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BLU11 の電気的特性と機能

BLU11のメーカーはPhilipsです、この部品の機能は「UHF power transistor」です。


製品の詳細 ( Datasheet PDF )

部品番号 BLU11
部品説明 UHF power transistor
メーカ Philips
ロゴ Philips ロゴ 




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BLU11 Datasheet, BLU11 PDF,ピン配置, 機能
DISCRETE SEMICONDUCTORS
DATA SHEET
BLU11/SL
UHF power transistor
Product specification
July 1986
http://www.Datasheet4U.com

1 Page





BLU11 pdf, ピン配列
Philips Semiconductors
UHF power transistor
Product specification
BLU11/SL
RATINGS
Limiting values in accordance with the Absolute Maximum System (IEC 134)
Collector-base voltage (open emitter)
Collector-emitter voltage (open base)
Emitter-base voltage (open collector)
Collector current
VCBO
VCEO
VEBO
d.c. or average
(peak value), f > 1 MHz
Total power dissipation
IC; IC(AV)
ICM
at Tmb 90 °C; f > 1 MHz
Storage temperature
Operating junction temperature
Ptot(rf)
Tstg
Tj
10
handbook, halfpage
Ptot(rf)
(W)
8
6
4
II
I
MDA306
2
0
0
I Continuous r.f. operation (f > 1 MHz)
II Short-time r.f. operation during mismatch (f > 1 MHz)
40
80 120 160
Tmb (°C)
Fig.2 Power/temperature derating curves.
max.
max.
max.
36 V
16 V
3V
max.
max.
0,4 A
1,2 A
max.
6W
65 to +150 °C
max. 200 °C
THERMAL RESISTANCE
Dissipation = 4,5 W
From junction to ambient(1)
at Ta = 25 °C; f > 1 MHz (r.f. operation)
From junction to mounting base
at Tmb = 25 °C; f > 1 MHz (r.f. operation)
Note
1. Device mounted on a printed wiring board (see Fig.6).
Rth j-a (rf)
Rth j-mb (rf)
max.
max.
50 K/W
15 K/W
July 1986
3
http://www.Datasheet4U.com


3Pages


BLU11 電子部品, 半導体
Philips Semiconductors
UHF power transistor
Product specification
BLU11/SL
handbook, full pagewidth
108
copper straps
M2
rivets
70
M3
+VCC
C3
C1
C2
R1
L1 L2
C4
L5
R2
C5
C6
L4
L6
L3
C7
C9
C8
MDA310
The circuit and the components are situated on one side of the P.T.F.E. fibre-glass board; the other side
is unetched copper serving as a groundplane. Earth connections are made by using hollow rivets,
fixing-screws and copper straps at the input and output and under the two emitters to provide a direct
contact between the copper on the component side and the groundplane.
Dimensions in mm.
Fig.6 Printed wiring board and component lay-out for 470 MHz class-B test circuit.
July 1986
6
http://www.Datasheet4U.com

6 Page



ページ 合計 : 9 ページ
 
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共有リンク

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