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Datasheet HSMF-C167 PDF ( 特性, スペック, ピン接続図 )

部品番号 HSMF-C167
部品説明 Miniature Bi-Color Surface Mount ChipLEDs
メーカ Avago
ロゴ Avago ロゴ 
プレビュー
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HSMF-C167 Datasheet, HSMF-C167 PDF,ピン配置, 機能
HSMF-C16x
Miniature Bi-Color Surface Mount ChipLEDs
Data Sheet
Description
This series of bi-color ChipLEDs is designed with the small-
est footprint to achieve high density of components on
board. They have the industry standard footprint of 1.6
mm x 0.8 mm and a height of only 0.5 mm. This makes
them very suitable for cellular phone and mobile equip-
ment backlighting and indication. They are available in
a wide range of color combinations. In order to facilitate
automated pick and place operation, these ChipLEDs are
shipped in tape and reel, with 4000 units per reel. These
parts are compatible with reflow soldering.
Features
Small size
0603 industry standard footprint
Diffused optics
Operating temperature range of –40° C to +85° C
Compatible with reflow soldering
Available in various color combination
Available in 8 mm tape on 7" (178 mm) diameter
reels
Applications
Keypad backlighting
Symbol indicator
LCD backlighting
Pushbutton backlighting
Front panel indicator
Device Selection Guide
Part Number
HSMF-C162
HSMF-C163
HSMF-C164
HSMF-C165
HSMF-C166
HSMF-C167
HSMF-C168
HSMF-C169
Color
AlInGaP Red / AlInGaP Amber
AlInGaP Red / InGaN Green
AlInGaP Red / InGaN Blue
High Efficiency Red / GaP Green
GaP Yellow / GaP Green
GaP Orange / GaP Green
InGaN Green / InGaN Blue
AlInGaP Amber / InGaN Blue
Package Description
Untinted, Diffused
Untinted, Diffused
Untinted, Diffused
Untinted, Diffused
Untinted, Diffused
Untinted, Diffused
Untinted, Diffused
Untinted, Diffused
CAUTION: HSMF-C16x LEDs are class 1A ESD sensitive per JESD22-A114C.01 standard. Please observe appropriate pre-
cautions during handling and processing. Refer to Avago Technologies Application Note AN-1142 for additional details.
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HSMF-C167 pdf, ピン配列
Electrical Characteristics at TA = 25° C
Forward Voltage
VF (Volts) @ IF[1]
Color Typ. Max.
Reverse
Breakdown
VR (Volts)
@ IR = 100 µA
Min.
AlInGaP Red
20 mA 1.9
2.4
5
AlInGaP Amber
20 mA 1.9
2.4
5
AlInGaP Red[2]
10 mA 1.8
2.3
5
AlInGaP Amber[2]
10 mA 1.8
2.3
5
InGaN Green
10 mA 3.4
3.8
5
InGaN Blue
10 mA 3.4
3.8
5
HER
20 mA 1.95 2.6
5
GaP Orange
20 mA 2.2
2.6
5
GaP Yellow
20 mA 2.1
2.6
5
GaP Green
20 mA 2.2
2.6
5
Notes:
1. VF Tolerance: ± 0.1 V.
2. The product testing is based on 20 mA. This is for reference only.
Capacitance Thermal
C (pF), @ VF = 0,
f = 1 MHz
Typ.
Resistance
RθJ-PIN (°C/W)
Typ.
15 300
11 300
15 300
11 300
35 500
35 500
5 325
7 325
6 325
9 325
Optical Characteristics at TA = 25° C
Color
Peak Dominant Luminous
Luminous Intensity Wavelength Wavelength
Viewing Angle
Efficacy
Iv (mcd) @ IF[1]
λpeak (nm)
λd[2] (nm)
2 θ1/2 Degrees[3] ηv (lm/W)
Color Min. Typ. Typ. Typ. Typ. Typ.
AlInGaP Red
20 mA 28.5 90
637
626
120
155
AlInGaP Amber
20 mA 28.5 90
595
592
120
480
AlInGaP Red[4] 10 mA 11.2 35 637 626 120 155
AlInGaP Amber[4] 10 mA 11.2 35 595 592 120 480
InGaN Green
10 mA 18 45
523
525
120
500
InGaN Blue
10 mA 2.8 10
468
470
120
80
HER 20 mA 2.8 10 636 621 120 145
GaP Orange
20 mA 2.8 8
605
604
120
380
GaP Yellow 20 mA 2.8 8 589 586 120 500
GaP Green
20 mA 4.5 15
570
572
120
595
Notes:
1. The luminous intensity Iv is measured at the peak of the spatial radiation pattern which may not be aligned with the mechanical axis of the lamp
package.
2. The dominant wavelength λd is derived from the CIE Chromatically Diagram and represents the perceived color of the device.
3. θ1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity.
4. The product testing is based on 20 mA. This is for reference purpose.
3
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HSMF-C167 電子部品, 半導体
25
AlInGaP/GaP
20
15
InGaN
10
5
0
0 10 20 30 40 50 60 70 80 90 100
TA – AMBIENT TEMPERATURE – °C
100
90
80
70
60
50
40
30
20
10
0
-90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90
ANGLE
Figure 4. Maximum forward current vs. ambient
temperature.
Figure 5. Relative intensity vs. angle.
HSMF-C16x fig 5
10 SEC. MAX.
230°C MAX.
140-160°C
4°C/SEC.
MAX.
OVER 2 MIN.
TIME
4°C/SEC. MAX.
3°C/SEC. MAX.
Figure 6. Recommended reflow soldering profile.
0.30
(0.012)
0.60
(0.024)
0.40
(0.016)
0.70
(0.028)
0.70
(0.028)
0.40
(0.016)
Figure 8. Recommended soldering pad pattern.
HSMF-C16x fig 7
217°C
200°C
150°C
255 - 260°C
3°C/SEC. MAX.
3°C/SEC. MAX.
10 - 30 SEC.
6°C/SEC. MAX.
60 - 120 SEC.
100 SEC. MAX.
TIME
(Acc. to J-STD-020C)
Figure 7. Recommended Pb-free reflow soldering profile.
6
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