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25Q32BV の電気的特性と機能

25Q32BVのメーカーはWinbondです、この部品の機能は「3v 32M-Bit Serial Flash Memory」です。


製品の詳細 ( Datasheet PDF )

部品番号 25Q32BV
部品説明 3v 32M-Bit Serial Flash Memory
メーカ Winbond
ロゴ Winbond ロゴ 




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25Q32BV Datasheet, 25Q32BV PDF,ピン配置, 機能
W25Q32BV
3V 32M-BIT
SERIAL FLASH MEMORY WITH
DUAL AND QUAD SPI
Publication Release Date: October 04,2013
- 1 - Revision I

1 Page





25Q32BV pdf, ピン配列
W25Q32BV
7.1.9 Security Register Lock Bits (LB3, LB2, LB1) ........................................................................15
7.1.10 Quad Enable Bit (QE).........................................................................................................16
7.1.11 Status Register Memory Protection (CMP = 0)...................................................................17
7.1.12 Status Register Memory Protection (CMP = 1)...................................................................18
7.2 INSTRUCTIONS................................................................................................................. 19
7.2.1 Manufacturer and Device Identification ................................................................................19
7.2.2 Instruction Set Table 1 (Erase, Program Instructions)(1) .......................................................20
7.2.3 Instruction Set Table 2 (Read Instructions) ..........................................................................21
7.2.4 Instruction Set Table 3 (ID, Security Instructions) ................................................................22
7.2.5 Write Enable (06h) ...............................................................................................................23
7.2.6 Write Enable for Volatile Status Register (50h) ....................................................................23
7.2.7 Write Disable (04h)...............................................................................................................24
7.2.8 Read Status Register-1 (05h) and Read Status Register-2 (35h).........................................25
7.2.9 Write Status Register (01h) ..................................................................................................25
7.2.10 Read Data (03h).................................................................................................................27
7.2.11 Fast Read (0Bh) .................................................................................................................28
7.2.12 Fast Read Dual Output (3Bh) .............................................................................................29
7.2.13 Fast Read Quad Output (6Bh)............................................................................................30
7.2.14 Fast Read Dual I/O (BBh)...................................................................................................31
7.2.15 Fast Read Quad I/O (EBh) .................................................................................................33
7.2.16 Word Read Quad I/O (E7h) ................................................................................................35
7.2.17 Octal Word Read Quad I/O (E3h).......................................................................................37
7.2.18 Set Burst with Wrap (77h) ..................................................................................................39
7.2.19 Continuous Read Mode Bits (M7-0) ...................................................................................40
7.2.20 Continuous Read Mode Reset (FFh or FFFFh)..................................................................40
7.2.21 Page Program (02h) ...........................................................................................................41
7.2.22 Quad Input Page Program (32h) ........................................................................................42
7.2.23 Sector Erase (20h) .............................................................................................................43
7.2.24 32KB Block Erase (52h) .....................................................................................................44
7.2.25 64KB Block Erase (D8h).....................................................................................................45
7.2.26 Chip Erase (C7h / 60h).......................................................................................................46
7.2.27 Erase / Program Suspend (75h).........................................................................................47
7.2.28 Erase / Program Resume (7Ah) .........................................................................................48
7.2.29 Power-down (B9h)..............................................................................................................49
7.2.30 Release Power-down / Device ID (ABh) .............................................................................50
7.2.31 Read Manufacturer / Device ID (90h) .................................................................................52
7.2.32 Read Manufacturer / Device ID Dual I/O (92h)...................................................................53
7.2.33 Read Manufacturer / Device ID Quad I/O (94h) .................................................................54
7.2.34 Read Unique ID Number (4Bh) ..........................................................................................55
7.2.35 Read JEDEC ID (9Fh) ........................................................................................................56
7.2.36 Read SFDP Register (5Ah) ................................................................................................57
Publication Release Date: October 04,2013
- 3 - Revision I


3Pages


25Q32BV 電子部品, 半導体
W25Q32BV
3. PACKAGE TYPES AND PIN CONFIGURATIONS
W25Q32BV is offered in an 8-pin SOIC 208-mil (package code SS), an 8-pin VSOP 208-mil (package
code ST), an 8-pad WSON 6x5-mm or 8x6-mm (package code ZP & ZE), an 8-pin PDIP 300-mil
(package code DA), a 16-pin SOIC 300-mil (package code SF) and 24-ball 8x6-mm TFBGAs (5x5 ball
array - package code TB, 6x4 ball array package code TC) as shown in Figure 1a-e respectively.
Package diagrams and dimensions are illustrated at the end of this datasheet.
3.1 Pin Configuration SOIC / VSOP 208-mil
Top View
/CS 1 8
DO (IO1)
/WP (IO2)
GND
27
36
45
VCC
/HOLD (IO3)
CLK
DI (IO0)
Figure 1a. W25Q32BV Pin Assignments, 8-pin SOIC / VSOP 208-mil (Package Code SS, ST)
3.2 Pad Configuration WSON 6x5-mm / 8X6-mm
Top View
/CS 1 8
VCC
DO (IO1)
/WP (IO2)
GND
27
36
45
/HOLD (IO3)
CLK
DI (IO0)
Figure 1b. W25Q32BV Pad Assignments, 8-pad WSON 6x5-mm / 8x6-mm (Package Code ZP, ZE)
-6-

6 Page



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部品番号部品説明メーカ
25Q32BV

3v 32M-Bit Serial Flash Memory

Winbond
Winbond


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