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BD3573HFP の電気的特性と機能

BD3573HFPのメーカーはROHM Semiconductorです、この部品の機能は「(BD3570FP - BD3575HFP) High Voltage LDO Regulators」です。


製品の詳細 ( Datasheet PDF )

部品番号 BD3573HFP
部品説明 (BD3570FP - BD3575HFP) High Voltage LDO Regulators
メーカ ROHM Semiconductor
ロゴ ROHM Semiconductor ロゴ 




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BD3573HFP Datasheet, BD3573HFP PDF,ピン配置, 機能
Power Management IC Series for Automotive Body Control
High Voltage
LDO Regulators
BD3570FP, BD3570HFP, BD3571FP, BD3571HFP, BD3572FP, BD3572HFP
BD3573FP, BD3573HFP, BD3574FP, BD3574HFP, BD3575FP, BD3575HFP
No.11036EBT02
Description
BD357XFP/HFP SERIES regulators feature a high 50 V withstand-voltage and are suitable for use with onboard vehicle
microcontrollers. They offer the output current of 500 mA while limiting the quiescent current to 30μA (TYP).With these
devices, a ceramic capacitor can be selected at the output for stable operation, the output tolerance is within ±2% over the
wide ambient temperature range (-40 to 125), and the short circuit protection is folded-type to minimize generation of
heat during malfunction. These devices are developed to offer most robust power-supply design under the harsh
automotive environment. The BD357XFP/HFP Series provide ideal solutions to lower the current consumption as well as to
simplify the use with battery direct-coupled systems.
Features
1) Ultra-low quiescent current: 30μA (TYP.)
2) Low-saturation voltage type P-channel DMOS output transistors
3) High output voltage precision: 2%Iomax = 500 mA
4) Low-ESR ceramic capacitors can be used as output capacitors.
5) Vcc power supply voltage = 50 V
6) Built-in overcurrent protection circuit and thermal shutdown circuit
7) TO252-3, TO252-5, HRP5 Package
Applications
Onboard vehicle devices (body-control, car stereos, satellite navigation systems, etc.)
Line up matrix
BD3570FP/HFP BD3571FP/HFP BD3572FP/HFP BD3573FP/HFP BD3574FP/HFP BD3575FP/HFP
Output voltage
SW function
3.3V
5.0 V
Variable
3.3V
5.0 V
Variable
Package
FP:TO252-3,TO252-5
HFP:HRP5
Absolute maximum ratings (Ta=25)
Parameter
Symbol
Limit
Unit
Supply voltage
VCC 50 1 V
Switch Supply voltage
VSW
50 2 V
Output current
IO 500 mA
1.2 (TO252-3) 3
Power dissipation
Pd
1.3 (TO252-5) 4
W
1.6 (HRP5) 5
Operating temperature range
Topr
-40 to +125
Storage temperature range
Tstg
-55 to +150
Maximum junction
temperature
Tjmax
150
1 Not to exceed Pd and ASO.
2 for ON/OFF SW Regulator only
3 TO252-3: Reduced by 9.6 mW/over 25 , when mounted on a glass epoxy board (70 mm 70 mm 1.6 mm).
4 TO252-5: Reduced by 10.4 mW/over 25 , when mounted on a glass epoxy board (70 mm 70 mm 1.6 mm).
5 HRP5: Reduced by 12.8 mW/over 25 , when mounted on a glass epoxy board (70 mm 70 mm 1.6 mm).
www.rohm.com
© 2011 ROHM Co., Ltd. All rights reserved.
1/9
2011.03 - Rev.B
Free Datasheet http://www.datasheet4u.com/

1 Page





BD3573HFP pdf, ピン配列
BD3570FP/HFP, BD3571FP/HFP, BD3572FP/HFP, BD3573FP/HFP
BD3574FP/HFP, BD3575FP/HFP
Reference Data: BD3574HFPUnless otherwise specified, Ta=25℃)
50 6
40
30
20
10
0
0
Ta=125
Ta=25
Ta=-40
5 10 15 20
SUPPLY VOLTAGE: VCC [V]
25
Fig. 1 Total Supply Current
5
4
3
Ta=125
2
Ta=25
1 Ta=-40
0
0 5 10 15 20
SUPPLY VOLTAGE: VCC [V]
Fig. 2 Output Voltage VS
Power Supply Voltage
25
3
2
Ta=125
Ta=25
1 Ta=-40
0
0 100 200 300 400 500
OUTPUT CURRENT: IO[mA]
Fig. 4 Dropout Voltage
70
Ta=125
60
50 Ta=25
40 Ta=-40
30
20
10
0
10 100 1000 10000 100000 1000000
FREQUENCY: f [Hz]
Fig. 5 Ripple rejection
100
80
60
40
20
0
0 100 200 300 400 500
OUTPUT CURRENT: IO[mA]
Fig. 7 Total Supply Current
Classified by Load
6
5
4
3
2
1
0
100 120 140 160 180 200
AMBIENT TEMPERATURE: Ta []
Fig. 8 Thermal Shutdown Circuit
120 2
90
Ta=125
60
Ta=25
30
Ta=-40
0
0 5 10 15 20 25
SUPPLY VOLTAGE: VSW [V]
Fig. 10 SW Bias current
www.rohm.com
© 2011 ROHM Co., Ltd. All rights reserved.
1.5
1
0.5
0
-40 0
40 80 120
AMBIENT TEMPERATURE: Ta []
Fig. 11 Dropout voltage VS
Temperature
3/9
Technical Note
6
5
4
Ta=-40
3
2
Ta=25
1 Ta=125
0
0
500
1000
1500
2000
OUTPUT CURRENT: IO [mA]
Fig. 3 Output Voltage VS Load
6
5
4
Ta=125
3
Ta=25
2
Ta=-40
1
0
0 0.5 1 1.5 2
SUPPLY VOLTAGE: VSW [V]
Fig. 6 Output Voltage VS
SW Input Voltage
5.5
5.25
5
4.75
4.5
-40
0
40 80 120
AMBIENT TEMPERATURE: Ta []
Fig. 9 Output Voltage VS
Temperature
50
40
30
20
10
0
-40
0
40 80 120
AMBIENT TEMPERATURE: Ta []
Fig. 12 Total Supply Current
Temperature
2011.03 - Rev.B
Free Datasheet http://www.datasheet4u.com/


3Pages


BD3573HFP 電子部品, 半導体
BD3570FP/HFP, BD3571FP/HFP, BD3572FP/HFP, BD3573FP/HFP
BD3574FP/HFP, BD3575FP/HFP
Technical Note
Peripheral Settings for Pins and Precautions
1) VCC pins
Insert capacitors with a capacitance of 0.33μF to 1000μF between the VCC and GND pins.
The capacitance varies with the application. Be sure to design the capacitance with a sufficient margin.
2) Capacitors for stopping oscillation for output pins
Capacitors for stopping oscillation must be placed between each output pin and the GND pin. Use a capacitor within a
capacitance range between 0.1μF and 1000μF. Since oscillation does not occur even for ESR values from 0.001Ω to
100Ω, a ceramic capacitor can be used. Abrupt input voltage and load fluctuations can affect output voltages. Output
capacitor capacitance values should be determined after sufficient testing of the actual application.
Operation Notes
1) Absolute maximum ratings
Use of the IC in excess of absolute maximum ratings such as the applied voltage or operating temperature range may
result in IC damage. Assumptions should not be made regarding the state of the IC (short mode or open mode) when
such damage is suffered. A physical safety measure such as a fuse should be implemented when use of the IC in a
special mode where the absolute maximum ratings may be exceeded is anticipated.
2) GND potential
Ensure a minimum GND pin potential in all operating conditions.
3) Setting of heat
Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating conditions.
4) Pin short and mistake fitting
Use caution when orienting and positioning the IC for mounting on printed circuit boards. Improper mounting may result in
damage to the IC. Shorts between output pins or between output pins and the power supply and GND pins caused by the
presence of a foreign object may result in damage to the IC.
5) Actions in strong magnetic field
Use caution when using the IC in the presence of a strong magnetic field as doing so may cause the IC to malfunction.
6) Testing on application boards
When testing the IC on an application board, connecting a capacitor to a pin with low impedance subjects the IC to stress.
Always discharge capacitors after each process or step. Be sure to turn power off when mounting or dismounting jigs at
the inspection stage. Furthermore, for countermeasures against static electricity, ground the equipment at the assembling
stage and pay utmost attention at the time of transportation or storing the product.
7) This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated.
PN junction is formed by the P layer and the N layer of each element, and a variety of parasitic elements will be
constituted.
For example, when a resistor and transistor are connected to pins as shown in Fig. 19,
the P/N junction functions as a parasitic diode when GND>Pin A for the resistor or GND>Pin B for the transistor
(NPN).
Similarly, when GNDPin B for the transistor (NPN), the parasitic diode described above combines with the N
layer of other adjacent elements to operate as a parasitic NPN transistor.
www.rohm.com
© 2011 ROHM Co., Ltd. All rights reserved.
6/9
2011.03 - Rev.B
Free Datasheet http://www.datasheet4u.com/

6 Page



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部品番号部品説明メーカ
BD3573HFP

(BD3570FP - BD3575HFP) High Voltage LDO Regulators

ROHM Semiconductor
ROHM Semiconductor


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