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PDF PR3BMF51YSKF Data sheet ( Hoja de datos )

Número de pieza PR3BMF51YSKF
Descripción Non-Zero Cross type DIP 8pin Triac output SSR
Fabricantes Sharp 
Logotipo Sharp Logotipo



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PR3BMF51NSKF Series
PR3BMF51NSKF
Series
*Zero cross type is also available. (PR3BMF21NSZF Series)
IT(rms)1.2A, Non-Zero Cross type
DIP 8pin
Triac output SSR
Description
PR3BMF51NSKF Series Solid State Relays (SSR)
are an integration of an infrared emitting diode (IRED),
a Phototriac Detector and a main output Triac. These
devices are ideally suited for controlling high voltage AC
loads with solid state reliability while providing 4kV isola-
tion (Viso(rms)) from input to output.
Features
1. Output current, IT(rms)1.2A
2. Non-zero crossing functionary
3. 8 pin DIP package (SMT gullwing also available)
4. High repetitive peak off-state voltage (VDRM : 600V)
5. Superior noise immunity (dV/dt : MIN. 100V/μs)
6. Response time, ton : MAX. 100μs
7. High isolation voltage between input and output
(Viso(rms) : 4kV)
8. Lead free and RoHS directive compliant
Agency approvals/Compliance
1. Recognized by UL508 le No. E94758 (as model No.
R3BMF5)
2. Approved by CSA 22.2 No.14, le No. LR63705 (as
model No. R3BMF5)
3. Optionary available VDE approved (DIN EN 60747-5-
2)(), le No. 40008898 (as model No. R3BMF5)
4. Package resin : UL ammability grade (94V-0)
() DIN EN60747-5-2 : successor standard of DIN VDE0884.
Applications
1. Isolated interface between high voltage AC devices
and lower voltage DC control circuitry.
2. Switching motors, fans, heaters, solenoids, and
valves.
3. Phase or power control in applications such as light-
ing and temperature control equipment.
Notice The content of data sheet is subject to change without prior notice.
In the absence of conrmation by device specication sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP
devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specication sheets before using any SHARP device.
Sheet No.: D4-A03801EN
1 Date Sep. 1. 2006
© SHARP Corporation
Free Datasheet http://www.Datasheet4U.com

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PR3BMF51YSKF pdf
PR3BMF51NSKF Series
Model Line-up
Lead Form
Through-Hole
SMT Gullwing
Shipping
Sleeve
Taping
Package
50 pcs/sleeve
1 000 pcs/reel
DIN
EN60747-5-2
Approved
Approved
Model No. PR3BMF51NSKF PR3BMF51YSKF PR3BMF51NIPF PR3BMF51YIPF
VDRM
[V]
600
Please contact a local SHARP sales representative to inquire about production status.
Rank
mark
1
IFT[mA]
(VD=6V,
RL=100Ω)
MAX.10
Sheet No.: D4-A03801EN
5
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PR3BMF51YSKF arduino
PR3BMF51NSKF Series
Cleaning instructions
Solvent cleaning :
Solvent temperature should be 45˚C or below. Immersion time should be 3minutes or less.
Ultrasonic cleaning :
The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time,
size of PCB and mounting method of the device.
Therefore, please make sure the device withstands the ultrasonic cleaning in actual conditions in advance of
mass production.
Recommended solvent materials :
Ethyl alcohol, Methyl alcohol and Isopropyl alcohol
In case the other type of solvent materials are intended to be used, please make sure they work ne in ac-
tual using conditions since some materials may erode the packaging resin.
Presence of ODC
This product shall not contain the following materials.
And they are not used in the production process for this device.
Regulation substances : CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform)
Specic brominated ame retardants such as the PBB and PBDE are not used in this product at all.
This product shall not contain the following materials banned in the RoHS Directive (2002/95/EC).
•Lead(*), Mercury, Cadmium, Hexavalent chromium, Polybrominated biphenyls (PBB), Polybrominated
diphenyl ethers (PBDE).
(*) High melting temperature type solders (i.e. tin-lead solder alloys containing more than 85% lead)
is exempted from the requirements.
11
Sheet No.: D4-A03801EN
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