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PDF AH3 Data sheet ( Hoja de datos )
| Número de pieza | AH3 | |
| Descripción | High Dynamic Range Gain Block | |
| Fabricantes | TriQuint Semiconductor | |
| Logotipo |  |
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Hay una vista previa y un enlace de descarga de AH3 (archivo pdf) en la parte inferior de esta página. Total 7 Páginas | ||
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AH3
High Dynamic Range Gain Block
Applications
• 3G / 4G Mobile Infrastructure
• CDMA, WCDMA, LTE
• IF Applications
Product Features
• 50 – 870 MHz
• +41 dBm OIP3
• 3 dB Noise Figure
• 13 dB Gain
• +20 dBm P1dB
• Internally matched
• Single +5 V Supply
• MTTF > 100 Years
• Lead-free/Green/RoHS-compliant SOT-89 Package
General Description
The AH3 is a high dynamic range amplifier in a low-cost
surface-mount package. The combination of low noise
figure and high output IP3 at the same bias point makes it
ideal for receiver and transmitter applications. The device
combines dependable performance with superb quality to
maintain MTTF values exceeding 100 years at mounting
temperatures of +85 °C. The AH3 is available in the
environmentally-friendly lead-free/green/RoHS-compliant
SOT-89 package.
The broadband amplifier uses a high reliability GaAs
MESFET technology and is targeted for applications
where high linearity is required. In addition, the AH3 is
internally matched for 50 ohms.
SOT-89 Package
Functional Block Diagram
GND
4
1
RF IN
2
GND
3
RF OUT
Pin Configuration
Pin #
1www.DataSheet.net/
2
3
4
Symbol
RF Input
GND
RF Output
GND Paddle
Not Recommended for
New Designs
Recommended Replacement
Part: TQP3M9028
Data Sheet: Rev D 06/05/2012
© 2012 TriQuint Semiconductor, Inc.
Ordering Information
Part No.
AH3-G
Description
High Dynamic Range Amplifier
Standard T/R size = 1000 pieces on a 7” reel.
- 1 of 7 -
Disclaimer: Subject to change without notic
Connecting the Digital World to the Global Network®
Datasheet pdf - http://www.DataSheet4U.co.kr/
1 page  
AH3
High Dynamic Range Gain Block
Pin Description
GND
4
Pin Symbol
1 RF IN
2, 4 GND
3 RF OUT
1
RF IN
2
GND
3
RF OUT
Description
RF Input. Internally DC grounded. No DC blocking capacitor required.
RF/DC Ground. Ensure good solder attach for optimal RF and thermal performance.
RF Output. DC supply input.
Applications Information
PC Board Layout
Circuit Board Material: .062” total thickness with
a .014” FR-4 top RF layer, 4 layers (other layers
added for rigidity), 1 oz copper, 50Ω Microstrip
line details: width = .025”.
The pad pattern shown has been developed and
tested for optimized assembly at TriQuint
Semiconductor. The PCB land pattern has been
developed to accommodate lead and package
tolerances. Since surface mount processes vary
from company to company, careful process
development is recommended.
www.DataSheet.net/
For further technical information, Refer to http://www.triquint.com/prodserv/more_info/default.aspx?prod_id=AH3
Data Sheet: Rev D 06/05/2012
© 2012 TriQuint Semiconductor, Inc.
- 5 of 7 -
Disclaimer: Subject to change without notic
Connecting the Digital World to the Global Network®
Datasheet pdf - http://www.DataSheet4U.co.kr/
5 Page | ||
| Páginas | Total 7 Páginas | |
| PDF Descargar | [ Datasheet AH3.PDF ] | |
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