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CP160808T-190xのメーカーはTaeJinです、この部品の機能は「Multilayer Chip Beads」です。 |
部品番号 | CP160808T-190x |
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部品説明 | Multilayer Chip Beads | ||
メーカ | TaeJin | ||
ロゴ | |||
このページの下部にプレビューとCP160808T-190xダウンロード(pdfファイル)リンクがあります。 Total 52 pages
Multilayer Chip Beads / CP TYPE(Large Current)
.Features:
1.Closed magnetic circuit structure allows high density mounting while preventing crosstalk.
2.Extremely high reliability due to entirely monolithic construction.
3.Low DC resistance structure of electrode to prevent wasteful electric power consumption.
4.Hing Current rating up to 6A.
5.The products contain no lead and also support lead-free soldering.
.Applications:
CP type has a large current funtion for power line due to its low DC resistance, it can generate an impedance
down to relative low frequency and cover a wide range of noise suppression.
.Product Identification:
PIHD □□□□ □ □□□ □
Tolerance
Inductance
.Shape and Dimension
.Schematic
Dimensions in mm
TYPE
A(mm)
CP160808
1.6±0.2
CP201209
2.0±0.2
CP321611
3.2±0.2
CP451616
4.5±0.2
CP453215
4.5±0.2
.Recommended Reflow
B(mm)
0.8±0.2
1.2±0.2
1.6±0.2
1.6±0.2
3.2±0.2
C(mm)
0.8±0.2
0.9±0.2
1.1±0.2
1.6±0.2
1.5±0.2
D(mm)
0.3±0.2
0.5±0.3
0.5±0.3
0.5±0.3
0.5±0.3
www.DataSheet.in
1 Page Multilayer Chip Beads / CP TYPE(Large Current)
Electrical Characteristics(CP201209 TYPE)
Part No.
IMPEDANCE
(Ω±25%)
Test frequency
DCR
(Ω) Max
CP201209T-110□
11
100 MHZ,200 mV
0.01
CP201209T-130□
13
100 MHZ,200 mV
0.02
CP201209T-150□
15
100 MHZ,200 mV
0.02
CP201209T-170□
17
100 MHZ,200 mV
0.02
CP201209T-190□
19
100 MHZ,200 mV
0.02
CP201209T-220□
22
100 MHZ,200 mV
0.02
CP201209T-260□
26
100 MHZ,200 mV
0.02
CP201209T-280□
28
100 MHZ,200 mV
0.02
CP201209T-300□
30
100 MHZ,200 mV
0.02
CP201209T-310□
31
100 MHZ,200 mV
0.02
CP201209T-320□
32
100 MHZ,200 mV
0.02
CP201209T-390□
39
100 MHZ,200 mV
0.02
CP201209T-400□
40
100 MHZ,200 mV
0.02
CP201209T-420□
42
100 MHZ,200 mV
0.025
CP201209T-500□
50
100 MHZ,200 mV
0.025
CP201209T-600□
60
100 MHZ,200 mV
0.03
CP201209T-700□
70
100 MHZ,200 mV
0.04
CP201209T-750□
75
100 MHZ,200 mV
0.04
CP201209T-800□
80
100 MHZ,200 mV
0.04
CP201209T-900□
90
100 MHZ,200 mV
0.04
CP201209T-101□
100
100 MHz,200 mV
0.04
CP201209T-121□
120
100 MHZ,200 mV
0.04
CP201209T-131□
130
100 MHZ,200 mV
0.05
CP201209T-151□
150
100 MHZ,200 mV
0.05
CP201209T-181□
180
100 MHZ,200 mV
0.05
CP201209T-201□
200
100 MHZ,200 mV
0.05
CP201209T-221□
220
100 MHZ,200 mV
0.08
CP201209T-241□
240
100 MHZ,200 mV
0.08
CP201209T-251□
250
100 MHZ,200 mV
0.08
CP201209T-301□
300
100 MHZ,200 mV
0.08
CP201209T-331□
330
100 MHZ,200 mV
0.08
CP201209T-391□
390
100 MHZ,200 mV
0.1
CP201209T-401□
400
100 MHZ,200 mV
0.1
CP201209T-451□
450
100 MHZ,200 mV
0.1
CP201209T-471□
470
100 MHZ,200 mV
0.1
CP201209T-501□
500
100 MHZ,200 mV
0.1
CP201209T-601□
600
100 MHZ,200 mV
0.1
CP201209T-751□
750
100 MHZ,200 mV
0.12
CP201209T-102□
1000
100 MHZ,200 mV
0.12
CP201209T-152□
1500
100 MHZ,200 mV
0.3
Rate Current
(mA) Max
6000
5000
5000
5000
4000
4000
4000
4000
4000
4000
4000
3000
3000
3000
3000
3000
3000
3000
3000
3000
3000
3000
2500
2500
2500
2500
2000
2000
2000
2000
2000
2000
2000
2000
2000
2000
2000
1500
1500
1000
www.DataSheet.in
3Pages Multilayer Chip Beads / CP TYPE(Large Current)
. Reliability and Test Conditions(可靠性測試條件)
1-1.Mechanical Performance
Item
Specification
Test Method
Flexure Strength
The forces applied on the right Test device shall be soldered on the substrate
conditions must not damage
Substrate Dimension: 100x40x1.6mm
the terminal electrode and the Deflection: 2.0mm
ferrite
Keeping Time: 30sec
*For 100505, substrate dimension is 100x40x0.8mm
Vibration
Test device shall be soldered on the substrate
Oscillation Frequency: 10 to 55 to 10Hz for 1min
Amplitude: 1.5mm
Time: 2hrs for each axis (X, Y & Z), total 6hrs
Resistance to Soldering Heat Appearance: No damage
Pre-heating: 150℃, 1min
More than 75% of the terminal Solder Composition: Sn/Pb = 63/37
electrode should be covered
Solder Composition: Sn/Ag3.0/Cu0.5(Pb-Free)
with solder. Impedance :
Solder Temperature: 260±5℃
within ±30% of initial value
Immersion Time: 10±1sec
Solder ability
The electrodes shall be at
Pre-heating: 150℃, 1min
least 90% covered with new
Solder Composition: Sn/Pb = 63/37
solder coating
Solder Temperature: 220±5℃
Solder Composition: Sn/Ag3.0/Cu0.5(Pb-Free)
Solder Temperature: 245±5℃(Pb-Free)
Immersion Time: 4±1sec
Terminal Strength Test
100505 series : ≧ 0.2 kg
Test device shall be soldered on the substrate
160808 series : ≧ 0.5 kg
201209 series : ≧ 1.0 kg
other series : ≧ 2.0 kg
BAY/BAQ321609 series:≧ 1.5 kg
(Push)
Item
Temperature Cycle
Humidity Resistance
High
Temperature Resistance
Low
Temperature Resistance
Specification
Appearance: No damage
Impedance: within±30% of
initial value
Test Method
One cycle:
Step Temperature (℃) Time (min)
1 -55±3
30
2 25±2
3
3 125±3
30
4 25±2
3
Total: 100cycles
Measured after exposure in the room condition for 24hrs
Temperature: 40±2℃
Relative Humidity: 90 ~ 95% / Time: 1000hrs
Measured after exposure in the room condition for 24hrs
Temperature: 125±3℃ / Relative Humidity: 0%
Applied Current: Rated Current /Time: 1000hrs
Measured after exposure in the room condition for 24hrs
Temperature: -55±3℃
Relative Humidity: 0% / Time: 1000hrs
Measured after exposure in the room condition for 24hrs
www.DataSheet.in
6 Page | |||
ページ | 合計 : 52 ページ | ||
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部品番号 | 部品説明 | メーカ |
CP160808T-190x | Multilayer Chip Beads | TaeJin |