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PDF IS65WV102416BLL Data sheet ( Hoja de datos )

Número de pieza IS65WV102416BLL
Descripción 1M x 16 HIGH-SPEED LOW POWER ASYNCHRONOUS CMOS STATIC RAM
Fabricantes Integrated Silicon Solution 
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IS62WV102416ALL
IS62WV102416BLL
IS65WV102416BLL
1M x 16 HIGH-SPEED LOW POWER
ASYNCHRONOUS CMOS STATIC RAM
JANUARY 2008
FEATURES
• High-speed access times:
25, 35 ns
• High-performance, low-power CMOS process
• Multiple center power and ground pins for greater
noise immunity
• Easy memory expansion with CS1 and OE
options
CS1 power-down
• Fully static operation: no clock or refresh
required
• TTL compatible inputs and outputs
• Single power supply
VDD 1.65V to 2.2V (IS62WV102416ALL)
speed = 35ns for VDD 1.65V to 2.2V
VDD 2.4V to 3.6V (IS62/65WV102416BLL)
speed = 25ns for VDD 2.4V to 3.6V
• Packages available:
– 48-ball miniBGA (9mm x 11mm)
– 48-pin TSOP (Type I)
• Industrial and Automotive Temperature Support
• Lead-free available
• Data control for upper and lower bytes
DESCRIPTION
The ISSIIS62WV102416ALL/BLL and IS65WV102416BLL
are high-speed, 16M-bit static RAMs organized as 1024K
words by 16 bits. It is fabricated using ISSI's high-perform-
ance CMOS technology. This highly reliable process coupled
with innovative circuit design techniques, yields high-
performance and low power consumption devices.
When CS1 is HIGH (deselected) or when CS2 is LOW
(deselected) or when CS1 is LOW, CS2 is HIGH and both
LB and UB are HIGH, the device assumes a standby mode
at which the power dissipation can be reduced down with
CMOS input levels.
Easy memory expansion is provided by using Chip Enable
and Output Enable inputs. The active LOW Write Enable
(WE) controls both writing and reading of the memory. A
data byte allows Upper Byte (UB) and Lower Byte (LB)
access.
The device is packaged in the JEDEC standard 48-pin
TSOP Type I and 48-pin Mini BGA (9mm x 11mm).
FUNCTIONAL BLOCK DIAGRAM
A0-A19
DECODER
1024K x 16
MEMORY ARRAY
VDD
GND
I/O0-I/O7
Lower Byte
I/O8-I/O15
Upper Byte
I/O
DATA
CIRCUIT
COLUMN I/O
CS1
OE
WE
UB
LB
CONTROL
CIRCUIT
Copyright © 2006 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time
without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to
obtain the latest version of this device specification before relying on any published information and before placing orders for products.
Integrated Silicon Solution, Inc. — www.issi.com
Rev. A
01/18/08
1
Free Datasheet http://www.datasheetlist.com/

1 page




IS65WV102416BLL pdf
IS62WV102416ALL
IS62WV102416BLL
IS65WV102416BLL
OPERATING RANGE (VDD) (IS62WV102416ALL)
Range
Commercial
Industrial
Automotive
Ambient Temperature
0°C to +70°C
–40°C to +85°C
–40°C to +125°C
VDD (35 nS)
1.65V-2.2V
1.65V-2.2V
1.65V-2.2V
OPERATING RANGE (VDD) (IS62WV102416BLL)(1)
Range
Ambient Temperature
VDD (25 nS)
Commercial
0°C to +70°C
2.4V-3.6V
Industrial
–40°C to +85°C
2.4V-3.6V
Note:
1. When operated in the range of 2.4V-3.6V, the device meets 10ns.
OPERATING RANGE (VDD) (IS65WV102416BLL)
Range
Ambient Temperature
Automotive
–40°C to +125°C
VDD (25 nS)
2.4V-3.6V
Integrated Silicon Solution, Inc. — www.issi.com
Rev. A
01/18/08
5
Free Datasheet http://www.datasheetlist.com/

5 Page





IS65WV102416BLL arduino
IS62WV102416ALL
IS62WV102416BLL
IS65WV102416BLL
WRITE CYCLE SWITCHING CHARACTERISTICS(1,2) (Over Operating Range)
Symbol Parameter
tWC Write Cycle Time
tSCS1/tSCS2 CS1/CS2 to Write End
tAW Address Setup Time to Write End
tHA Address Hold from Write End
tSA Address Setup Time
tPWB LB, UB Valid to End of Write
tPWE(4)
WE Pulse Width
tSD Data Setup to Write End
tHD Data Hold from Write End
tHZWE(3) WE LOW to High-Z Output
tLZWE(3) WE HIGH to Low-Z Output
25ns
Min. Max.
25 —
18 —
15 —
0—
0—
18 —
18 —
12 —
0—
— 12
5—
35 ns
Min. Max.
35 —
25 —
25 —
0—
0—
25 —
30 —
15 —
0—
— 20
5—
Unit
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
Notes:
1. Testconditionsassumesignaltransitiontimesof5nsorless,timingreferencelevelsof0.9V/1.5V,inputpulselevelsof 0.4toVDD-0.2V/0.4VtoVDD-0.3Vand
outputloadingspecifiedinFigure1.
2. The internal write time is defined by the overlap of CS1 LOW, CS2 HIGH and UB or LB, and WE LOW. All signals must be in valid states to initiate a Write, but
any one can go inactive to terminate the Write. The Data Input Setup and Hold timing are referenced to the rising or falling edge of the signal that terminates the
write.
3. TestedwiththeloadinFigure2.Transitionismeasured±500mVfromsteady-statevoltage.Not100%tested.
4. tPWE > tHZWE + tSD when OE is LOW.
AC WAVEFORMS
WRITE CYCLE NO. 1(1,2) (CS1 Controlled, OE = HIGH or LOW)
ADDRESS
CS1
CS2
WE
LB, UB
DOUT
DIN
tWC
tSCS1
tHA
tSCS2
tAW
tPWE
tPWB
tSA
tHZWE
DATA UNDEFINED
HIGH-Z
tLZWE
tSD
tHD
DATA-IN VALID
Notes:
1. WRITEisaninternallygeneratedsignalassertedduringanoverlapoftheLOWstatesontheCS1,CS2andWEinputsandatleastoneoftheLBandUBinputs
beingintheLOWstate.
2. WRITE = (CS1) [ (LB) = (UB) ] (WE).
Integrated Silicon Solution, Inc. — www.issi.com
Rev. A
01/18/08
11
Free Datasheet http://www.datasheetlist.com/

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