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W25Q32DW の電気的特性と機能

W25Q32DWのメーカーはWinbondです、この部品の機能は「1.8V 32M-BIT SERIAL FLASH MEMORY」です。


製品の詳細 ( Datasheet PDF )

部品番号 W25Q32DW
部品説明 1.8V 32M-BIT SERIAL FLASH MEMORY
メーカ Winbond
ロゴ Winbond ロゴ 




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W25Q32DW Datasheet, W25Q32DW PDF,ピン配置, 機能
W25Q32DW
1.8V 32M-BIT
SERIAL FLASH MEMORY WITH
DUAL/QUAD SPI & QPI
www.DataSheet.net/
-1-
Publication Release Date: January 18, 2011
Preliminary - Revision C
Datasheet pdf - http://www.DataSheet4U.co.kr/

1 Page





W25Q32DW pdf, ピン配列
W25Q32DW
10.2
10.1.12 W25Q32DW Status Register Memory Protection (CMP = 1) ............................................17
INSTRUCTIONS................................................................................................................. 18
10.2.1 Manufacturer and Device Identification ...............................................................................18
10.2.2 Instruction Set Table 1 (Standard SPI Instructions) ............................................................19
10.2.3 Instruction Set Table 2 (Dual SPI Instructions) ...................................................................20
10.2.4 Instruction Set Table 3 (Quad SPI Instructions) ..................................................................20
10.2.5 Instruction Set Table 4 (QPI Instructions) ...........................................................................21
10.2.6 Write Enable (06h) ..............................................................................................................23
10.2.7 Write Enable for Volatile Status Register (50h)...................................................................23
10.2.8 Write Disable (04h) .............................................................................................................24
10.2.9 Read Status Register-1 (05h) and Read Status Register-2 (35h) .......................................24
10.2.10 Write Status Register (01h)...............................................................................................25
10.2.11 Read Data (03h) ...............................................................................................................27
10.2.12 Fast Read (0Bh)................................................................................................................28
10.2.13 Fast Read Dual Output (3Bh) ...........................................................................................30
10.2.14 Fast Read Quad Output (6Bh) ..........................................................................................31
10.2.15 Fast Read Dual I/O (BBh) .................................................................................................32
10.2.16 Fast Read Quad I/O (EBh)................................................................................................34
10.2.17 Word Read Quad I/O (E7h) ..............................................................................................37
10.2.18 Octal Word Read Quad I/O (E3h) .....................................................................................39
10.2.19 Set Burst with Wrap (77h) .............www..Data.Shee.t.net/.................................................................................41
10.2.20 Page Program (02h) .........................................................................................................42
10.2.21 Quad Input Page Program (32h).......................................................................................44
10.2.22 Sector Erase (20h)............................................................................................................45
10.2.23 32KB Block Erase (52h)....................................................................................................46
10.2.24 64KB Block Erase (D8h) ...................................................................................................47
10.2.25 Chip Erase (C7h / 60h) .....................................................................................................48
10.2.26 Erase / Program Suspend (75h) .......................................................................................49
10.2.27 Erase / Program Resume (7Ah)........................................................................................51
10.2.28 Power-down (B9h) ............................................................................................................52
10.2.29 Release Power-down / Device ID (ABh) ...........................................................................53
10.2.30 Read Manufacturer / Device ID (90h) ...............................................................................55
10.2.31 Read Manufacturer / Device ID Dual I/O (92h) .................................................................56
10.2.32 Read Manufacturer / Device ID Quad I/O (94h) ................................................................57
10.2.33 Read Unique ID Number (4Bh) .........................................................................................58
10.2.34 Read JEDEC ID (9Fh) ......................................................................................................59
10.2.35 Erase Security Registers (44h) .........................................................................................60
10.2.36 Program Security Registers (42h).....................................................................................61
10.2.37 Read Security Registers (48h) ..........................................................................................62
10.2.38 Set Read Parameters (C0h) .............................................................................................63
10.2.39 Burst Read with Wrap (0Ch) .............................................................................................64
Publication Release Date: January 18, 2011
- 3 - Preliminary - Revision C
Datasheet pdf - http://www.DataSheet4U.co.kr/


3Pages


W25Q32DW 電子部品, 半導体
W25Q32DW
3. PIN CONFIGURATION SOIC 208-MIL
Top View
/CS 1 8
DO (IO1)
/WP (IO2)
GND
27
36
45
VCC
/HOLD (IO3)
CLK
DI (IO0)
Figure 1a. W25Q32DW Pin Assignments, 8-pin SOIC 208-mil (Package Code SS)
4. PAD CONFIGURATION WSON 6X5-MM / 8X6-MM
Top View
/CS 1 8 VCC
DO (IO1)
/WP (IO2)
GND
2
3
7
www.DataSheet.net/
6
45
/HOLD (IO3)
CLK
DI (IO0)
Figure 1b. W25Q32DW Pad Assignments, 8-pad WSON (Package Code ZP & ZE)
5. PIN DESCRIPTION SOIC 208-MIL, WSON 6X5/8X6-MM
PIN NO.
PIN NAME
I/O
FUNCTION
1 /CS I Chip Select Input
2
DO (IO1)
I/O Data Output (Data Input Output 1)*1
3
/WP (IO2)
I/O Write Protect Input ( Data Input Output 2)*2
4 GND
Ground
5
DI (IO0)
I/O Data Input (Data Input Output 0)*1
6 CLK I Serial Clock Input
7
/HOLD (IO3)
I/O Hold Input (Data Input Output 3)*2
8 VCC
Power Supply
*1 IO0 and IO1 are used for Standard and Dual SPI instructions
*2 IO0 – IO3 are used for Quad SPI/QPI instructions
-6-
Datasheet pdf - http://www.DataSheet4U.co.kr/

6 Page



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部品番号部品説明メーカ
W25Q32DW

1.8V 32M-BIT SERIAL FLASH MEMORY

Winbond
Winbond


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