HCB3225K-151T50 Datasheet PDF - GANGES TECHNOLOGY
| Part Number | HCB3225K-151T50 | |
| Description | Ferrite Chip Bead | |
| Manufacturers | GANGES TECHNOLOGY | |
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There is a preview and HCB3225K-151T50 download ( pdf file ) link at the bottom of this page. Total 9 Pages | ||
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GANGES TECHNOLOGY
www.DataSheet4U.com
Ferrite Chip Bead
For High Current
Applications
HCB Series
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www.DataShePet44U. .com
Thermal shock
Phase Temperature(℃) Time(min)
1
-55±2℃
30±3
Appearance: no damage.
Impedance: within±30%of initial value.
2
Room Temp.
10~15
3
+125±5℃
30±3
4
Room Temp.
10~15
Measured:5 times
Low temperature storage
test
Appearance: no damage.
Impedance: within±30%of initial value.
Random Vibration Test
Appearance: Cracking, shipping and any other defects harmful to the
characteristics should not be allowed.
Impedance: Within±30% of initial value.
Drop
Drop 10 times on a concrete floor from a height of 75cm
For HCB HPB
Condition for 1 cycle
Step1:-55±2℃ 30±3 min.
Step2:Room temperature 10 to15 min.
Step3:+125±5℃ 30±3 min.
Step4: Room temperature 10 to15 min.
Number of cycles:5
Measured at room temperature after placing
for 2 to 3 hrs.
Temperature:-55±2℃.
Applied current:rated current.
Duration:500±12hrs.
Measured at room temperature after placing
for 2 to 3hrs.
Frequency: 10-55-10Hz for 1 min.
Amplitude: 1.52mm
Directions and times: X, Y, Z directions for 2
hours.
A period of 2 hours in each of 3 mutually
perpendicular directions (Total 6 hours).
a: No mechanical damage
b: Impedance change: ±30%
6. Soldering and Mounting
6-1. Recommended PC Board Pattern
Series
Chip size
Land Patterns For
Reflow Soldering
Type A(mm) B(mm) C(mm) D(mm) L(mm) G(mm) H(mm)
HCB/HPB
1608
2012
3216
3225
4516
4532
1.6±0.15 0.80±0.15 0.80±0.15 0.30±0.2
2.0±0.20 1.25±0.20 0.85±0.20 0.50±0.3
3.2±0.20 1.60±0.20 1.10±0.20 0.50±0.3
3.2±0.20 2.50±0.20 1.30±0.20 0.50±0.3
4.5±0.20 1.60±0.20 1.60±0.20 0.50±0.3
4.5±0.20 3.20±0.20 1.50±0.20 0.50±0.3
2.60
3.00
4.40
4.40
5.70
5.90
0.60
1.00
2.20
2.20
2.70
2.57
0.80
1.00
1.40
3.40
1.40
4.22
L
G
PC board should be designed so that
products are not sufficient under
mechanical stress as warping the
board.
Products shall be positioned in the
sideway direction against the
mechanical stress to prevent failure.
6-2. Soldering
Mildly activated rosin fluxes are preferred. The minimum amount of solder can lead to damage from the stresses caused
by the difference in coefficients of expansion between solder, chip and substrate. YOSONIC terminations are suitable for
all wave and re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of
hot air soldering tools.
6-2.1 Solder re-flow:
Recommended temperature profiles for re-flow soldering in Figure 1.
6-2.2 Solder Wave:
Wave soldering is perhaps the most rigorous of surface mount soldering processes due to the steep rise in temperature
seen by the circuit when immersed in the molten solder wave , typical at 240℃. Due to the risk of thermal damage to
products, wave soldering of large size products is discouraged. Recommended temperature profile for wave soldering is
shown in Figure 2.
6-2.3 Soldering Iron(Figure 3):
Products attachment with a soldering iron is discouraged due to the inherent process control limitations. In the event that
a soldering iron must be employed the following precautions are recommended.
‧Preheat circuit and products to 150℃ ‧Never contact the ceramic with the iron tip
‧Use a 20 watt soldering iron with tip diameter of 1.0mm
‧280℃ tip temperature (max)
‧1.0mm tip diameter (max)
‧Limit soldering time to 3 sec.
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| Information | Total 9 Pages | |
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