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PDF RT9715 Data sheet ( Hoja de datos )
| Número de pieza | RT9715 | |
| Descripción | 2A/1.5A/1.1A/0.7A High-Side Power Switches | |
| Fabricantes | RichTek | |
| Logotipo |  |
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Hay una vista previa y un enlace de descarga de RT9715 (archivo pdf) en la parte inferior de esta página. Total 15 Páginas | ||
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www.DataSheet4U.com
RT9715
90mΩ, 2A/1.5A/1.1A/0.7A High-Side Power Switches
with Flag
General Description
The RT9715 is a cost-effective, low-voltage, single
N-MOSFET high-side Power Switch IC for USB application.
Low switch-on resistance (typ. 90mΩ) and low supply
current (typ. 50uA) are realized in this IC.
The RT9715 integrates an over-current protection circuit,
a short fold back circuit, a thermal shutdown circuit and an
under-voltage lockout circuit for overall protection. Besides,
a flag output is available to indicate fault conditions to the
local USB controller. Furthermore, the chip also integrates
an embedded delay function to prevent miss-operation from
happening due to inrush-current. The RT9715 is an ideal
solution for USB power supply and can support flexible
applications since it is available in various packages such
as SOT-23-5, SOP-8, MSOP-8 and WDFN-8L 3x3.
Ordering Information
RT9715
Package Type
B : SOT-23-5
BG : SOT-23-5 (G-Type)
BR : SOT-23-5 (R-Type)
S : SOP-8
F : MSOP-8
QW : WDFN-8L 3x3 (W-Type)
Operating Temperature Range
G : Green (Halogen Free with Commer-
cial Standard)
Output Current/EN Function
A : 2A/Active High
B : 2A/Active Low
C : 1.5A/Active High
D : 1.5A/Active Low
E : 1.1A/Active High
F : 1.1A/Active Low
G : 0.7A/Active High
H : 0.7A/Active Low
Note :
Richtek Green products are :
` RoHS compliant and compatible with the current require-
ments of IPC/JEDEC J-STD-020.
` Suitable for use in SnPb or Pb-free soldering processes.
Features
z 90mΩ (typ.) N-MOSFET Switch
z Operating Range : 2.7V to 5.5V
z Reverse Blocking Current
z Under Voltage Lockout
z Deglitched Fault Report (FLG)
z Thermal Protection with Foldback
z Over Current Protection
z Short Circuit Protection
z UL Approved−E219878
z Nemko Approved−NO49621
z RoHS Compliant and Halogen Free
Applications
z USB Peripherals
z Notebook PCs
Pin Configurations
(TOP VIEW)
VIN EN/EN
VIN
54
5
EN/EN
4
23
VOUT GND FLG
SOT-23-5
VOUT VIN
23
VOUT GND NC
SOT-23-5 (G-Type)
54
23
FLG GND EN/EN
SOT-23-5 (R-Type)
GND
VIN
VIN
EN/EN
2
3
4
8 VOUT
7 VOUT
6 VOUT
5 FLG
SOP-8/MSOP-8
GND
VIN
VIN
EN/EN
1
2
3
4
8 VOUT
7 VOUT
6 VOUT
9 5 FLG
WDFN-8L 3x3
Marking Information
For marking information, contact our sales representative
directly or through a Richtek distributor located in your
area, otherwise visit our website for detail.
DS9715-02 April 2009
www.richtek.com
1
1 page  
Typical Operating Characteristics
On Resistance vs. Input Voltage
108 IOUT = 2A
106
SOP-8
104
102
100
98
96 SOT-23-5
94
92
90
2.7 3.1 3.5 3.9 4.3 4.7 5.1
Input Voltage (V)
5.5
Quiescent Current vs. Input Voltage
60
No Load
58
56
54
52
50
48
46
44
42
40
2.7 3.1 3.5 3.9 4.3 4.7 5.1 5.5
Input Voltage (V)
Shutdown Current vs. Input Voltage
1.0
No Load
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
2.7 3.1 3.5 3.9 4.3 4.7 5.1 5.5
Input Voltage (V)
DS9715-02 April 2009
www.DataSheet4U.com
RT9715
On Resistance vs. Temperature
125 VIN = 5V, IOUT = 2A
120
115
110
105
SOP-8
100
95
SOT-23-5
90
85
80
75
70
-40 -25 -10 5 20 35 50 65
Temperature (°C)
80
Quiescent Current vs. Temperature
60
VIN = 5V,No Load
59
58
57
56
55
54
53
52
51
50
-40 -25 -10 5 20 35 50 65 80 95 110
Temperature (°C)
Shutdown Current vs. Temperature
1.0
VIN = 5V
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
-40 -25 -10
5 20 35 50 65 80
Temperature (°C)
95 110
www.richtek.com
5
5 Page 
maximum power dissipation can be calculated by following
formula :
PD(MAX) = (TJ(MAX) − TA) / θJA
Where TJ(MAX) is the maximum operation junction
temperature 100°C, TA is the ambient temperature and the
θJA is the junction to ambient thermal resistance.
For recommended operating conditions specification of
RT9715, where TJ(MAX) is the maximum junction
temperature of the die (100°C) and TA is the maximum
ambient temperature. The junction to ambient thermal
resistance θJA is layout dependent. For SOT-23-5
packages, the thermal resistance θJA is 250°C/W on the
standard JEDEC 51-3 single-layer thermal test board. And
for SOP-8 and MSOP-8 packages, the thermal resistance
θJA is 160°C/W. The maximum power dissipation at TA =
25°C can be calculated by following formula :
PD(MAX) = (100°C - 25°C) / (250°C/W) = 0.3W for
SOT-23-5 packages
PD(MAX) = (100°C - 25°C) / (160°C/W) = 0.469W for
SOP-8/MSOP-8 packages
PD(MAX) = (100°C - 25°C) / (108°C/W) = 0.694W for
WDFN-8L 3x3 packages
The maximum power dissipation depends on operating
ambient temperature for fixed TJ(MAX) and thermal resistance
θJA. For RT9715 packages, the Figure 2 of derating curves
allows the designer to see the effect of rising ambient
temperature on the maximum power allowed.
0.8
WDFN-8L 3x3
0.7
Single Layer PCB
0.6
0.5 SOP-8/MSOP-8
0.4
SOT-23-5
0.3
0.2
0.1
0
0 10 20 30 40 50 60 70 80 90 100
Ambient Temperature (°C)
Figure 2. Derating Curves for RT9715 Package
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RT9715
PCB Layout Guide
In order to meet the voltage drop, droop, and EMI
requirements, careful PCB layout is necessary. The
following guidelines must be followed :
` Locate the ceramic bypass capacitors as close as
possible to the VIN pins of the RT9715.
` Place a ground plane under all circuitry to lower both
resistance and inductance and improve DC and transient
performance (Use a separate ground and power plans if
possible).
` Keep all VBUS traces as short as possible and use at
least 50-mil, 2 ounce copper for all VBUS traces.
` Avoid vias as much as possible. If vias are necessary,
make them as large as feasible.
` Place cuts in the ground plane between ports to help
reduce the coupling of transients between ports.
` Locate the output capacitor and ferrite beads as close to
the USB connectors as possible to lower impedance
(mainly inductance) between the port and the capacitor
and improve transient load performance.
` Locate the RT9715 as close as possible to the output
port to limit switching noise.
VBUS
The input capacitor should
be placed as close as
possible to the IC.
VOUT
VIN
GND
GND_BUS
FLG
VIN
Figure 3
EN
DS9715-02 April 2009
www.richtek.com
11
11 Page | ||
| Páginas | Total 15 Páginas | |
| PDF Descargar | [ Datasheet RT9715.PDF ] | |
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