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PDF IXDF604 Data sheet ( Hoja de datos )
| Número de pieza | IXDF604 | |
| Descripción | 4-Ampere Dual Low-Side Ultrafast MOSFET Drivers | |
| Fabricantes | Clare | |
| Logotipo |  |
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Hay una vista previa y un enlace de descarga de IXDF604 (archivo pdf) en la parte inferior de esta página. Total 13 Páginas | ||
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IXD_604www.DataSheet4U.com
4-Ampere Dual Low-Side
Ultrafast MOSFET Drivers
Features
• 4A Peak Source/Sink Drive Current
• Wide Operating Voltage Range: 4.5V to 35V
• -40°C to +125°C Extended Operating Temperature
Range
• Logic Input Withstands Negative Swing of up to 5V
• Matched Rise and Fall Times
• Low Propagation Delay Time
• Low, 10μA Supply Current
• Low Output Impedance
Applications
• Efficient Power MOSFET and IGBT Switching
• Switch Mode Power Supplies
• Motor Controls
• DC to DC Converters
• Class-D Switching Amplifiers
• Pulse Transformer Driver
Description
The IXDD604/IXDF604/IXDI604/IXDN604 dual
high-speed gate drivers are especially well suited for
driving the latest IXYS MOSFETs and IGBTs. Each of
the two outputs can source and sink 4A of peak
current while producing voltage rise and fall times of
less than 10ns. The input of each driver is virtually
immune to latch up, and proprietary circuitry
eliminates cross conduction and current
“shoot-through.” Low propagation delay and fast,
matched rise and fall times make the
IXDD604/IXDF604/IXDI604/ IXDN604 ideal for
high-frequency and high-power applications.
The IXDD604 is a dual non-inverting driver with an
enable. The IXDN604 is a dual non-inverting driver,
the IXDI604 is a dual inverting driver, and the IXDF604
has one inverting driver and one non-inverting driver.
Pb
RoHS
2002/95/EC
e3
The IXDD604/IXDF604/IXDI604/IXDN604 family is
available in a standard 8-lead DIP (PI), 8-lead SOIC
(SIA), 8-lead SOIC with an exposed grounded metal
back (SI), and an 8-lead DFN (D2) package.
Ordering Information
Part Number
IXDD604D2TR
IXDD604PI
IXDD604SI
IXDD604SITR
IXDD604SIA
IXDD604SIATR
IXDF604PI
IXDF604SI
IXDF604SITR
IXDF604SIA
IXDF604SIATR
IXDI604PI
IXDI604SI
IXDI604SITR
IXDI604SIA
IXDI604SIATR
IXDN604PI
IXDN604SI
IXDN604SITR
IXDN604SIA
IXDN604SIATR
Logic
Configuration
ENA
INA
ENB
INB
A
B
OUTA
OUTB
INA A
OUTA
INB B
OUTB
INA A
OUTA
INB B
OUTB
INA A
OUTA
INB B
OUTB
Package Type
8-Lead DFN
8-Lead DIP
8-Lead SOIC with Exposed, Grounded Metal Back
8-Lead SOIC with Exposed, Grounded Metal Back
8-Lead SOIC
8-Lead SOIC
8-Lead DIP
8-Lead SOIC with Exposed, Grounded Metal Back
8-Lead SOIC with Exposed, Grounded Metal Back
8-Lead SOIC
8-Lead SOIC
8-Lead DIP
8-Lead SOIC with Exposed, Grounded Metal Back
8-Lead SOIC with Exposed, Grounded Metal Back
8-Lead SOIC
8-Lead SOIC
8-Lead DIP
8-Lead SOIC with Exposed, Grounded Metal Back
8-Lead SOIC with Exposed, Grounded Metal Back
8-Lead SOIC
8-Lead SOIC
Packing
Method
Tape & Reel
Tube
Tube
Tape & Reel
Tube
Tape & Reel
Tube
Tube
Tape & Reel
Tube
Tape & Reel
Tube
Tube
Tape & Reel
Tube
Tape & Reel
Tube
Tube
Tape & Reel
Tube
Tape & Reel
Quantity
2000
50
100
2000
100
2000
50
100
2000
100
2000
50
100
2000
100
2000
50
100
2000
100
2000
DS-IXD_604 - R00C
PRELIMINARY
1
1 page  
www.DataSheet4U.com
IXD_604
1.6 Electrical Characteristics
Test Conditions: TA=-40°C to +125°C, 4.5V < VCC < 35V, TJ<150°C, one channel (unless otherwise noted).
Parameter
Input Voltage, High
Input Voltage, Low
Input Voltage Range
Input Current
Output Voltage, High
Output Voltage, Low
Output Resistance, High State
Output Resistance, Low State
Output Current, Continuous
Rise Time
Fall Time
On-Time Propagation Delay
Off-Time Propagation Delay
Enable to Output-High Delay Time
Disable to High Impedance State Delay Time
Power Supply Current
Conditions
4.5V < VCC < 18V
4.5V < VCC < 18V
-
0V < VIN < VCC
-
-
VCC=18V, IOUT=-10mA
VCC=18V, IOUT=10mA
Limited by package power
dissipation
CLOAD=1000pF, VCC=18V
CLOAD=1000pF, VCC=18V
CLOAD=1000pF, VCC=18V
CLOAD=1000pF, VCC=18V
IXDD604 only
IXDD604 only
VCC=18V, VIN=3.5V
VCC=18V, VIN=0V
VCC=18V, VIN=VCC
Symbol
VIH
VIL
VIN
IIN
VOH
VOL
ROH
ROL
IDC
tR
tF
tONDLY
tOFFDLY
tENOH
tDOLD
ICC
Minimum Typical Maximum Units
3.1 - -
- - 0.65 V
-5 - VCC+0.3
-10
VCC-0.025
-
-
-
-
10
-
0.025
μA
V
- - 3Ω
- - 2.5
- - ±1 A
- - 16
- - 14
- - 65
ns
- - 65
- - 65
- - 65
- 1 3.5 mA
- - 150
μA
- - 150
1.7 Thermal Characteristics
Package
IXDD604D2 (8-Lead DFN)
IXD_604PI (8-Lead DIP)
IXD_604SI (8-Lead SOIC with Exposed, Grounded Metal Back)
IXD_604SIA (8-Lead SOIC)
Parameter
θJA
Rating
35
125
85
120
Units
°C/W
R00C
PRELIMINARY
5
5 Page 
4 Manufacturing Information
www.DataSheet4U.com
IXD_604
4.1 Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. Clare classified
all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint
industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our
products to the maximum conditions set forth in the standard, and guarantee proper operation of our
devices when handled according to the limitations and information in that standard as well as to any limitations set
forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to
the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device
IXDD604D2
IXD_604PI/SI/SIA
Moisture Sensitivity Level (MSL) Rating
MSL 3
MSL 1
4.2 ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard
JESD-625.
4.3 Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020
must be observed.
Device
IXD_604SI/SIA/D2
IXD_604PI
Maximum Temperature x Time
260°C for 30 seconds
250°C for 30 seconds
4.4 Board Wash
Clare recommends the use of no-clean flux formulations. However, board washing to remove flux residue is
acceptable. Since Clare employs the use of silicone coating as an optical waveguide in many of its optically isolated
products, the use of a short drying bake could be necessary if a wash is used after solder reflow processes.
Chlorine-based or Fluorine-based solvents or fluxes should not be used. Cleaning methods that employ ultrasonic
energy should not be used.
Pb
RoHS
2002/95/EC
e3
R00C
PRELIMINARY
11
11 Page | ||
| Páginas | Total 13 Páginas | |
| PDF Descargar | [ Datasheet IXDF604.PDF ] | |
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