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MX25V1006E の電気的特性と機能

MX25V1006EのメーカーはMACRONIXです、この部品の機能は「1M-BIT [x 1/x 2] CMOS SERIAL FLASH」です。


製品の詳細 ( Datasheet PDF )

部品番号 MX25V1006E
部品説明 1M-BIT [x 1/x 2] CMOS SERIAL FLASH
メーカ MACRONIX
ロゴ MACRONIX ロゴ 




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MX25V1006E Datasheet, MX25V1006E PDF,ピン配置, 機能
MX25V1006E
MX25V1006E
DATASHEET
P/N: PM1752
REV. 1.3, NOV. 12, 2013
1
http://www.Datasheet4U.com

1 Page





MX25V1006E pdf, ピン配列
MX25V1006E
POWER-ON STATE.................................................................................................................................................... 20
ELECTRICAL SPECIFICATIONS............................................................................................................................... 21
ABSOLUTE MAXIMUM RATINGS.................................................................................................................... 21
CAPACITANCE TA = 25°C, f = 1.0 MHz............................................................................................................ 21
Figure 5. INPUT TEST WAVEFORMS AND MEASUREMENT LEVEL............................................................. 22
Figure 6. OUTPUT LOADING.......................................................................................................................... 22
Table 5. DC CHARACTERISTICS ................................................................................................................... 23
Table 6. AC CHARACTERISTICS ................................................................................................................... 24
Table 7. Power-Up Timing................................................................................................................................. 25
INITIAL DELIVERY STATE............................................................................................................................... 25
Timing Analysis......................................................................................................................................................... 26
Figure 7. Serial Input Timing............................................................................................................................. 26
Figure 8. Output Timing..................................................................................................................................... 26
Figure 9. Hold Timing........................................................................................................................................ 27
Figure 10. WP# Disable Setup and Hold Timing during WRSR when SRWD=1.............................................. 27
Figure 11. Write Enable (WREN) Sequence (Command 06)............................................................................ 28
Figure 12. Write Disable (WRDI) Sequence (Command 04)............................................................................. 28
Figure 13. Read Identification (RDID) Sequence (Command 9F)..................................................................... 28
Figure 14. Read Status Register (RDSR) Sequence (Command 05)............................................................... 29
Figure 15. Write Status Register (WRSR) Sequence (Command 01).............................................................. 29
Figure 16. Read Data Bytes (READ) Sequence (Command 03)..................................................................... 29
Figure 17. Read at Higher Speed (FAST_READ) Sequence (Command 0B)................................................. 30
Figure 18. Dual Output Read Mode Sequence (Command 3B)........................................................................ 30
Figure 19. Page Program (PP) Sequence (Command 02).............................................................................. 31
Figure 20. Sector Erase (SE) Sequence (Command 20)................................................................................. 32
Figure 21. Block Erase (BE) Sequence (Command 52 or D8)......................................................................... 32
Figure 22. Chip Erase (CE) Sequence (Command 60 or C7).......................................................................... 33
Figure 23. Deep Power-down (DP) Sequence (Command B9)....................................................................... 33
Figure 24. Read Electronic Signature (RES) Sequence (Command AB)......................................................... 33
Figure 25. Release from Deep Power-down (RDP) Sequence (Command AB).............................................. 34
Figure 26. Read Electronic Manufacturer & Device ID (REMS) Sequence (Command 90)............................ 34
Figure 27. Power-up Timing.............................................................................................................................. 35
RECOMMENDED OPERATING CONDITIONS.......................................................................................................... 36
Figure 28. AC Timing at Device Power-Up........................................................................................................ 36
Figure 29. Power-Down Sequence................................................................................................................... 37
ERASE AND PROGRAMMING PERFORMANCE..................................................................................................... 38
DATA RETENTION..................................................................................................................................................... 38
LATCH-UP CHARACTERISTICS............................................................................................................................... 38
ORDERING INFORMATION....................................................................................................................................... 39
PART NAME DESCRIPTION...................................................................................................................................... 40
PACKAGE INFORMATION......................................................................................................................................... 41
REVISION HISTORY .................................................................................................................................................. 44
P/N: PM1752
REV. 1.3, NOV. 12, 2013
3
http://www.Datasheet4U.com


3Pages


MX25V1006E 電子部品, 半導体
PIN CONFIGURATIONS
8-LAND USON (2x3mm)
CS#
SO/SIO1
WP#
GND
1
2
3
4
8 VCC
7 HOLD#
6 SCLK
5 SI/SIO0
8-PIN TSSOP (173mil)
CS#
SO/SIO1
WP#
GND
1
2
3
4
8 VCC
7 HOLD#
6 SCLK
5 SI/SIO0
8-PIN SOP (150mil)
CS#
SO/SIO1
WP#
GND
1
2
3
4
8 VCC
7 HOLD#
6 SCLK
5 SI/SIO0
MX25V1006E
PIN DESCRIPTION
SYMBOL DESCRIPTION
CS# Chip Select
SI/SIO0
Serial Data Input (for 1 x I/O)/ Serial Data
Input & Output (for Dual output mode)
SO/SIO1
Serial Data Output (for 1 x I/O)/ Serial Data
Input & Output (for Dual output mode)
SCLK Clock Input
HOLD#
Hold, to pause the device without
deselecting the device
WP# Write Protection
VCC + 3.3V Power Supply
GND Ground
P/N: PM1752
REV. 1.3, NOV. 12, 2013
6
http://www.Datasheet4U.com

6 Page



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部品番号部品説明メーカ
MX25V1006E

1M-BIT [x 1/x 2] CMOS SERIAL FLASH

MACRONIX
MACRONIX


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