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W25Q40BL の電気的特性と機能

W25Q40BLのメーカーはWinbondです、この部品の機能は「2.5V 4M-BIT SERIAL FLASH MEMORY」です。


製品の詳細 ( Datasheet PDF )

部品番号 W25Q40BL
部品説明 2.5V 4M-BIT SERIAL FLASH MEMORY
メーカ Winbond
ロゴ Winbond ロゴ 




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W25Q40BL Datasheet, W25Q40BL PDF,ピン配置, 機能
W25Q40BL
2.5V 4M-BIT
SERIAL FLASH MEMORY WITH
DUAL AND QUAD SPI
Publication Release Date: May 04, 2012
- 1 - Revision D

1 Page





W25Q40BL pdf, ピン配列
W25Q40BL
7.2.1 Manufacturer and Device Identification ................................................................................16
7.2.2 Instruction Set Table 1 (Erase, Program Instructions)..........................................................17
7.2.3 Instruction Set Table 2 (Read Instructions) ..........................................................................18
7.2.4 Instruction Set Table 3 (ID, Security Instructions) ................................................................19
7.2.5 Write Enable (06h) ...............................................................................................................20
7.2.6 Write Enable for Volatile Status Register (50h)....................................................................20
7.2.7 Write Disable (04h)...............................................................................................................21
7.2.8 Read Status Register-1 (05h) and Read Status Register-2 (35h) ........................................22
7.2.9 Write Status Register (01h) ..................................................................................................22
7.2.10 Read Data (03h) .................................................................................................................24
7.2.11 Fast Read (0Bh) .................................................................................................................25
7.2.12 Fast Read Dual Output (3Bh) .............................................................................................26
7.2.13 Fast Read Quad Output (6Bh)............................................................................................27
7.2.14 Fast Read Dual I/O (BBh)...................................................................................................28
7.2.15 Fast Read Quad I/O (EBh) .................................................................................................30
7.2.16 Word Read Quad I/O (E7h) ................................................................................................32
7.2.17 Octal Word Read Quad I/O (E3h).......................................................................................34
7.2.18 Set Burst with Wrap (77h) ..................................................................................................36
7.2.19 Continuous Read Mode Bits (M7-0) ...................................................................................37
7.2.20 Continuous Read Mode Reset (FFh or FFFFh)..................................................................37
7.2.21 Page Program (02h) ...........................................................................................................38
7.2.22 Quad Input Page Program (32h) ........................................................................................39
7.2.23 Sector Erase (20h) .............................................................................................................40
7.2.24 32KB Block Erase (52h) .....................................................................................................41
7.2.25 64KB Block Erase (D8h).....................................................................................................42
7.2.26 Chip Erase (C7h / 60h).......................................................................................................43
7.2.27 Erase / Program Suspend (75h).........................................................................................44
7.2.28 Erase / Program Resume (7Ah) .........................................................................................45
7.2.29 Power-down (B9h) ..............................................................................................................46
7.2.30 Release Power-down / Device ID (ABh) .............................................................................47
7.2.31 Read Manufacturer / Device ID (90h) .................................................................................49
7.2.32 Read Manufacturer / Device ID Dual I/O (92h) ...................................................................50
7.2.33 Read Manufacturer / Device ID Quad I/O (94h) .................................................................51
7.2.34 Read Unique ID Number (4Bh)...........................................................................................52
7.2.35 Read JEDEC ID (9Fh) ........................................................................................................53
7.2.36 Read SFDP Register (5Ah) ................................................................................................54
7.2.37 Erase Security Registers (44h)...........................................................................................55
7.2.38 Program Security Registers (42h) ......................................................................................56
7.2.39 Read Security Registers (48h) ...........................................................................................57
8. ELECTRICAL CHARACTERISTICS............................................................................................... 58
8.1 Absolute Maximum Ratings................................................................................................ 58
Publication Release Date: May 04, 2012
- 3 - Revision D


3Pages


W25Q40BL 電子部品, 半導体
W25Q40BL
3. PACKAGE TYPES
3.1 Pin Configuration SOIC /VSOP 150-mil, SOIC 208-mil
/CS
DO (IO1)
/WP (IO2)
GND
Top View
18
27
36
45
VCC
/HOLD (IO3)
CLK
DI (IO0)
Figure 1a. W25Q40BL Pin Assignments, 8-pin SOIC/VSOP 150-mil, SOIC 208-mil (Package Code SN, SV & SS)
3.2 Pad Configuration WSON 6X5-mm, USON 2X3-mm
/CS
DO (IO1)
/WP (IO2)
GND
Top View
18
27
36
45
VCC
/HOLD (IO3)
CLK
DI (IO0)
Figure 1b. W25Q40BL Pad Assignments, 8-pad WSON 6x5-mm, USON 2x3-mm (Package Code ZP & UX)
3.3 Pin Configuration PDIP 300-mil
Top View
/CS 1
8 VCC
DO (IO1)
/WP (IO2)
GND
2
3
4
7 /HOLD (IO3)
6 CLK
5 DI (IO0)
Figure 1c. W25Q16CV Pin Assignments, 8-pin PDIP (Package Code DA)
3.4 Pin Description SOIC, VSOP, WSON, USON, PDIP
PIN NO.
PIN NAME
I/O
FUNCTION
1 /CS I Chip Select Input
2
DO (IO1)
I/O Data Output (Data Input Output 1)*1
3
/WP (IO2)
I/O Write Protect Input ( Data Input Output 2)*2
4 GND
Ground
5
DI (IO0)
I/O Data Input (Data Input Output 0)*1
6 CLK I Serial Clock Input
7
/HOLD (IO3)
I/O Hold Input (Data Input Output 3)*2
8 VCC
Power Supply
*1 IO0 and IO1 are used for Standard and Dual SPI instructions
*2 IO0 – IO3 are used for Quad SPI instructions
-6-

6 Page



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共有リンク

Link :


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2.5V 4M-BIT SERIAL FLASH MEMORY

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