DataSheet.jp

HCD-GTX88 の電気的特性と機能

HCD-GTX88のメーカーはSonyです、この部品の機能は「CD DECK RECEIVER SERVICE MANUAL」です。


製品の詳細 ( Datasheet PDF )

部品番号 HCD-GTX88
部品説明 CD DECK RECEIVER SERVICE MANUAL
メーカ Sony
ロゴ Sony ロゴ 




このページの下部にプレビューとHCD-GTX88ダウンロード(pdfファイル)リンクがあります。
Total 30 pages

No Preview Available !

HCD-GTX88 Datasheet, HCD-GTX88 PDF,ピン配置, 機能
HCD-GTX88
SERVICE MANUAL
Ver. 1.0 2007. 06
E Model
Australian Model
• HCD-GTX88 is the tuner, deck,
CD and amplifier section in
MHC-GTX88.
Amplifier section
Brazil model only
The following are measured at
AC 127 V or 220 V, 50/60 Hz
Front/Surround speaker
RMS output power: 205 W + 205 W
(at 8 , 1 kHz, 10% THD)
Subwoofer
RMS output power: 130 W + 130 W
(at 6 , 100 Hz, 10% THD)
Other models
The following are measured at
Mexican model:
AC 127 V, 60 Hz
Other models:
AC 120, 220, 240 V, 50/60 Hz
Front/Surround speaker
Power Output (rated): 175 W + 175 W
(at 8 , 1 kHz, 1% THD)
RMS output power (reference):
255 W + 255 W
(per channel at 8 , 1 kHz,
10% THD)
Subwoofer
RMS output power (reference):
130 W + 130 W
(at 6 , 100 Hz, 10% THD)
CD
Section
Model Name Using Similar Mechanism
CD Mechanism Type
Optical Pick-up Name
Tape Deck
Model Name Using Similar Machanism
Section
NEW
CDM74KF-K6BD91UR-WOD//M
KSM-213DCP/C2NP
HCD-GN1100D
SPECIFICATIONS
Inputs
VIDEO (AUDIO IN) L/R:
Voltage 250 mV,
impedance 47 kilohms
AUDIO (AUDIO IN) L/R:
Voltage 450 mV,
impedance 47 kilohms
MIC:
Sensitivity 1 mV,
impedance 10 kilohms
(USB) port:
Type A
Outputs
PHONES:
accepts headphones of
8 ohms or more
Disc player section
System
Compact disc and digital
audio system
Laser
Semiconductor laser
(λ=770 – 810 nm)
Emission duration:
continuous
Laser Output
Max. 44.6 µW*
* This output is the value measured
at a distance of 200 mm from the
objective lens surface on the Optical
Pick-up Block with 7 mm aperture.
– Continued on next page –
9-887-753-01
2007F04-1
© 2007. 06
Sony Corporation
Personal Audio Division
Published by Sony Techno Create Corporation
CD DECK RECEIVER
1

1 Page





HCD-GTX88 pdf, ピン配列
HCD-GTX88
Notes on Chip Component Replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of soldering iron around 270°C during
repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 °C higher than
ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to about
350 °C.
Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscou-s (sticky, less prone to flow) than
ordinary solder so use caution not to let solder bridges occur such
as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may also
be added to ordinary solder.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
Laser component in this product is capable
of emitting radiation exceeding the limit for
Class 1.
This appliance is
claassified as a CLASS 1
LASER product. This
label is located on the
rear exterior.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous
radiation exposure.
NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK
OR BASE UNIT
The laser diode in the optical pick-up block may suffer electrostatic
breakdown because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
3


3Pages


HCD-GTX88 電子部品, 半導体
HCD-GTX88
SECTION 1
GENERAL
This section is extracted
from instruction manual.
Guide to parts and controls
This manual mainly explains operations using the buttons on the unit, but the same
operations can also be performed using the buttons on the remote having the same or
similar names.
Unit
– Front view
123 4
wf
5
wd 6
ws
wa
7
w;
8
ql 9
qk q;
qj qa
qs
– Top view
qh qg qf qd
wkwj wh wg
6GB
6

6 Page



ページ 合計 : 30 ページ
 
PDF
ダウンロード
[ HCD-GTX88 データシート.PDF ]


データシートを活用すると、その部品の主な機能と仕様を詳しく理解できます。 ピン構成、電気的特性、動作パラメータ、性能を確認してください。


共有リンク

Link :


部品番号部品説明メーカ
HCD-GTX88

CD DECK RECEIVER SERVICE MANUAL

Sony
Sony


www.DataSheet.jp    |   2020   |  メール    |   最新    |   Sitemap