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18F4620 の電気的特性と機能

18F4620のメーカーはMicrochip Technologyです、この部品の機能は「PIC18F4620」です。


製品の詳細 ( Datasheet PDF )

部品番号 18F4620
部品説明 PIC18F4620
メーカ Microchip Technology
ロゴ Microchip Technology ロゴ 




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18F4620 Datasheet, 18F4620 PDF,ピン配置, 機能
DataSheet.in
PIC18F2525/2620/4525/4620
Data Sheet
28/40/44-Pin
Enhanced Flash Microcontrollers
with 10-Bit A/D and nanoWatt Technology
2004 Microchip Technology Inc.
Preliminary
DS39626B

1 Page





18F4620 pdf, ピン配列
DataSheet.in
PIC18F2525/2620/4525/4620
28/40/44-Pin Enhanced Flash Microcontrollers with
10-Bit A/D and nanoWatt Technology
Power Managed Modes:
Peripheral Highlights (Continued):
• Run: CPU on, peripherals on
• Idle: CPU off, peripherals on
• Sleep: CPU off, peripherals off
• Idle mode currents down to 2.5 µA typical
• Sleep mode current down to 100 nA typical
• Timer1 Oscillator: 1.8 µA, 32 kHz, 2V
• Watchdog Timer: 1.4 µA, 2V typical
• Two-Speed Oscillator Start-up
Flexible Oscillator Structure:
• Four Crystal modes, up to 40 MHz
• 4x Phase Lock Loop (PLL) – available for crystal
and internal oscillators)
• Two External RC modes, up to 4 MHz
• Two External Clock modes, up to 40 MHz
• Internal oscillator block:
- 8 user selectable frequencies, from 31 kHz to
8 MHz
- Provides a complete range of clock speeds
from 31 kHz to 32 MHz when used with PLL
- User tunable to compensate for frequency drift
• Secondary oscillator using Timer1 @ 32 kHz
• Fail-Safe Clock Monitor
- Allows for safe shutdown if peripheral clock stops
Peripheral Highlights:
• High-current sink/source 25 mA/25 mA
• Three programmable external interrupts
• Four input change interrupts
• Up to 2 Capture/Compare/PWM (CCP) modules,
one with Auto-Shutdown (28-pin devices)
• Enhanced Capture/Compare/PWM (ECCP)
module (40/44-pin devices only):
- One, two or four PWM outputs
- Selectable polarity
- Programmable dead time
- Auto-Shutdown and Auto-Restart
• Master Synchronous Serial Port (MSSP) module
supporting 3-wire SPI™ (all 4 modes) and I2C™
Master and Slave modes
• Enhanced Addressable USART module:
- Supports RS-485, RS-232 and LIN 1.2
- RS-232 operation using internal oscillator
block (no external crystal required)
- Auto-Wake-up on Start bit
- Auto-Baud Detect
• 10-bit, up to 13-channel Analog-to-Digital
Converter module (A/D):
- Auto-acquisition capability
- Conversion available during Sleep
• Dual analog comparators with input multiplexing
• Programmable 16-level High/Low-Voltage
Detection (HLVD) module:
- Supports interrupt on High/Low-Voltage Detection
Special Microcontroller Features:
• C compiler optimized architecture:
- Optional extended instruction set designed to
optimize re-entrant code
• 100,000 erase/write cycle Enhanced Flash
program memory typical
• 1,000,000 erase/write cycle Data EEPROM
memory typical
• Flash/Data EEPROM Retention: 100 years typical
• Self-programmable under software control
• Priority levels for interrupts
• 8 x 8 Single Cycle Hardware Multiplier
• Extended Watchdog Timer (WDT):
- Programmable period from 4 ms to 131s
• Single-supply 5V In-Circuit Serial
Programming™ (ICSP™) via two pins
• In-Circuit Debug (ICD) via two pins
• Wide operating voltage range: 2.0V to 5.5V
• Programmable Brown-out Reset (BOR) with
software enable option
-
Device
Program Memory
Data Memory
Flash # Single-Word SRAM EEPROM
(bytes) Instructions (bytes) (bytes)
I/O
10-bit
A/D (ch)
CCP/
ECCP
(PWM)
MSSP
SPI™
Master
I2C™
Comp.
Timers
8/16-bit
PIC18F2525
PIC18F2620
PIC18F4525
PIC18F4620
48K
64K
48K
64K
24576
32768
24576
32768
3986
3986
3986
3986
1024
1024
1024
1024
25
25
36
36
10
10
13
13
2/0 Y
2/0 Y
1/1 Y
1/1 Y
Y
Y
Y
Y
1
1
1
1
2 1/3
2 1/3
2 1/3
2 1/3
2004 Microchip Technology Inc.
Preliminary
DS39626B-page 1


3Pages


18F4620 電子部品, 半導体
DataSheet.in
PIC18F2525/2620/4525/4620
Table of Contents
1.0 Device Overview .......................................................................................................................................................................... 7
2.0 Oscillator Configurations ............................................................................................................................................................ 23
3.0 Power Managed Modes ............................................................................................................................................................. 33
4.0 Reset .......................................................................................................................................................................................... 41
5.0 Memory Organization ................................................................................................................................................................. 53
6.0 Flash Program Memory .............................................................................................................................................................. 73
7.0 Data EEPROM Memory ............................................................................................................................................................. 83
8.0 8 x 8 Hardware Multiplier............................................................................................................................................................ 89
9.0 Interrupts .................................................................................................................................................................................... 91
10.0 I/O Ports ................................................................................................................................................................................... 105
11.0 Timer0 Module ......................................................................................................................................................................... 123
12.0 Timer1 Module ......................................................................................................................................................................... 127
13.0 Timer2 Module ......................................................................................................................................................................... 133
14.0 Timer3 Module ......................................................................................................................................................................... 135
15.0 Capture/Compare/PWM (CCP) Modules ................................................................................................................................. 139
16.0 Enhanced Capture/Compare/PWM (ECCP) Module................................................................................................................ 147
17.0 Master Synchronous Serial Port (MSSP) Module .................................................................................................................... 161
18.0 Enhanced Universal Synchronous Receiver Transmitter (EUSART) ....................................................................................... 201
19.0 10-Bit Analog-to-Digital Converter (A/D) Module ..................................................................................................................... 223
20.0 Comparator Module.................................................................................................................................................................. 233
21.0 Comparator Voltage Reference Module ................................................................................................................................... 239
22.0 High/Low-Voltage Detect (HLVD)............................................................................................................................................. 243
23.0 Special Features of the CPU .................................................................................................................................................... 249
24.0 Instruction Set Summary .......................................................................................................................................................... 267
25.0 Development Support............................................................................................................................................................... 317
26.0 Electrical Characteristics .......................................................................................................................................................... 323
27.0 DC and AC Characteristics Graphs and Tables ....................................................................................................................... 361
28.0 Packaging Information.............................................................................................................................................................. 363
Appendix A: Revision History............................................................................................................................................................. 371
Appendix B: Device Differences......................................................................................................................................................... 371
Appendix C: Conversion Considerations ........................................................................................................................................... 372
Appendix D: Migration from Baseline to Enhanced Devices.............................................................................................................. 372
Appendix E: Migration from Mid-Range to Enhanced Devices .......................................................................................................... 373
Appendix F: Migration from High-End to Enhanced Devices ............................................................................................................. 373
Index .................................................................................................................................................................................................. 375
On-Line Support................................................................................................................................................................................. 385
Systems Information and Upgrade Hot Line ...................................................................................................................................... 385
Reader Response .............................................................................................................................................................................. 386
PIC18F2525/2620/4525/4620 Product Identification System ............................................................................................................ 387
DS39626B-page 4
Preliminary
2004 Microchip Technology Inc.

6 Page



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部品番号部品説明メーカ
18F4620

PIC18F4620

Microchip Technology
Microchip Technology


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