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S34ML04G1 の電気的特性と機能

S34ML04G1のメーカーはSpansionです、この部品の機能は「(S34ML01G1 - S34ML04G1) SLC NAND Flash Memory」です。


製品の詳細 ( Datasheet PDF )

部品番号 S34ML04G1
部品説明 (S34ML01G1 - S34ML04G1) SLC NAND Flash Memory
メーカ Spansion
ロゴ Spansion ロゴ 




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S34ML04G1 Datasheet, S34ML04G1 PDF,ピン配置, 機能
Spansion® SLC NAND Flash Memory for
Embedded
1 Gb, 2 Gb, 4 Gb Densities:
1-bit ECC, x8 and x16 I/O, 3V VCC
S34ML01G1, S34ML02G1, S34ML04G1
Data Sheet
Spansion® SLC NAND Flash Memory for Embedded Cover Sheet
Notice to Readers: This document states the current technical specifications regarding the Spansion
product(s) described herein. Each product described herein may be designated as Advance Information,
Preliminary, or Full Production. See Notice On Data Sheet Designations for definitions.
Publication Number S34ML01G1_04G1
Revision 17
Issue Date November 22, 2013
Free Datasheet http://www.datasheet-pdf.com/

1 Page





S34ML04G1 pdf, ピン配列
Spansion® SLC NAND Flash Memory for
Embedded
1 Gb, 2 Gb, 4 Gb Densities:
1-bit ECC, x8 and x16 I/O, 3V VCC
S34ML01G1, S34ML02G1, S34ML04G1
Data Sheet
Distinctive Characteristics
Density
– 1 Gbit / 2 Gbit / 4 Gbit
Architecture
– Input / Output Bus Width: 8-bits / 16-bits
– Page Size:
– x8 = 2112 (2048 + 64) bytes; 64 bytes is spare area
– x16 = 1056 (1024 + 32) words; 32 words is spare area
– Block Size: 64 Pages
– x8 = 128k + 4k bytes
– x16 = 64k + 2k words
– Plane Size:
– 1 Gbit / 2 Gbit: 1024 Blocks per Plane
x8 = 128M + 4M bytes
x16 = 64M + 2M words
– 4 Gbit: 2048 Blocks per Plane
x8 = 256M + 8M bytes
x16 = 128M + 4M words
– Device Size:
– 1 Gbit: 1 Plane per Device or 128 Mbyte
– 2 Gbit: 2 Planes per Device or 256 Mbyte
– 4 Gbit: 2 Planes per Device or 512 Mbyte
NAND Flash Interface
– Open NAND Flash Interface (ONFI) 1.0 compliant
– Address, Data and Commands multiplexed
Supply Voltage
– 3.3V device: Vcc = 2.7V ~ 3.6V
Security
– One Time Programmable (OTP) area
– Hardware program/erase disabled during power transition
Additional Features
– 2 Gb and 4 Gb parts support Multiplane Program and Erase
commands
– Supports Copy Back Program
– 2 Gb and 4 Gb parts support Multiplane Copy Back Program
– Supports Read Cache
Electronic Signature
– Manufacturer ID: 01h
Operating Temperature
– Industrial: -40°C to 85°C
– Automotive: -40°C to 105°C
Performance
Page Read / Program
– Random access: 25 µs (Max)
– Sequential access: 25 ns (Min)
– Program time / Multiplane Program time: 200 µs (Typ)
Block Erase (S34ML01G1)
– Block Erase time: 2.0 ms (Typ)
Block Erase / Multiplane Erase (S34ML02G1, S34ML04G1)
– Block Erase time: 3.5 ms (Typ)
Reliability
– 100,000 Program / Erase cycles (Typ)
(with 1 bit ECC per 528 bytes (x8) or 264 words (x16))
– 10 Year Data retention (Typ)
– Blocks zero and one are valid and will be valid for at least 1000
program-erase cycles with ECC
Package Options
– Lead Free and Low Halogen
– 48-Pin TSOP 12 x 20 x 1.2 mm
– 63-Ball BGA 9 x 11 x 1 mm
Publication Number S34ML01G1_04G1
Revision 17
Issue Date November 22, 2013
This document states the current technical specifications regarding the Spansion product(s) described herein. Spansion Inc. deems the products to have been in sufficient pro-
duction volume such that subsequent versions of this document are not expected to change. However, typographical or specification corrections, or modifications to the valid com-
binations offered may occur.
Free Datasheet http://www.datasheet-pdf.com/


3Pages


S34ML04G1 電子部品, 半導体
Data Sheet
Figures
Figure 1.1
Figure 1.2
Figure 1.3
Figure 1.4
Figure 1.5
Figure 1.6
Figure 1.7
Figure 3.1
Figure 3.2
Figure 4.1
Figure 4.2
Figure 6.1
Figure 6.2
Figure 6.3
Figure 6.4
Figure 6.5
Figure 6.6
Figure 6.7
Figure 6.8
Figure 6.9
Figure 6.10
Figure 6.11
Figure 6.12
Figure 6.13
Figure 6.14
Figure 6.15
Figure 6.16
Figure 6.17
Figure 6.18
Figure 6.19
Figure 6.20
Figure 6.21
Figure 6.22
Figure 6.23
Figure 6.24
Figure 6.25
Figure 6.26
Figure 6.27
Figure 6.28
Figure 6.29
Figure 6.30
Figure 6.31
Figure 6.32
Figure 6.33
Figure 6.34
Figure 6.35
Figure 6.36
Figure 6.37
Figure 6.38
Figure 6.39
Figure 7.1
Figure 7.2
Figure 8.1
Figure 8.2
Logic Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
48-Pin TSOP1 Contact x8, x16 Devices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
63-BGA Contact, x8 Device (Balls Down, Top View). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
63-BGA Contact, x16 Device (Balls Down, Top View). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Functional Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Array Organization — x8 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Array Organization — x16 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Page Reprogram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Page Reprogram with Data Manipulation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Ready/Busy Pin Electrical Application . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
WP# Low Timing Requirements during Program/Erase Command Sequence . . . . . . . . . . . 39
Command Latch Cycle. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
Address Latch Cycle . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
Input Data Latch Cycle. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
Data Output Cycle Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
Data Output Cycle Timing (EDO). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
Page Read Operation (Read One Page) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
Page Read Operation Interrupted by CE# . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
Page Read Operation Timing with CE# Don’t Care. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
Page Program Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
Page Program Operation Timing with CE# Don’t Care . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
Random Data Input . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
Random Data Output . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
Multiplane Page Program . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
Multiplane Page Program (ONFI 1.0 Protocol) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
Block Erase Operation (Erase One Block). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
Multiplane Block Erase . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
Multiplane Block Erase (ONFI 1.0 Protocol) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
Copy Back Read with Optional Data Readout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
Copy Back Program with Random Data Input . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
Multiplane Copy Back Program . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
Multiplane Copy Back Program (ONFI 1.0 Protocol) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54
Status / EDC Read Cycle. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54
Read Status Enhanced Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55
Reset Operation Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55
Read Cache Operation Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
“Sequential” Read Cache Timing, Start (and Continuation) of Cache Operation . . . . . . . . . 56
“Random” Read Cache Timing, Start (and Continuation) of Cache Operation . . . . . . . . . . . 57
Read Cache Timing, End Of Cache Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
Cache Program . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58
Multiplane Cache Program . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59
Multiplane Cache Program (ONFI 1.0 Protocol) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60
Read ID Operation Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61
Read ID2 Operation Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61
ONFI Signature Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62
Read Parameter Page Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62
OTP Entry Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63
Power On and Data Protection Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63
Program Enabling / Disabling Through WP# Handling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64
Erase Enabling / Disabling Through WP# Handling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64
TS/TSR 48 — 48-lead Plastic Thin Small Outline, 12 x 20 mm, Package Outline . . . . . . . . 65
VBM063 — 63-Pin BGA, 11 mm x 9 mm Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66
Program Operation with CE# Don't Care . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67
Read Operation with CE# Don't Care . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67
6 Spansion® SLC NAND Flash Memory for Embedded S34ML01G1_04G1_17 November 22, 2013
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共有リンク

Link :


部品番号部品説明メーカ
S34ML04G1

3V SLC NAND Flash

Cypress Semiconductor
Cypress Semiconductor
S34ML04G1

(S34ML01G1 - S34ML04G1) SLC NAND Flash Memory

Spansion
Spansion
S34ML04G2

NAND Flash Memory

Cypress Semiconductor
Cypress Semiconductor


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