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PDF K9G8G08U0A-W000 Data sheet ( Hoja de datos )
| Número de pieza | K9G8G08U0A-W000 | |
| Descripción | FLASH MEMORY DIE | |
| Fabricantes | Samsung | |
| Logotipo |  |
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Hay una vista previa y un enlace de descarga de K9G8G08U0A-W000 (archivo pdf) en la parte inferior de esta página. Total 5 Páginas | ||
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K9G8G08U0A-W000
FLASH MEMORY DIE
K9G8G08U0A
INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS,
AND IS SUBJECT TO CHANGE WITHOUT NOTICE.
NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY LICENSE,
EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE,
TO ANY INTELLECTUAL PROPERTY RIGHTS IN SAMSUNG PRODUCTS OR TECHNOLOGY.
ALL INFORMATION IN THIS DOCUMENT IS PROVIDED
ON AS "AS IS" BASIS WITHOUT GUARANTEE OR WARRANTY OF ANY KIND.
1. For updates or additional information about Samsung products, contact your nearest Samsung office.
2. Samsung products are not intended for use in life support, critical care, medical, safety equipment, or sim-
ilar applications where Product failure could result in loss of life or personal or physical harm, or any military
or defense application, or any governmental procurement to which special terms or provisions may apply.
* Samsung Electronics reserves the right to change products or specification without notice.
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Free Datasheet http://www.datasheet4u.net/
1 page  
K9G8G08U0A-W000
FLASH MEMORY DIE
1.6 Packing
• Tray Packing for Chip
A 2-inch square waffle style carrier for die with separate compartments for each die. Each tray has a cavity size selected for the
device that allows for easy loading and unloading and prevents rotation. The tray itself is made of conductive material to reduce the
danger of damage to the die from electrostatic discharge.
The chip carriers will be labeled with the following information :
- SAMSUNG wafer lot number
- SAMSUNG part number
- Quantity
• Jar Packing for Wafer
Jar Packing is made by Samsung Electronics and used by many customers that we deliver the requested die as wafer.
The pack consists of clean paper to wrap the wafer, high cushioned sponge between wafer and hardly fragile plastic box with sponge.
Each pack has typically 25 wafers and then several packs are put into larger box depending on amounts of wafers.
1.7 Storage and Handling
SAMSUNG recommends the die should be stored in a controlled environment with filtered nitrogen. The carrier must be opened at
ESD safe environment at inspection and assembly.
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Free Datasheet http://www.datasheet4u.net/
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| Páginas | Total 5 Páginas | |
| PDF Descargar | [ Datasheet K9G8G08U0A-W000.PDF ] | |
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