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F6P02T3 の電気的特性と機能

F6P02T3のメーカーはON Semiconductorです、この部品の機能は「 NTF6P02T3」です。


製品の詳細 ( Datasheet PDF )

部品番号 F6P02T3
部品説明 NTF6P02T3
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F6P02T3 Datasheet, F6P02T3 PDF,ピン配置, 機能
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NTF6P02T3
Power MOSFET
-6.0 Amps, -20 Volts
P–Channel SOT–223
Features
Low RDS(on)
Logic Level Gate Drive
Diode Exhibits High Speed, Soft Recovery
Avalanche Energy Specified
Typical Applications
Power Management in Portables and Battery–Powered Products, i.e.:
Cellular and Cordless Telephones and PCMCIA Cards
http://onsemi.com
–6.0 AMPERES
–20 VOLTS
RDS(on) = 44 mW (Typ.)
P–Channel
D
MAXIMUM RATINGS (TJ = 25°C unless otherwise noted)
Rating
Symbol Value
Drain–to–Source Voltage
VDSS
–20
Gate–to–Source Voltage
VGS ±8.0
Drain Current (Note 1)
– Continuous @ TA = 25°C
– Continuous @ TA = 70°C
– Single Pulse (tp = 10 µs)
ID –10
ID –8.4
IDM –35
Total Power Dissipation @ TA = 25°C
PD 8.3
Operating and Storage Temperature Range
TJ, Tstg –55 to
+150
Unit
Vdc
Vdc
Adc
Apk
W
°C
Single Pulse Drain–to–Source Avalanche
Energy – Starting TJ = 25°C
(VDD = –20 Vdc, VGS = –5.0 Vdc,
IL(pk) = –10 A, L = 3.0 mH, RG = 25W)
EAS 150 mJ
Thermal Resistance
– Junction to Lead (Note 1)
– Junction to Ambient (Note 2)
– Junction to Ambient (Note 3)
RθJL
RθJA
RθJA
°C/W
15
71.4
160
Maximum Lead Temperature for Soldering
Purposes, 1/8from case for 10 seconds
TL 260 °C
1. Steady State.
2. When surface mounted to an FR4 board using 1pad size,
(Cu. Area 1.127 in2), Steady State.
3. When surface mounted to an FR4 board using minimum recommended pad
size, (Cu. Area 0.412 in2), Steady State.
G
S
MARKING
DIAGRAM
1
2
3
4 SOT–223
CASE 318E
STYLE 3
AWW
6P02
A
WW
6P02
= Assembly Location
= Work Week
= Device Code
PIN ASSIGNMENT
4 Drain
123
Gate Drain Source
ORDERING INFORMATION
Device
Package Shipping
NTF6P02T3
SOT–223 4000/Tape & Reel
© Semiconductor Components Industries, LLC, 2002
September, 2002 – Rev. 0
1
Publication Order Number:
NTF6P02T3/D
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1 Page





F6P02T3 pdf, ピン配列
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NTF6P02T3
TYPICAL ELECTRICAL CHARACTERISTICS
12
–10 V
–7.0 V
–5.0 V
9
6
–2.2 V
–2.4 V
–3.2 V
–4.4 V
–2.0 V
TJ = 25°C
–1.8 V
–1.6 V
3
–1.4 V
VGS = –1.2 V
0
01 2 3 4 5 6 7 8 9
–VDS, DRAIN–TO–SOURCE VOLTAGE (VOLTS)
Figure 1. On–Region Characteristics
10
12
VDS –10 V
10
8
6
4
TJ = –55°C
2
TJ = 25°C
0
TJ = 100°C
0 0.5 1 1.5 2 2.5 3
–VGS, GATE–TO–SOURCE VOLTAGE (VOLTS)
Figure 2. Transfer Characteristics
0.2
0.15
ID = –6.0 A
TJ = 25°C
0.08
0.07
TJ = 25°C
0.06
VGS = –2.5 V
0.1
0.05
0
01 2 3 4 5
–VGS, GATE–TO–SOURCE VOLTAGE (VOLTS)
Figure 3. On–Resistance versus
Gate–to–Source Voltage
0.05
0.04
VGS = –4.5 V
0.03
0.02
6 2 4 6 8 10 12 14
–ID, DRAIN CURRENT (AMPS)
Figure 4. On–Resistance versus Drain Current
and Gate Voltage
1.6
ID = –6.0 A
VGS = –4.5 V
1.4
10,000
VGS = 0 V
TJ = 150°C
1.2
1000
1.0
0.8 TJ = 100°C
0.6 100
–50 –25 0 25 50 75 100 125 150
2 4 6 8 10 12 14 16 18 20
TJ, JUNCTION TEMPERATURE (°C)
–VDS, DRAIN–TO–SOURCE VOLTAGE (VOLTS)
Figure 5. On–Resistance Variation with
Temperature
Figure 6. Drain–to–Source Leakage Current
versus Voltage
http://onsemi.com
3
Datasheet
pdf
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3Pages


F6P02T3 電子部品, 半導体
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NTF6P02T3
TYPICAL SOLDER HEATING PROFILE
For any given circuit board, there will be a group of
control settings that will give the desired heat pattern. The
operator must set temperatures for several heating zones
and a figure for belt speed. Taken together, these control
settings make up a heating “profile” for that particular
circuit board. On machines controlled by a computer, the
computer remembers these profiles from one operating
session to the next. Figure 12 shows a typical heating
profile for use when soldering a surface mount device to a
printed circuit board. This profile will vary among
soldering systems, but it is a good starting point. Factors
that can affect the profile include the type of soldering
system in use, density and types of components on the
board, type of solder used, and the type of board or
substrate material being used. This profile shows
temperature versus time. The line on the graph shows the
actual temperature that might be experienced on the surface
of a test board at or near a central solder joint. The two
profiles are based on a high density and a low density
board. The Vitronics SMD310 convection/infrared reflow
soldering system was used to generate this profile. The type
of solder used was 62/36/2 Tin Lead Silver with a melting
point between 177–189°C. When this type of furnace is
used for solder reflow work, the circuit boards and solder
joints tend to heat first. The components on the board are
then heated by conduction. The circuit board, because it has
a large surface area, absorbs the thermal energy more
efficiently, then distributes this energy to the components.
Because of this effect, the main body of a component may
be up to 30 degrees cooler than the adjacent solder joints.
200°C
150°C
100°C
5°C
STEP 1
PREHEAT
ZONE 1
“RAMP”
STEP 2
VENT
“SOAK”
STEP 3
HEATING
ZONES 2 & 5
“RAMP”
STEP 4
HEATING
ZONES 3 & 6
“SOAK”
DESIRED CURVE FOR HIGH
MASS ASSEMBLIES
150°C
160°C
STEP 5 STEP 6 STEP 7
HEATING VENT COOLING
ZONES 4 & 7
“SPIKE”
205° TO 219°C
170°C
PEAK AT
SOLDER
JOINT
100°C
140°C
SOLDER IS LIQUID FOR
40 TO 80 SECONDS
(DEPENDING ON
MASS OF ASSEMBLY)
DESIRED CURVE FOR LOW
MASS ASSEMBLIES
TIME (3 TO 7 MINUTES TOTAL)
Figure 12. Typical Solder Heating Profile
TMAX
http://onsemi.com
6
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部品番号部品説明メーカ
F6P02T3

NTF6P02T3

ON Semiconductor
ON Semiconductor


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