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CP160808T-190x の電気的特性と機能

CP160808T-190xのメーカーはTaeJinです、この部品の機能は「Multilayer Chip Beads」です。


製品の詳細 ( Datasheet PDF )

部品番号 CP160808T-190x
部品説明 Multilayer Chip Beads
メーカ TaeJin
ロゴ TaeJin ロゴ 




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CP160808T-190x Datasheet, CP160808T-190x PDF,ピン配置, 機能
Multilayer Chip Beads / CP TYPELarge Current
.Features:
1.Closed magnetic circuit structure allows high density mounting while preventing crosstalk.
2.Extremely high reliability due to entirely monolithic construction.
3.Low DC resistance structure of electrode to prevent wasteful electric power consumption.
4.Hing Current rating up to 6A.
5.The products contain no lead and also support lead-free soldering.
.Applications:
CP type has a large current funtion for power line due to its low DC resistance, it can generate an impedance
down to relative low frequency and cover a wide range of noise suppression.
.Product Identification
PIHD □□□□ □ □□□ □
Tolerance
Inductance
.Shape and Dimension
.Schematic
Dimensions in mm
TYPE
A(mm)
CP160808
1.6±0.2
CP201209
2.0±0.2
CP321611
3.2±0.2
CP451616
4.5±0.2
CP453215
4.5±0.2
.Recommended Reflow
B(mm)
0.8±0.2
1.2±0.2
1.6±0.2
1.6±0.2
3.2±0.2
C(mm)
0.8±0.2
0.9±0.2
1.1±0.2
1.6±0.2
1.5±0.2
D(mm)
0.3±0.2
0.5±0.3
0.5±0.3
0.5±0.3
0.5±0.3
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1 Page





CP160808T-190x pdf, ピン配列
Multilayer Chip Beads / CP TYPELarge Current
Electrical CharacteristicsCP201209 TYPE
Part No.
IMPEDANCE
(±25%)
Test frequency
DCR
() Max
CP201209T-110
11
100 MHZ,200 mV
0.01
CP201209T-130
13
100 MHZ,200 mV
0.02
CP201209T-150
15
100 MHZ,200 mV
0.02
CP201209T-170
17
100 MHZ,200 mV
0.02
CP201209T-190
19
100 MHZ,200 mV
0.02
CP201209T-220
22
100 MHZ,200 mV
0.02
CP201209T-260
26
100 MHZ,200 mV
0.02
CP201209T-280
28
100 MHZ,200 mV
0.02
CP201209T-300
30
100 MHZ,200 mV
0.02
CP201209T-310
31
100 MHZ,200 mV
0.02
CP201209T-320
32
100 MHZ,200 mV
0.02
CP201209T-390
39
100 MHZ,200 mV
0.02
CP201209T-400
40
100 MHZ,200 mV
0.02
CP201209T-420
42
100 MHZ,200 mV
0.025
CP201209T-500
50
100 MHZ,200 mV
0.025
CP201209T-600
60
100 MHZ,200 mV
0.03
CP201209T-700
70
100 MHZ,200 mV
0.04
CP201209T-750
75
100 MHZ,200 mV
0.04
CP201209T-800
80
100 MHZ,200 mV
0.04
CP201209T-900
90
100 MHZ,200 mV
0.04
CP201209T-101
100
100 MHz,200 mV
0.04
CP201209T-121
120
100 MHZ,200 mV
0.04
CP201209T-131
130
100 MHZ,200 mV
0.05
CP201209T-151
150
100 MHZ,200 mV
0.05
CP201209T-181
180
100 MHZ,200 mV
0.05
CP201209T-201
200
100 MHZ,200 mV
0.05
CP201209T-221
220
100 MHZ,200 mV
0.08
CP201209T-241
240
100 MHZ,200 mV
0.08
CP201209T-251
250
100 MHZ,200 mV
0.08
CP201209T-301
300
100 MHZ,200 mV
0.08
CP201209T-331
330
100 MHZ,200 mV
0.08
CP201209T-391
390
100 MHZ,200 mV
0.1
CP201209T-401
400
100 MHZ,200 mV
0.1
CP201209T-451
450
100 MHZ,200 mV
0.1
CP201209T-471
470
100 MHZ,200 mV
0.1
CP201209T-501
500
100 MHZ,200 mV
0.1
CP201209T-601
600
100 MHZ,200 mV
0.1
CP201209T-751
750
100 MHZ,200 mV
0.12
CP201209T-102
1000
100 MHZ,200 mV
0.12
CP201209T-152
1500
100 MHZ,200 mV
0.3
Rate Current
(mA) Max
6000
5000
5000
5000
4000
4000
4000
4000
4000
4000
4000
3000
3000
3000
3000
3000
3000
3000
3000
3000
3000
3000
2500
2500
2500
2500
2000
2000
2000
2000
2000
2000
2000
2000
2000
2000
2000
1500
1500
1000
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3Pages


CP160808T-190x 電子部品, 半導体
Multilayer Chip Beads / CP TYPELarge Current
. Reliability and Test Conditions(可靠性測試條件)
1-1.Mechanical Performance
Item
Specification
Test Method
Flexure Strength
The forces applied on the right Test device shall be soldered on the substrate
conditions must not damage
Substrate Dimension: 100x40x1.6mm
the terminal electrode and the Deflection: 2.0mm
ferrite
Keeping Time: 30sec
*For 100505, substrate dimension is 100x40x0.8mm
Vibration
Test device shall be soldered on the substrate
Oscillation Frequency: 10 to 55 to 10Hz for 1min
Amplitude: 1.5mm
Time: 2hrs for each axis (X, Y & Z), total 6hrs
Resistance to Soldering Heat Appearance: No damage
Pre-heating: 150, 1min
More than 75% of the terminal Solder Composition: Sn/Pb = 63/37
electrode should be covered
Solder Composition: Sn/Ag3.0/Cu0.5(Pb-Free)
with solder. Impedance :
Solder Temperature: 260±5
within ±30% of initial value
Immersion Time: 10±1sec
Solder ability
The electrodes shall be at
Pre-heating: 150, 1min
least 90% covered with new
Solder Composition: Sn/Pb = 63/37
solder coating
Solder Temperature: 220±5
Solder Composition: Sn/Ag3.0/Cu0.5(Pb-Free)
Solder Temperature: 245±5(Pb-Free)
Immersion Time: 4±1sec
Terminal Strength Test
100505 series : 0.2 kg
Test device shall be soldered on the substrate
160808 series : 0.5 kg
201209 series : 1.0 kg
other series : 2.0 kg
BAY/BAQ321609 series:1.5 kg
(Push)
Item
Temperature Cycle
Humidity Resistance
High
Temperature Resistance
Low
Temperature Resistance
Specification
Appearance: No damage
Impedance: within±30% of
initial value
Test Method
One cycle:
Step Temperature () Time (min)
1 -55±3
30
2 25±2
3
3 125±3
30
4 25±2
3
Total: 100cycles
Measured after exposure in the room condition for 24hrs
Temperature: 40±2
Relative Humidity: 90 ~ 95% / Time: 1000hrs
Measured after exposure in the room condition for 24hrs
Temperature: 125±3/ Relative Humidity: 0%
Applied Current: Rated Current /Time: 1000hrs
Measured after exposure in the room condition for 24hrs
Temperature: -55±3
Relative Humidity: 0% / Time: 1000hrs
Measured after exposure in the room condition for 24hrs
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部品番号部品説明メーカ
CP160808T-190x

Multilayer Chip Beads

TaeJin
TaeJin


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