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PDF MT29C4G48MAPLCCA-6IT Data sheet ( Hoja de datos )
| Número de pieza | MT29C4G48MAPLCCA-6IT | |
| Descripción | NAND Flash and Mobile LPDRAM | |
| Fabricantes | Micron Technology | |
| Logotipo |  |
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Preliminary‡
152-Ball NAND Flash and Mobile LPDRAM PoP (TI OMAP) MCP
Features
NAND Flash and Mobile LPDRAM
152-Ball Package-on-Package (PoP)
Combination Memory (TI OMAP™)
MT29C Family
Current production part numbers: See Table 1 on page 3
Features
• Micron® NAND Flash and Mobile LPDRAM
components
• RoHS-compliant, “green” package
• Separate NAND Flash and Mobile LPDRAM
interfaces
• Space-saving package-on-package combination
• Low-voltage operation (1.70–1.95V)
• Industrial temperature range: –40°C to +85°C
NAND Flash-Specific Features
• Organization
– Page size
x8: 2112 bytes (2048 + 64 bytes)
x16: 1056 words (1024 + 32 words)
– Block size: 64 pages (128K + 4K bytes)
Mobile LPDRAM-Specific Features
• No external voltage reference required
• No minimum clock rate requirement
• 1.8V LVCMOS-compatible inputs
• Programmable burst lengths
• Partial-array self refresh (PASR)
• Deep power-down (DPD) mode
• Selectable output drive strength
• STATUS REGISTER READ (SRR) supported1
Figure 1: PoP Block Diagram
NAND Flash
Power
NAND Flash
Device
NAND Flash
Interface
LP-DRAM Power
www.DataSheet.net/
LP-DRAM
Device
LP-DRAM Interface
Options
• LP-DRAM
166 MHz CL32
133 MHz CL3
Marking
-6
-75
Notes: 1. Contact factory for remapped SRR output.
2. CL = CAS (READ) latency.
PDF: 09005aef8326e5ac / Source: 09005aef8326e59a
152ball_ nand_lpdram_j4xx_omap.fm - Rev. E 4/09 EN
1 Micron Technology, Inc., reserves the right to change products or specifications without notice.
©2008 Micron Technology, Inc. All rights reserved.
‡Products and specifications discussed herein are for evaluation and reference purposes only and are subject to change by
Micron without notice. Products are only warranted by Micron to meet Micron’s production data sheet specifications.
Datasheet pdf - http://www.DataSheet4U.co.kr/
1 page  
Preliminary
152-Ball NAND Flash and Mobile LPDRAM PoP (TI OMAP) MCP
Ball Assignments and Descriptions
Ball Assignments and Descriptions
Figure 3: 152-Ball VFBGA Ball Assignments (NAND x8; LPDDR x16)
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21
A NC NC VDDQ LDM DQ5 DQ7 VSSQ DQ2 DQ4 DQ8 DQ11 CK VSS UDM VDDQ DQ13 DQ12 NC NC NC NC A
B NC NC NC NC VDDQ DQ1 DQ6 LDQS DQ3 DQ0 DQ9 DQ10 CK# VSSQ UDQS VDD DQ15 DQ14 NC NC NC B
C VSSQ NC
NC NC
C
D NC NC
NC NC
D
E NC NC
NC NC
E
F VSSQ VDDQ
VSSQ VDDQ
F
G NC NC
A0 NC
G
H NC VSS
VSS VDD
H
J VDD NC
A2 A3
J
K WE# NC
A1 A9
K
L NC RE#
M NC VSS
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VDDQ VSSQ
L
A7 A6
M
N NC VCC
A8 A11 N
P NC NC
VSS VDD
P
R NC VSS
A5 A12
R
T NC VCC
CS1# CS0# T
U I/O1 I/O0
CAS# A4
U
V I/O3 I/O2
BA1 RAS# V
W CE1# LOCK
VSSQ VDDQ
W
Y NC NC I/O6 I/O7 WP# VSS VCC NC NC R/B# VSS A14 CKE1 VDD CKE0 A10 VSS WE# VSSQ NC NC Y
AA NC NC I/O4 I/O5 NC VCC VSS CE0# ALE CLE VDD TQ VSS VDDQ A13 VSSQ VDD BA0 VDDQ NC NC AA
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21
Top View – Ball Down
NAND
LPDDR
Supply
Ground
Note: Contact factory for availability of x16 LPDDR configuration.
PDF: 09005aef8326e5ac / Source: 09005aef8326e59a
152ball_ nand_lpdram_j4xx_omap.fm - Rev. E 4/09 EN
5 Micron Technology, Inc., reserves the right to change products or specifications without notice.
©2008 Micron Technology, Inc. All rights reserved.
Datasheet pdf - http://www.DataSheet4U.co.kr/
5 Page 
Preliminary
152-Ball NAND Flash and Mobile LPDRAM PoP (TI OMAP) MCP
Device Diagrams
Figure 6: 152-Ball Functional Block Diagram (Dual LPDDR)
CE0#
CLE
ALE
RE#
WE#
WP#
NAND Flash
VCC
I/O
R/B#
VSS
CS0#, CS1#
CK
CKE0, CKE1
RAS#
CAS#
WE#
Address,
BA0, BA1
LPDDR
(Die 0 and 1)
www.DataSheet.net/
VDD
VDDQ
DQM
DQ
TQ
VSS
VSSQ
PDF: 09005aef8326e5ac / Source: 09005aef8326e59a
152ball_ nand_lpdram_j4xx_omap.fm - Rev. E 4/09 EN
11
Micron Technology, Inc., reserves the right to change products or specifications without notice.
©2008 Micron Technology, Inc. All rights reserved.
Datasheet pdf - http://www.DataSheet4U.co.kr/
11 Page | ||
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