DataSheet.jp

K8A56EZC の電気的特性と機能

K8A56EZCのメーカーはSamsung semiconductorです、この部品の機能は「256Mb C-die NOR FLASH」です。


製品の詳細 ( Datasheet PDF )

部品番号 K8A56EZC
部品説明 256Mb C-die NOR FLASH
メーカ Samsung semiconductor
ロゴ Samsung semiconductor ロゴ 




このページの下部にプレビューとK8A56EZCダウンロード(pdfファイル)リンクがあります。
Total 30 pages

No Preview Available !

K8A56EZC Datasheet, K8A56EZC PDF,ピン配置, 機能
Rev. 1.0, Nov. 2010
K8A56(57)ET(B)(Z)C
256Mb C-die NOR FLASH
16M x16, Synch Burst
Multi Bank SLC NOR Flash
datasheet
SAMSUNG ELECTRONICS RESERVES THE RIGHT TO CHANGE PRODUCTS, INFORMATION AND
SPECIFICATIONS WITHOUT NOTICE.
Products and specifications discussed herein are for reference purposes only. All information discussed
herein is provided on an "AS IS" basis, without warranties of any kind.
This document and all information discussed herein remain the sole and exclusive property of Samsung
Electronics. No license of any patent, copyright, mask work, trademark or any other intellectual property
right is granted by one party to the other party under this document, by implication, estoppel or other-
wise.
Samsung products are not intended for use in life support, critical care, medical, safety equipment, or
similar applications where product failure could result in loss of life or personal or physical harm, or any
military or defense application, or any governmental procurement to which special terms or provisions
may apply.
For updates or additional information about Samsung products, contact your nearest Samsung office.
www.DataSAhlel berta4nUd.cnoammes, trademarks and registered trademarks belong to their respective owners.
2009 Samsung Electronics Co., Ltd. All rights reserved.
-1-

1 Page





K8A56EZC pdf, ピン配列
K8A56(57)15ET(B)(Z)C
datasheet
NOR
FLASH
Rev.
MEMORY
1.0
256Mb C-die NOR FLASH 1
1.0 FEATURES................................................................................................................................................................. 5
2.0 GENERAL DESCRIPTION ......................................................................................................................................... 5
3.0 PIN DESCRIPTION .................................................................................................................................................... 5
4.0 BALL FBGA TOP VIEW (BALL DOWN) ..................................................................................................................... 6
5.0 FUNCTIONAL BLOCK DIAGRAM .............................................................................................................................. 7
6.0 ORDERING INFORMATION ...................................................................................................................................... 8
7.0 PRODUCT INTRODUCTION...................................................................................................................................... 11
8.0 COMMAND DEFINITIONS ......................................................................................................................................... 12
9.0 DEVICE OPERATION ................................................................................................................................................ 14
9.1 Read Mode .............................................................................................................................................................. 14
9.1.1 Asynchronous Read Mode................................................................................................................................ 14
9.1.1.1 Asynchronous Page Read Mode ................................................................................................................ 14
9.1.2 Synchronous (Burst) Read Mode...................................................................................................................... 14
9.1.2.1 Continuous Linear Burst Read.................................................................................................................... 14
9.2 Programmable Wait State ....................................................................................................................................... 15
9.3 Handshaking............................................................................................................................................................ 15
9.4 Set Burst Mode Configuration Register ................................................................................................................... 15
9.4.1 Programmable Wait State Configuration........................................................................................................... 15
9.4.2 Burst Read Mode Setting .................................................................................................................................. 15
9.4.3 RDY Configuration ............................................................................................................................................ 15
9.5 Autoselect Mode...................................................................................................................................................... 17
9.6 Standby Mode ......................................................................................................................................................... 17
9.7 Automatic Sleep Mode ............................................................................................................................................ 17
9.8 Output Disable Mode ............................................................................................................................................... 17
9.9 Block Protection & Unprotection.............................................................................................................................. 17
9.10 Hardware Reset..................................................................................................................................................... 17
9.11 Software Reset ...................................................................................................................................................... 18
9.12 Program ................................................................................................................................................................. 18
9.13 Accelerated Program ............................................................................................................................................. 18
9.14 Write Buffer Programming ..................................................................................................................................... 18
9.15 Accelerated Write Buffer Programming ................................................................................................................. 19
9.16 Chip Erase ............................................................................................................................................................. 19
9.17 Block Erase ........................................................................................................................................................... 19
9.18 Unlock Bypass....................................................................................................................................................... 19
9.19 Erase Suspend / Resume...................................................................................................................................... 20
9.20 Program Suspend / Resume ................................................................................................................................. 20
9.21 Read While Write Operation .................................................................................................................................. 20
9.22 OTP Block Region ................................................................................................................................................. 20
9.23 Low VCC Write Inhibit ........................................................................................................................................... 20
9.24 Write Pulse “Glitch” Protection .............................................................................................................................. 21
9.25 Logical Inhibit......................................................................................................................................................... 21
10.0 FLASH MEMORY STATUS FLAGS ......................................................................................................................... 22
11.0 DEEP POWER DOWN ............................................................................................................................................. 24
12.0 COMMON FLASH MEMORY INTERFACE .............................................................................................................. 25
13.0 ABSOLUTE MAXIMUM RATINGS ..................................................................................................................... 27
14.0 RECOMMENDED OPERATING CONDITIONS ( Voltage reference to GND ) ..................................................... 27
15.0 DC CHARACTERISTICS................................................................................................................................... 28
16.0 CAPACITANCE (TA = 25 °C, VCC = 1.8V, f = 1.0MHz)...................................................................................... 29
www.DataSheet4U.com
17.0 AC TEST CONDITION ...................................................................................................................................... 29
18.0 AC CHARACTERISTICS .......................................................................................................................................... 30
18.1 Synchronous/Burst Read.................................................................................................................................30
18.2 Asynchronous Read ........................................................................................................................................33
18.3 Erase/Program Operation................................................................................................................................37
18.4 Erase/Program Performance ...........................................................................................................................38
-3-


3Pages


K8A56EZC 電子部品, 半導体
K8A56(57)15ET(B)(Z)C
datasheet
NOR
FLASH
Rev.
MEMORY
1.0
4.0 BALL FBGA TOP VIEW (BALL DOWN)
TBD
www.DataSheet4U.com
-6-

6 Page



ページ 合計 : 30 ページ
 
PDF
ダウンロード
[ K8A56EZC データシート.PDF ]


データシートを活用すると、その部品の主な機能と仕様を詳しく理解できます。 ピン構成、電気的特性、動作パラメータ、性能を確認してください。


共有リンク

Link :


部品番号部品説明メーカ
K8A56EZC

256Mb C-die NOR FLASH

Samsung semiconductor
Samsung semiconductor


www.DataSheet.jp    |   2020   |  メール    |   最新    |   Sitemap