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uClamp0511T の電気的特性と機能

uClamp0511TのメーカーはSemtech Corporationです、この部品の機能は「1-Line ESD protection」です。


製品の詳細 ( Datasheet PDF )

部品番号 uClamp0511T
部品説明 1-Line ESD protection
メーカ Semtech Corporation
ロゴ Semtech Corporation ロゴ 




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uClamp0511T Datasheet, uClamp0511T PDF,ピン配置, 機能
PROTECTION PRODUCTS - MicroClampTM
Description
The μClampTM series of TVS arrays are designed to pro-
tect sensitive electronics from damage or latch-up due
to ESD. It is designed to replace multilayer varistors
(MLVs) in portable applications such as cell phones, note-
book computers, and other portable electronics. It fea-
tures large cross-sectional area junctions for conducting
high transient currents. They offer desirable character-
istics for board level protection including fast response
time, low operating and clamping voltage, and no device
degradation.
The μClampTM0511T is in a 2-pin, RoHS/WEEE compli-
ant, SLP1006P2T package. It measures 1.0 x 0.6 mm
with a nominal height of only 0.4mm. The leads are
spaced at a pitch of 0.65mm and are finished with
lead-free NiPdAu. Each device will protect one line
operating at 5 volts. It gives the designer the flexibility
to protect single lines in applications where arrays are
not practical. They may be used to meet the ESD
immunity requirements of IEC 61000-4-2, Level 4
(±15kV air, ±8kV contact discharge). The combination
of small size and high ESD surge capability makes
them ideal for use in portable applications such as
cellular phones, digital cameras, and MP3 players.
uClamp0511T
Low Profile μClampTM
1-Line ESD protection
Features
‹ Transient protection for data lines to
IEC 61000-4-2 (ESD) ±15kV (air), ±8kV (contact)
IEC 61000-4-4 (EFT) 40A (tp = 5/50ns)
Cable Discharge Event (CDE)
‹ Ultra-small package (1.0 x 0.6 x 0.4mm)
‹ Protects one data or power line
‹ Low reverse current: 3nA typical (VR=3.3V)
‹ Working voltage: - 5V / +5V
‹ Low capacitance: 4pF typical
‹ Solid-state silicon-avalanche technology
Mechanical Characteristics
‹ SLP1006P2T package
‹ RoHS/WEEE Compliant
‹ Nominal Dimensions: 1.0 x 0.6 x 0.4 mm
‹ Lead Finish: NiPdAu
‹ Molding compound flammability rating: UL 94V-0
‹ Marking : Marking code, cathode band
‹ Packaging : Tape and Reel
Applications
‹ Cellular Handsets & Accessories
‹ Keypads, Side Keys, USB 2.0, LCD Displays
‹ Notebooks & Desktop Computers
‹ Portable Instrumentation
‹ Digital Cameras
‹ Peripherals
‹ MP3 Players
Dimensions
Schematic & PIN Configuration
1.0
0.65
0.60
2
0.40
Nominal Dimensions (mm)
Revision 07/1/2008
1
SLP1006P2T (Bottom View)
1 www.semtech.com

1 Page





uClamp0511T pdf, ピン配列
uClamp0511T
PROTECTION PRODUCTS
Non-Repetitive Peak Pulse Power vs. Pulse Time
10
Clamping Voltage vs. Peak Pulse Current
15.00
1
10.00
0.1
0.01
0.1
1 10
Pulse Duration - tp (us)
100
Normalized Junction Capacitance vs. Reverse Voltage
1.2
1
0.8
0.6
0.4
0.2
0
0
f = 1MHz
123
Reverse Voltage - VR (V)
4
5
ESD Clamping (Pin 1 to 2 and 2 to 1)
(8kV Contact per IEC 61000-4-2)
5.00
0.00
0
Waveform
Parameters:
tr = 8µs
td = 20µs
0.5 1 1.5 2 2.5
Peak Pulse Current - IPP (A)
3
Typical Insertion Loss (S21)
CH1 S21 LOG 6 dB / REF 0 dB
0 dB
-6 dB
-12 dB
-18 dB
-24 dB
5
1: -0.9412 dB
800 MHz
2: -1.315 dB
800 MHz
12
3: -16.289 dB
1.8 GHz
4 4: -10.05 dB
2.5 GHz
3
5: -8.6364 dB
2.7 GHz
-30 dB
-36 dB
-42 dB
-48 dB
1
MHz
10
MHz
100
MHz
13
GHz GHz
START. 030 MHz
STOP 3000.000000 MHz
ESD Clamping (Pin 1 to 2 and 2 to 1)
(-8kV Contact per IEC 61000-4-2)
Note: Data is taken with a 10x attenuator
© 2008 Semtech Corp.
Note: Data is taken with a 10x attenuator
3
www.semtech.com


3Pages


uClamp0511T 電子部品, 半導体
PROTECTION PRODUCTS
Outline Drawing - SLP1006P2T
uClamp0511T
AD
B
E
TOP VIEW
aaa C
A1
PIN 1 ID
bxN
bbb C A B
A SEATING
PLANE
C
R
DIMENSIONS
DIM
INCHES
MIN NOM MAX
MILLIMETERS
MIN NOM MAX
A .015 .016 .017 0.37 0.40 0.43
A1 .000 .001 .002 0.00 0.03 0.05
b .018 .020 .022 0.45 0.50 0.55
D .035 .039 .043 0.90 1.00 1.10
E .020 .024 .028 0.50 0.60 0.70
e .026 BSC
0.65 BSC
L .008 .010 .012 0.20 0.25 0.30
R .002 .004 .006 0.05 0.10 0.15
N2
2
aaa .003
0.08
bbb .004
0.10
2x L
e
BOTTOM VIEW
NOTES:
1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
Land Pattern - SLP1006P2T
(C) G
Y
Z
X
DIMENSIONS
DIM INCHES
MILLIMETERS
C (.033)
G .012
X .024
Y .022
Z .055
(0.85)
0.30
0.60
0.55
1.40
NOTES:
1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
2. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY.
CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR
COMPANY'S MANUFACTURING GUIDELINES ARE MET.
© 2008 Semtech Corp.
6
www.semtech.com

6 Page



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