognized as a logic “1”, and VO ≤ 0.5V is recognized as a logic “0”.
TABLE 5. BURN-IN AND OPERATING LIFE TEST, DELTA PARAMETERS (+25oC)
PARAMETER
GROUP B
SUBGROUP
DELTA LIMIT
ICC 5 12µA
IOL/IOH
5 -15% of 0 Hour
TABLE 6. APPLICABLE SUBGROUPS
CONFORMANCE GROUPS
METHOD
GROUP A SUBGROUPS
READ AND RECORD
Initial Test (Preburn-In)
100%/5004
1, 7, 9
ICC, IOL/H
Interim Test I (Postburn-In)
100%/5004
1, 7, 9
ICC, IOL/H
Interim Test II (Postburn-In)
100%/5004
1, 7, 9
ICC, IOL/H
PDA
100%/5004
1, 7, 9, Deltas
Interim Test III (Postburn-In)
100%/5004
1, 7, 9
ICC, IOL/H
PDA
100%/5004
1, 7, 9, Deltas
Final Test
100%/5004
2, 3, 8A, 8B, 10, 11
Group A (Note 1)
Sample/5005
1, 2, 3, 7, 8A, 8B, 9, 10, 11
Group B
Subgroup B-5
Sample/5005
1, 2, 3, 7, 8A, 8B, 9, 10, 11, Deltas Subgroups 1, 2, 3, 9, 10, 11,
(Note 2)
Subgroup B-6
Sample/5005
1, 7, 9
Group D
Sample/5005
1, 7, 9
NOTES:
1. Alternate group A testing in accordance with method 5005 of MIL-STD-883 may be exercised.
2. Table 5 parameters only.
Spec Number 518756
234
5 Page | ||
| Páginas | Total 9 Páginas | |
| PDF Descargar | [ Datasheet HCS164K.PDF ] | |
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