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DAP018AのメーカーはON Semiconductorです、この部品の機能は「PWM Current-Mode Controller」です。 |
部品番号 | DAP018A |
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部品説明 | PWM Current-Mode Controller | ||
メーカ | ON Semiconductor | ||
ロゴ | |||
このページの下部にプレビューとDAP018Aダウンロード(pdfファイル)リンクがあります。 Total 28 pages
Customer Specific Device from ON Semiconductor
DAP018A/B/C/D/F
PWM Current-Mode
Controller for High-Power
Universal Off-Line Supplies
Housed in a SO−14 package, the DAP018X represents an
enhanced version of the currently available Speedking
controller, the DAP011.
With an internal structure operating at a fixed 65 kHz or
100 kHz frequency, the controller directly connects to the
high−voltage rail for a lossless and clean startup sequence.
Current−mode control also provides an excellent input
audio−susceptibility and inherent pulse−by−pulse control.
Internal ramp compensation easily prevents sub−harmonic
oscillations from taking place in continuous conduction
mode designs. On top of these features, the device takes
advantage of the auxiliary winding negative swing to let the
user adjust the maximum power the converter can deliver in
high line conditions (OPP).
When the current setpoint falls below a given value, e.g.
the output power demand diminishes, the IC automatically
freezes the peak current and reduces its switching frequency
down to 25 kHz. At this point, if further output power
reduction occurs, the controller enters skip−cycle.
The DAP018X features an efficient protective circuitry
which, in presence of an overcurrent condition, disables the
output pulses while the device enters a safe burst mode,
trying to re−start. Once the fault has gone, the device
auto−recovers. By implementing a timer to acknowledge a
fault condition, independently from the auxiliary supply, the
designer’s task is eased when stringent fault mode
conditions need to be met.
A dedicated input helps triggering a latch−off circuitry
which permanently disables output pulses, for instance to
implement an over voltage protection (OVP). A separate
input accepts a direct NTC connection to ground for a simple
and efficient over temperature protection (OTP).
Features
• Fixed−frequency 65 kHz (A and B versions) or 100 kHz
(C and D versions) Current−mode Control Operation
• Internal and Adjustable Over Power Protection (OPP)
Circuit
• Frequency Foldback down to 25 kHz and Skip−cycle in
Light Load Conditions
• Reduced Internal Bias Currents for Improved Standby
Performance
• Adjustable Brown−out Protection (B and D versions)
• Internal Ramp Compensation
• Internal Fixed 5 ms Soft−Start
• Adjustable Frequency Jittering for Better EMI Signature
• Auto−recovery internal output short−circuit protection
for A, B, C and D versions. F is latched
• Adjustable Timer for Improved Short−circuit Protection
• OTP and OVP Inputs for Improved Robustness
• +500 mA / −800 mA Peak Current Capability
• Up to 28 V VCC Operation
• Improved Creepage Distance between High−voltage
and Adjacent Pin
• Extremely Low No−load Standby Power
• This is a Pb−Free Device
• This Device uses Halogen−Free Molding Compound
Typical Applications
• High Power ac−dc Converters for TVs, Set−top Boxes etc.
• Offline Adapters for Notebooks
14
1
SOIC−14
D SUFFIX
CASE 751A
x = Device Version
A = Assembly Location
WL = Wafer Lot
Y = Year
WW = Work Week
G = Pb−Free Package
MARKING
DIAGRAM
14
DAP018x
AWLYWWG
1
PIN CONNECTIONS
OPP
OVP
CTimer
Jittering
Fold
FB
CS
1
2
3
4
5
6
7
14 HV
13 NC
12 OTP
11 BO(B&D)
10
9
VCC
DRV
8 GND
(Top View)
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 3 of this data sheet.
†For information on tape and reel specifications, including part
orientation and tape sizes, please refer to our Tape and Reel
Packaging Specifications Brochure, BRD8011/D.
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
© Semiconductor Components Industries, LLC, 2009
July, 2009 − Rev. 0
1
Publication Order Number:
DAP018/D
1 Page DAP018A/B/C/D/F
ORDERING INFORMATION
Delta Device
ON Semiconductor Device Frequency
Brown−
Out
Short−
Circuit
Package
Shipping†
DAP018ADR2G
SCY99079ADR2G
65 kHz
No
Auto−
SOIC−14
2500 / Tape & Reel
Recovery
(Pb−Free)
DAP018BDR2G
SCY99079BDR2G
65 kHz
Yes
Auto−
SOIC−14
2500 / Tape & Reel
Recovery
(Pb−Free)
DAP018CDR2G
SCY99079CDR2G
100 kHz
No
Auto−
SOIC−14
2500 / Tape & Reel
Recovery
(Pb−Free)
DAP018DDR2G
SCY99079DDR2G
100 kHz
Yes
Auto−
SOIC−14
2500 / Tape & Reel
Recovery
(Pb−Free)
DAP018FDR2G
SCY99079FDR2G
65 kHz
Yes
Latched
SOIC−14
2500 / Tape & Reel
(Pb−Free)
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
http://onsemi.com
3
3Pages DAP018A/B/C/D/F
ELECTRICAL CHARACTERISTICS
(For typical values TJ = 25°C, for min/max values TJ = −25°C to +125°C, Max TJ = 150°C, VCC = 12 V unless otherwise noted)
DRIVE OUTPUT
Symbol
Rating
Pin Min Typ Max Unit
Tf Output voltage fall−time @ CL = 1 nF, 10−90% of a 12 V output signal
Isource Source current capability at VDRV = 10.5 V
Isink
Sink current capability at VDRV = 0 V
VDRVlow DRV pin level at VCC close to VCC(min) with a 33 kW resistor to GND
VDRVhigh DRV pin level at VCC = 28 V
CURRENT COMPARATOR
9 − 25 − ns
9 − 500 − mA
9 − 800 − mA
9 7.6
−
−V
9 10 15 17 V
Symbol
Rating
Pin Min Typ Max Unit
IIB
VLimit
TDEL
TLEB
TSS
Input Bias Current @ 0.8 V input level on pin 7
Maximum internal current setpoint – pin1 grounded
Propagation delay from current detection to gate off−state
Leading Edge Blanking Duration
Internal soft−start duration activated upon startup, auto−recovery and BO
release for versions B & D, pin 1 grounded.
7 0.02 mA
7 0.76 0.8 0.84 V
7 100 150 ns
7 140 ns
− 5 ms
IOPPo Setpoint decrease for pin 1 biased to –300 mV (Note 1)
1 37.5 %
IOOPv Voltage setpoint for pin 1 biased to −300 mV (Note 1)
1 0.46 0.5 0.54 V
IOPPs Setpoint decrease for pin 1grounded
1 0%
INTERNAL OSCILLATOR
Symbol
Rating
Pin Min Typ Max Unit
fOSC
fOSC
Dmax
fjitter
fswing
ICjit
VCjitP
Oscillation frequency (65 kHz version, A & B)
Oscillation frequency (100 kHz version, C & D)
Maximum duty−cycle
Frequency jittering in percentage of fOSC
Swing frequency with a 22 nF capacitor to pin 4
Jittering modulator charging current
Jittering capacitor peak voltage
− 60 65 70 kHz
− 92 100 108 kHz
− 76 80 84 %
− ±5 %
4 300 Hz
4 18 mA
4 2.2 V
VCjitV Jittering capacitor valley voltage
4 0.8 V
FEEDBACK SECTION
Symbol
Rating
Pin Min Typ Max Unit
Rup Internal pull−up resistor
RFB Equivalent resistor on FB pin
Iratio Pin 6 to current setpoint division ratio
FREQUENCY FOLDBACK
6 20 kW
16 kW
− 4.2 kW
Symbol
Rating
Pin Min Typ Max Unit
Ifold Internal foldback reference current
5 8.5 10 11.5 mA
Vfold
Frequency folback level with a 100 kW resistor to ground
51V
Iskip Skip current in percentage of the maximum excursion, for Vfold = 1 V
30 %
Ftrans Transition frequency below which skip−cycle occurs for TJ = 25°C
– 21 25 29 kHz
Vskip Skip−cycle level voltage on the feedback pin
6 320 mV
1. See characterization table for linearity over negative bias voltage.
2. Guaranteed by design.
3. The OTP parameters are selected to cope with a TTC03−474 which offers a resistance of 8.8 kW when heated to a temperature of 110°C.
4. The brown−out circuitry is disabled on versions A & C and operates on versions B & D.
http://onsemi.com
6
6 Page | |||
ページ | 合計 : 28 ページ | ||
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部品番号 | 部品説明 | メーカ |
DAP018A | PWM Current-Mode Controller | ON Semiconductor |
DAP018B | PWM Current-Mode Controller | ON Semiconductor |
DAP018C | PWM Current-Mode Controller | ON Semiconductor |
DAP018D | PWM Current-Mode Controller | ON Semiconductor |