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PDF IRLHS6242PBF Data sheet ( Hoja de datos )

Número de pieza IRLHS6242PBF
Descripción Power MOSFET ( Transistor )
Fabricantes International Rectifier 
Logotipo International Rectifier Logotipo



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No Preview Available ! IRLHS6242PBF Hoja de datos, Descripción, Manual

VDS
VGS
RDS(on) max
(@VGS = 4.5V)
RDS(on) max
(@VGS = 2.5V)
ID
(@TC (Bottom) = 25°C)
20
±12
11.7
15.5
12d
V
V
mΩ
mΩ
A
Applications
Charge and discharge switch for battery application
System/Load Switch
PD - 97582B
IRLHS6242PbF
HEXFET® Power MOSFET
D
D
DG
D
D
S
2mm x 2mm PQFN
S
Features and Benefits
Features
Low RDSon (11.7mΩ)
Low Thermal Resistance to PCB (13°C/W)
Low Profile (1.0mm)
Industry-Standard Pinout
Compatible with Existing Surface Mount Techniques
RoHS Compliant Containing no Lead, no Bromide and no Halogen
results in
Resulting Benefits
Lower Conduction Losses
Enable better thermal dissipation
Increased Power Density
Multi-Vendor Compatibility
Easier Manufacturing
Environmentally Friendlier
Orderable part number
IRLHS6242TRPBF
IRLHS6242TR2PBF
Package Type
PQFN 2mm x 2mm
PQFN 2mm x 2mm
Standard Pack
Form
Quantity
Tape and Reel
4000
Tape and Reel
400
Note
Absolute Maximum Ratings
Parameter
VDS Drain-to-Source Voltage
VGS
ID @ TA = 25°C
ID @ TA = 70°C
ID @ TC(Bottom) = 25°C
ID @ TC(Bottom) = 70°C
ID @ TC(Bottom) = 25°C
IDM
PD @TA = 25°C
PD @TC(Bottom) = 25°C
Gate-to-Source Voltage
Continuous Drain Current, VGS @ 4.5V
Continuous Drain Current, VGS @ 4.5V
iContinuous Drain Current, VGS @ 4.5V
iContinuous Drain Current, VGS @ 4.5V
cContinuous Drain Current, VGS @ 4.5V (Package Limited)
Pulsed Drain Current
gPower Dissipation
gPower Dissipation
gLinear Derating Factor
TJ
TSTG
Operating Junction and
Storage Temperature Range
Max.
20
±12
10
8.3
22d
18d
12d
88
1.98
9.6
0.016
-55 to + 150
Units
V
A
W
W/°C
°C
Notes  through ‡ are on page 2
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IRLHS6242PBF pdf
25
ID = 8.5A
20
15
TJ = 125°C
10
TJ = 25°C
5
0 2 4 6 8 10 12 14 16
VGS, Gate -to -Source Voltage (V)
Fig 12. On-Resistance vs. Gate Voltage
70
ID
60 TOP 2.2A
4.3A
50 BOTTOM 8.5A
40
30
20
10
0
25 50 75 100 125 150
Starting TJ , Junction Temperature (°C)
Fig 14. Maximum Avalanche Energy vs. Drain Current
IRLHS6242PbF
35
30
25
20
Vgs = 2.5V
15
Vgs = 4.5V
10
5
0 10 20 30 40 50 60 70
ID, Drain Current (A)
Fig 13. Typical On-Resistance vs. Drain Current
600
500
400
300
200
100
0
1E-5
1E-4
1E-3
1E-2
1E-1
1E+0
Time (sec)
Fig 15. Typical Power vs. Time
D.U.T
+
‚
-

RG
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+
Driver Gate Drive
P.W.
Period
D=
P.W.
Period
ƒ Circuit Layout Considerations
Low Stray Inductance
-
Ground Plane
Low Leakage Inductance
Current Transformer
-„ +
D.U.T. ISD Waveform
Reverse
Recovery
Current
Body Diode Forward
Current
di/dt
D.U.T. VDS Waveform
Diode Recovery
dv/dt
dv/dt controlled by RG
Driver same type as D.U.T.
VDD +
ISD controlled by Duty Factor "D"
D.U.T. - Device Under Test
-
Re-Applied
Voltage
Body Diode
Inductor Curent
Forward Drop
Ripple 5%
* VGS = 5V for Logic Level Devices
Fig 16. Peak Diode Recovery dv/dt Test Circuit for N-Channel
HEXFET® Power MOSFETs
*VGS=10V
VDD
ISD
5
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