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SiI9136 の電気的特性と機能

SiI9136のメーカーはSilicon imageです、この部品の機能は「HDMI Deep Color Transmitter」です。


製品の詳細 ( Datasheet PDF )

部品番号 SiI9136
部品説明 HDMI Deep Color Transmitter
メーカ Silicon image
ロゴ Silicon image ロゴ 




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SiI9136 Datasheet, SiI9136 PDF,ピン配置, 機能
Data Brief
SiI9136 HDMI Deep Color Transmitter
Data Brief
Document # SiI-DB-1075-A02
http://www.Datasheet4U.com

1 Page





SiI9136 pdf, ピン配列
.
Introduction
The SiI9136 transmitter is an HDMI® Deep Color
transmitter for consumer electronics products such as
set-top boxes, Blu-ray players and recorders, A/V
Receivers, DVD players and recorders, personal video
recorders, home theater-in-a-box systems, and home
theater PCs.
The SiI9136 transmitter, with the latest generation
225 MHz TMDS core, enables home theater devices to
deliver up to 16-bit Deep Color at 1080p/30 resolutions
and up to 12-bit Deep Color at 1080p/60 resolutions.
On the audio side, High-Bit-Rate (HBR) audio formats
(such as Dolby® TrueHD and DTS-HD) are supported
for an enhanced digital audio experience.
Video Input
Support of most common standard and non-
standard video input formats
Support of most common 3D formats
Supports video resolutions up to 12-bit 1080p
(60 Hz), 12-bit 720p/1080i (120 Hz), and 16-bit
1080p (30 Hz)
Audio Input
S/PDIF input supports PCM and compressed audio
formats (Dolby Digital, DTS, AC-3)
DSD input supports Super Audio CD applications
I²S input supports PCM, DVD-Audio input (up to
8-channel 192 kHz)
High Bit Rate audio support (for example, DTS
HD and Dolby True HD)
SiI9136 HDMI Deep Color Transmitter
Data Brief
HDMI Output
DVI 1.0, HDCP 1.4, and HDMI transmitter with
xvYCC extended color gamut, Deep Color up to
16-bit color, and HBR audio support
225 MHz HDMI Transmitter
Supports all mandatory and some optional 3D
modes
Pre-programmed HDCP key set simplifies the
manufacturing process, lowers cost, and provides
the highest level of HDCP key security.
Dynamic cable equalization automatically
equalizes the TMDS™ output signal
Control Capability
Consumer Electronics Control (CEC) interface that
incorporates an HDMI-compliant CEC I/O and the
Silicon Image CEC Programming Interface (CPI)
reduces the need for system-level control by the
system microcontroller and simplifies firmware
overhead
Four General Purpose I/O (GPIO) pins
Three power modes defined by the Advanced
Configuration and Power Interface specification
allows the power consumption of the device with
respect to system needs to be dynamically adjusted
Packaging
100-pin, 14 mm x 14 mm, 0.5 mm pitch TQFP
package with enhanced ePad™
SiI-DB-1075-A02
Figure 1. Example of System Architecture
© 2009-2010 Silicon Image, Inc. All rights reserved. 1


3Pages


SiI9136 電子部品, 半導体
SiI9136 HDMI Deep Color Transmitter
Data Brief
Package Information
Silicon Image, Inc.
ePad Requirements
The SiI9136 HDMI Deep Color Transmitter chip is packaged in a 100-pin, 14 mm x 14mm TQFP package with an
ExposedPad™ (ePad™) that is used for the electrical ground of the device and for improved thermal transfer
characteristics. The ePad dimensions are 5 mm x 5 mm ±0.20 mm. Soldering the ePad to the ground plane of the PCB is
required to meet package power dissipation requirements at full speed operation, and to correctly connect the chip
circuitry to electrical ground. A clearance of at least 0.25 mm should be designed on the PCB between the edge of the
ePad and the inner edges of the lead pads to avoid the possibility of electrical shorts.
The thermal land area on the PCB may use thermal vias to improve heat removal from the package. These thermal vias
also double as the ground connections of the chip and must attach internally in the PCB to the ground plane. An array of
vias should be designed into the PCB beneath the package. For optimum thermal performance, the via diameter should
be 12 mils to 13 mils (0.30 mm to 0.33 mm) and the via barrel should be plated with 1-ounce copper to plug the via. This
design helps to avoid any solder wicking inside the via during the soldering process, which may result in voids in solder
between the pad and the thermal land. If the copper plating does not plug the vias, the thermal vias can be tented with
solder mask on the top surface of the PCB to avoid solder wicking inside the via during assembly. The solder mask
diameter should be at least 4 mils (0.1 mm) larger than the via diameter.
Package stand-off when mounting the device also needs to be considered. For a nominal stand-off of approximately 0.1
mm the stencil thickness of 5 mils to 8 mils should provide a good solder joint between the ePad and the thermal land.
PCB Layout Guidelines
PCB layout designers should refer to Silicon Image application note PCB Layout Guidelines: Designing with Exposed
Pads (SiI-AN-0129) for basic design guidelines when designing with thermally enhanced packages using an Exposed Pad.
4
© 2009-2010 Silicon Image, Inc. All rights reserved. SiI-DB-1075-A0
2

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