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HCPL0738 の電気的特性と機能

HCPL0738のメーカーはAgilent(Hewlett-Packard)です、この部品の機能は「High Speed CMOS Optocoupler」です。


製品の詳細 ( Datasheet PDF )

部品番号 HCPL0738
部品説明 High Speed CMOS Optocoupler
メーカ Agilent(Hewlett-Packard)
ロゴ Agilent(Hewlett-Packard) ロゴ 




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HCPL0738 Datasheet, HCPL0738 PDF,ピン配置, 機能
Agilent HCPL-0738
High Speed CMOS Optocoupler
Data Sheet
Description
The HCPL-0738 is a dual-channel
15 MBd CMOS optocoupler in
SOIC-8 package. The HCPL-0738
optocoupler utilizes the latest CMOS
IC technology to achieve out-
standing performance with very low
power consumption. Basic building
blocks of HCPL-0738 are high
speed LEDs and CMOS detector ICs.
Agilent also offers the same
performance in the single channel
version, HCPL-0708. Each
detector incorporates an
integrated photodiode, a high
speed transimpedance amplifier,
and a voltage comparator with an
output driver.
Functional Diagram
ANODE 1 1
CATHODE 1 2
CATHODE 2 3
ANODE 2 4
8 VDD
7 VO 1
6 VO 2
5 GND
Truth Table
LED VO, Output
OFF H
ON L
Note: A 0.1 µF bypass capacitor must be
connected between pins 5 and 8.
Features
• 15 ns typical pulse width
distortion
• 40 ns maximum prop. delay skew
• 20 ns typical prop. delay
• High speed: 15 MBd
• + 5 V CMOS compatibility
• 10 kV/µS minimum common mode
rejection
• –40 to 100˚C temperature range
• Safety and regulatory approvals
–UL recognized (2500 V rms for
1 minute per UL 1577)
–CSA component acceptance
notice #5.
–VDE 0884 (TUV) approved for
HCPL-0738 Option 060
Applications
• PDP (plasma display panel)
• Digital field bus isolation:
DeviceNet, SDS, Profibus
• Multiplexed data transmission
• Computer peripheral interface
• Microprocessor system interface
• DC/DC converter
CAUTION: It is advised that normal static precautions be taken in handling and assembly of this
component to prevent damage and/or degradation which may be induced by ESD.

1 Page





HCPL0738 pdf, ピン配列
Regulatory Information
The HCPL-0738 has been
approved by the following
organizations:
UL
Recognized under UL 1577,
component recognition program,
File E55361.
CSA
Approved under CSA Component
Acceptance Notice #5, File
CA88324.
TUV
Approved according to
VDE 0884/06.92, Certificate
R9650938.
Insulation and Safety Related Specifications (approval pending)
Parameter
Minimum External Air Gap
(Clearance)
Minimum External Tracking
(Creepage)
Minimum Internal Plastic Gap
(Internal Clearance)
Tracking Resistance
(Comparative Tracking Index)
Isolation Group
Symbol
L(I01)
L(I02)
CTI
Value
4.9
4.8
0.08
175
IIIa
Units
mm
mm
mm
Volts
Conditions
Measured from input terminals to output terminals,
shortest distance through air.
Measured from input terminals to output terminals,
shortest distance path along body.
Insulation thickness between emitter and detector; also
known as distance through insulation.
DIN IEC 112/VDE 0303 Part 1
Material Group (DIN VDE 0110, 1/89, Table 1)
All Agilent data sheets report the
creepage and clearance inherent
to the optocoupler component
itself. These dimensions are
needed as a starting point for the
equipment designer when deter-
mining the circuit insulation re-
quirements. However, once
mounted on a printed circuit
board, minimum creepage and
clearance requirements must be
met as specified for individual
equipment standards. For creep-
age, the shortest distance path
along the surface of a printed
circuit board between the solder
fillets of the input and output
leads must be considered. There
are recommended techniques
such as grooves and ribs which
may be used on a printed circuit
board to achieve desired creep-
age and clearances. Creepage and
clearance distances will also
change depending on factors
such as pollution degree and
insulation level.
Absolute Maximum Ratings
Parameter
Storage Temperature
Ambient Operating Temperature
Supply Voltage
Output Voltage
Average Forward Input Current
Average Output Current
Lead Solder Temperature
Solder Reflow Temperature Profile
Symbol
Minimum
Maximum
TS –55 125
TA –40 100
VDD 0
6.0
VO –0.5 VDD + 0.5
IF — 20
IO — 2
260˚C for 10 seconds, 1.6 mm below seating plane
See Solder Reflow Thermal Profile section
Units
˚C
˚C
Volts
Volts
mA
mA
Recommended Operating Conditions
Parameter
Ambient Operating Temperature
Supply Voltages
Input Current (ON)
Symbol
TA
VDD
IF
3
Minimum
–40
4.5
10
Maximum
100
5.5
16
Units
˚C
V
mA


3Pages


HCPL0738 電子部品, 半導体
Application Information
Bypassing and PC Board Layout
The HCPL-0738 optocoupler is
extremely easy to use. No exter-
nal interface circuitry is required
because the HCPL-0738 uses
high-speed CMOS IC technology
allowing CMOS logic to be con-
nected directly to the inputs and
outputs.
As shown in Figure 6, the only
external component required for
proper operation is the bypass
capacitor. Capacitor values
should be between 0.01 µF and
0.1 µF. For each capacitor, the
total lead length between both
ends of the capacitor and the
power-supply pins should not
exceed 20 mm.
VI1
GND 1
GND 1
VI2
1
2
3
4
8 VDD
C
7 VO 1
6 VO 2
5 GND 2
Figure 6. Recommended printed circuit board layout.
Propagation Delay, Pulse-Width
Distortion, and Propagation Delay
Skew
Propagation delay is a figure of
merit which describes how
quickly a logic signal propagates
through a system. The propaga-
tion delay from low to high (tPLH)
is the amount of time required for
an input signal to propagate to
the output, causing the output to
change from low to high.
Similarly, the propagation delay
from high to low (tPHL) is the
amount of time required for the
input signal to propagate to the
output, causing the output to
change from high to low (see
Figure 7).
Pulse-width distortion (PWD)
results when tPLH and tPHL differ
in value. PWD is defined as the
difference between tPLH and tPHL
and often determines the maxi-
mum data rate capability of a
transmission system. PWD can
be expressed in percent by
dividing the PWD (in ns) by the
minimum pulse width (in ns)
being transmitted. Typically,
PWD on the order of 20-30% of
the minimum pulse width is
tolerable; the exact figure de-
pends on the particular applica-
tion (RS232, RS422, T-1, etc.).
Propagation delay skew, tPSK, is
an important parameter to con-
sider in parallel data applications
where synchronization of signals
on parallel data lines is a con-
cern. If the parallel data is being
sent through a group of
optocouplers, differences in
propagation delays will cause the
data to arrive at the outputs of
6

6 Page



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