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EXC28BA221U の電気的特性と機能

EXC28BA221UのメーカーはPanasonic Semiconductorです、この部品の機能は「Chip Bead Array」です。


製品の詳細 ( Datasheet PDF )

部品番号 EXC28BA221U
部品説明 Chip Bead Array
メーカ Panasonic Semiconductor
ロゴ Panasonic Semiconductor ロゴ 




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EXC28BA221U Datasheet, EXC28BA221U PDF,ピン配置, 機能
Chip Bead Array
Type: EXC28B
Chip Bead Array
Features
Space saving
SSOP package (0.5 mm pitch) compatibility
Small size and lightweight
Type: EXC28BB
Suitable for high speed signals (over 50 MHz)
Excellent cross talk characteristics (100 MHz:<-25 dB)
Type: EXC28BA
Reduces waveform ringing noise
Excellent cross talk characteristics (100 MHz:<-30 dB)
Recommended Applications
Small digital equipment such as PCs, printers, HDD,
DVD-ROMs, CD-ROMs, LCDs.
Digital audio and video equipment such as DSC,
DVC, CD Players, DVD Players, MD Players.
Electronic musical instruments, and other digital
equipment.
Explanation of Part Numbers
1234
EXC2
5
8
Product Code
Size
6 7 8 9 10
BB1 2 1
Type Characteristics Nominal Impedance
11 12
U
Form Suffix
Noise Filter
Chip size 1005 mm
x4 Array
Multilayer
B Chip bead
A Ringing Suppression Type
B High Speed Signal Type
The first two digits are
significant figure of
impedance value and the
third one denotes the
number of zeros following
Code
Packing
U Embossed Carrier Taping
Construction
Dimensions in mm (not to scale)
Ferrite Core
A
EF
B
D
C
Inner Conductor
Electrode
Type
(inches) A
Dimensions (mm)
BCDE
Mass
F
(Weight)
[mg/pc.]
EXC28B
(0804)
1.00±0.15
2.0±0.2
0.5±0.1 0.20±0.15 0.5±0.1 0.25±0.10
5.2
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Feb. 2006
www.DataSheet.in

1 Page





EXC28BA221U pdf, ピン配列
Circuit Configuration
87 6 5
8765
12 34
1 2 34
Chip Bead Array
Packaging Methods (Taping)
Standard Quantity
Part Number
Kind of Taping
EXC28B२२२२U
Embossed Carrier Taping
Pitch (P1)
4 mm
Quantity
5000 pcs./reel
Embossed Carrier Taping
Taping Reel
t1
Sprocket hole φ D0
Compartment
A
t2
Chip component
P1 P2 P0
Tape running direction
φC
φD
E
φA
T
Wt
Embossed Carrier Dimensions (mm)
Part Number A B W
EXC28B२२२२U 1.20±0.15 2.25±0.15 8.0±0.2
F E P1
3.5±0.1 1.75±0.10 4.0±0.1
P2
2.0±0.1
P0
4.0±0.1
φD0 t1
t2
1.5±0.1 0.20±0.05 0.9±0.1
Standard Reel Dimensions (mm)
Part Number
EXC28B२२२२U
φA
180–03.0
φB
60.0±1.0
φC
13.0±0.5
φD
21.0±0.8
E
2.0±0.5
W
9.0±0.3
T
11.4±1.5
t
1.2±0.2
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Feb. 2006
www.DataSheet.in


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共有リンク

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部品番号部品説明メーカ
EXC28BA221U

Chip Bead Array

Panasonic Semiconductor
Panasonic Semiconductor


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