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HCPL-0708060 の電気的特性と機能

HCPL-0708060のメーカーはAgilent(Hewlett-Packard)です、この部品の機能は「High Speed CMOS Optocoupler」です。


製品の詳細 ( Datasheet PDF )

部品番号 HCPL-0708060
部品説明 High Speed CMOS Optocoupler
メーカ Agilent(Hewlett-Packard)
ロゴ Agilent(Hewlett-Packard) ロゴ 




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HCPL-0708060 Datasheet, HCPL-0708060 PDF,ピン配置, 機能
Agilent HCPL-0708
High Speed
CMOS Optocoupler
Data Sheet
Description
Available in SO-8 package, the
HCPL-0708 optocoupler utilizes the
latest CMOS IC technology to
achieve outstanding performance
with very low power consumption.
Basic building blocks of the HCPL-
Functional Diagram
NC 1
ANODE 2
8 VDD
7 NC
0708 are a high speed LED and a
CMOS detector IC. The detector
incorporates an integrated
photodiode, a high-speed trans-
impedance amplifier, and a voltage
comparator with an output driver.
Features
• +5 V CMOS compatibility
• 15 ns typical pulse width distortion
• 30 ns max. pulse width distortion
• 40 ns max. propagation delay
skew
• High speed: 15 MBd
• 60 ns max. propagation delay
• 10 kV/µs minimum common mode
rejection
• –40 to 100°C temperature range
• Safety and regulatory approvals
pending
– UL recognized
2500 V rms for 1 min. per
UL 1577 for HCPL-0708
– CSA component acceptance
Notice #5
– VDE 0884 (TUV) approved for
HCPL-0708 Option 060
CATHODE 3
NC 4
6 VO
5 GND
TRUTH TABLE
LED
OFF
ON
VO, OUTPUT
H
L
*A 0.1 µF bypass capacitor
must be connected between
pins 5 and 8.
Applications
• Scan drive in PDP
• Digital field bus isolation:
DeviceNet, SDS, Profibus
• Multiplexed data transmission
• Computer peripheral interface
• Microprocessor system interface
• DC/DC converter
CAUTION: It is advised that normal static precautions be taken in handling and assembly of this
component to prevent damage and/or degradation which may be induced by ESD.

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HCPL-0708060 pdf, ピン配列
Solder Reflow Thermal Profile
300
PREHEATING RATE 3°C + 1°C/–0.5°C/SEC.
REFLOW HEATING RATE 2.5°C ± 0.5°C/SEC. PEAK
TEMP.
245°C
200
160°C
150°C
140°C
100
2.5°C ± 0.5°C/SEC.
3°C + 1°C/–0.5°C
PREHEATING TIME
150°C, 90 + 30 SEC.
30
SEC.
30
SEC.
PEAK
TEMP.
240°C
PEAK
TEMP.
230°C
SOLDERING
TIME
200°C
50 SEC.
ROOM
TEMPERATURE
0
0
TIGHT
TYPICAL
LOOSE
50 100 150 200 250
TIME (SECONDS)
Regulatory Information
The HCPL-0708 has been
approved by the following
organizations:
UL
Recognized under UL 1577,
component recognition program,
File E55361.
CSA
Approved under CSA Component
Acceptance Notice #5, File
CA88324.
VDE
Approved according to
VDE 0884/06.92,
File 6591-23-4880-1005.
TUV
Approved according to
VDE 0884/06.92, Certificate
R9650938.
Insulation and Safety Related Specifications
Parameter
Symbol Value
Minimum External Air
Gap (Clearance)
L(I01)
4.9
Minimum External
Tracking (Creepage)
L(I02)
4.8
Minimum Internal Plastic
Gap (Internal Clearance)
0.08
Tracking Resistance
CTI
(Comparative Tracking Index)
175
Units
mm
mm
mm
Volts
Conditions
Measured from input terminals to output
terminals, shortest distance through air.
Measured from input terminals to output
terminals, shortest distance path along body.
Insulation thickness between emitter and
detector; also known as distance through
insulation.
DIN IEC 112/VDE 0303 Part 1
Isolation Group
IIIa Material Group (DIN VDE 0110, 1/89, Table 1)
All Agilent data sheets report the
creepage and clearance inherent
to the optocoupler component
itself. These dimensions are
needed as a starting point for the
equipment designer when
determining the circuit insulation
requirements. However, once
mounted on a printed circuit
board, minimum creepage and
clearance requirements must be
met as specified for individual
equipment standards. For
creepage, the shortest distance
path along the surface of a
printed circuit board between the
solder fillets of the input and
output leads must be considered.
There are recommended
techniques such as grooves and
ribs which may be used on a
printed circuit board to achieve
desired creepage and clearances.
Creepage and clearance distances
will also change depending on
factors such as pollution degree
and insulation level.
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3Pages


HCPL-0708060 電子部品, 半導体
Package Characteristics
All Typicals at TA = 25°C.
Parameter
Input-Output Insulation
Input-Output Momentary
Withstand Voltage
Input-Output Resistance
Input-Output Capacitance
Symbol
II-O
Min. Typ. Max. Units
1 µA
VISO 2500
RI-O 1012
CI-O 0.6
Vrms
pF
Test Conditions
45% RH, t = 5 s
VI-O = 3 kV dc,
TA = 25°C
RH 50%, t = 1 min.,
TA = 25°C
VI-O = 500 V dc
f = 1 MHz, TA = 25°C
Notes:
1. tPHL propagation delay is measured from the 50% level on the risiing edge of the input pulse to the 2.5 V level of the falling edge
of the VO signal. tPLH propagation delay is measured from the 50% level on the falling edge of the input pulse to the 2.5 V level of
the rising edge of the VO signal.
2. PWD is defined as |tPHL - tPLH|.
3. tPSK is equal to the magnitude of the worst case difference in tPHL and/or tPLH that will be seen between units at any given
temperature within the recommended operating conditions.
4. CMH is the maximum tolerable rate of rise of the common mode voltage to assure that the output will remain in a high logic state.
5. CML is the maximum tolerable rate of fall of the common mode voltage to assure that the output will remain in a low logic state.
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部品番号部品説明メーカ
HCPL-0708060

High Speed CMOS Optocoupler

Agilent(Hewlett-Packard)
Agilent(Hewlett-Packard)


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