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PDF PIC18F4X1X Data sheet ( Hoja de datos )
| Número de pieza | PIC18F4X1X | |
| Descripción | 28/40/44-Pin Flash Microcontrollers | |
| Fabricantes | Microchip Technology | |
| Logotipo |  |
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PIC18F2X1X/4X1X
28/40/44-Pin Flash Microcontrollers with
10-Bit A/D and nanoWatt Technology
Power-Managed Modes:
• Run: CPU On, Peripherals On
• Idle: CPU Off, Peripherals On
• Sleep: CPU Off, Peripherals Off
• Idle mode Currents Down to 3.0 μA Typical
• Sleep mode Currents Down to 20 nA Typical
• Timer1 Oscillator: 1.8 μA, 32 kHz, 2V
• Watchdog Timer: 2.1 μA
• Two-Speed Oscillator Start-up
Peripheral Highlights:
• High-Current Sink/Source 25 mA/25 mA
• Up to 2 Capture/Compare/PWM (CCP) modules,
One with Auto-Shutdown (28-pin devices)
• Enhanced Capture/Compare/PWM (ECCP)
module (40/44-pin devices only):
- One, two or four PWM outputs
- Selectable polarity
- Programmable dead time
- Auto-shutdown and auto-restart
• Master Synchronous Serial Port (MSSP) module
Supporting 3-Wire SPI (all 4 modes) and I2C™
Master and Slave modes
• Enhanced Addressable USART module:
- Supports RS-485, RS-232 and LIN 1.2
- RS-232 operation using internal oscillator
block (no external crystal required)
- Auto-wake-up on Start bit
- Auto-Baud Detect
• 10-Bit, Up to 13-Channel Analog-to-Digital
Converter module (A/D):
- Auto-acquisition capability
- Conversion available during Sleep
• Dual Analog Comparators with Input Multiplexing
• Programmable 16-Level High/Low-Voltage
Detection (HLVD) module:
- Supports interrupt on High/Low-Voltage Detection
Flexible Oscillator Structure:
• Four Crystal modes, Up to 40 MHz
• 4x Phase Lock Loop (PLL) – Available for Crystal
and Internal Oscillators
• Two External RC modes, Up to 4 MHz
• Two External Clock modes, Up to 40 MHz
• Internal Oscillator Block:
- 8 user-selectable frequencies, from 31 kHz to
8 MHz
- Provides a complete range of clock speeds
from 31 kHz to 32 MHz when used with PLL
- User-tunable to compensate for frequency drift
• Secondary Oscillator using Timer1 @ 32 kHz
• Fail-Safe Clock Monitor:
- Allows for safe shutdown if peripheral clock stops
Special Microcontroller Features:
• C Compiler Optimized Architecture:
- Optional extended instruction set designed to
optimize re-entrant code
• 100,000 Erase/Write Cycle Flash Program
Memory Typical
• Three Programmable External Interrupts
• Four Input Change Interrupts
• Priority Levels for Interrupts
• 8 x 8 Single-Cycle Hardware Multiplier
• Extended Watchdog Timer (WDT):
- Programmable period from 4 ms to 131s
• Single-Supply 5V In-Circuit Serial
Programming™ (ICSP™) via Two Pins
• In-Circuit Debug (ICD) via Two Pins
• Wide Operating Voltage Range: 2.0V to 5.5V
• Programmable Brown-out Reset (BOR) with
Software Enable Option
© 2009 Microchip Technology Inc.
DS39636D-page 3
1 page  
PIC18F2X1X/4X1X
www.DataSheet4U.com
Table of Contents
1.0 Device Overview .......................................................................................................................................................................... 9
2.0 Oscillator Configurations ............................................................................................................................................................ 25
3.0 Power-Managed Modes ............................................................................................................................................................. 35
4.0 Reset .......................................................................................................................................................................................... 43
5.0 Memory Organization ................................................................................................................................................................. 55
6.0 Flash Program Memory.............................................................................................................................................................. 77
7.0 8 x 8 Hardware Multiplier............................................................................................................................................................ 81
8.0 Interrupts .................................................................................................................................................................................... 83
9.0 I/O Ports ..................................................................................................................................................................................... 97
10.0 Timer0 Module ......................................................................................................................................................................... 115
11.0 Timer1 Module ......................................................................................................................................................................... 119
12.0 Timer2 Module ......................................................................................................................................................................... 125
13.0 Timer3 Module ......................................................................................................................................................................... 127
14.0 Capture/Compare/PWM (CCP) Modules ................................................................................................................................. 131
15.0 Enhanced Capture/Compare/PWM (ECCP) Module................................................................................................................ 139
16.0 Master Synchronous Serial Port (MSSP) Module .................................................................................................................... 153
17.0 Enhanced Universal Synchronous Receiver Transmitter (EUSART)....................................................................................... 193
18.0 10-Bit Analog-to-Digital Converter (A/D) Module ..................................................................................................................... 213
19.0 Comparator Module.................................................................................................................................................................. 223
20.0 Comparator Voltage Reference Module................................................................................................................................... 229
21.0 High/Low-Voltage Detect (HLVD)............................................................................................................................................. 233
22.0 Special Features of the CPU.................................................................................................................................................... 239
23.0 Instruction Set Summary .......................................................................................................................................................... 259
24.0 Development Support............................................................................................................................................................... 309
25.0 Electrical Characteristics .......................................................................................................................................................... 313
26.0 DC and AC Characteristics Graphs And Tables ...................................................................................................................... 351
27.0 Packaging Information.............................................................................................................................................................. 353
Appendix A: Revision History............................................................................................................................................................. 361
Appendix B: Device Differences ........................................................................................................................................................ 361
Appendix C: Conversion Considerations ........................................................................................................................................... 362
Appendix D: Migration From Baseline to Enhanced Devices ............................................................................................................ 362
Appendix E: Migration From Mid-Range to Enhanced Devices ......................................................................................................... 363
Appendix F: Migration From High-End to Enhanced Devices............................................................................................................ 363
Index ................................................................................................................................................................................................. 365
The Microchip Web Site ..................................................................................................................................................................... 375
Customer Change Notification Service .............................................................................................................................................. 375
Customer Support .............................................................................................................................................................................. 375
Reader Response .............................................................................................................................................................................. 376
PIC18F2X1X/4X1X Product Identification System............................................................................................................................. 377
© 2009 Microchip Technology Inc.
DS39636D-page 7
5 Page 
PIC18F2X1X/4X1X
www.DataSheet4U.com
FIGURE 1-1:
PIC18F2410/2415/2510/2515/2610 (28-PIN) BLOCK DIAGRAM
Table Pointer<21>
Data Bus<8>
inc/dec logic
21
20
88
PCLATU PCLATH
PCU PCH PCL
Program Counter
Address Latch
Program Memory
(16/32/48/64
Kbytes)
Data Latch
31 Level Stack
STKPTR
8
Table Latch
ROM Latch
Instruction Bus <16>
IR
Data Latch
Data Memory
(.7, 1.5, 3.9
Kbytes)
Address Latch
12
Data Address<12>
4
BSR
12
FSR0
FSR1
FSR2
4
Access
Bank
12
inc/dec
logic
Address
Decode
PORTA
RA0/AN0
RA1/AN1
RA2/AN2/VREF-/CVREF
RA3/AN3/VREF+
RA4/T0CKI/C1OUT
RA5/AN4/SS/HLVDIN/C2OUT
OSC2/CLKO(3)/RA6
OSC1/CLKI(3)/RA7
PORTB
RB0/INT0/FLT0/AN12
RB1/INT1/AN10
RB2/INT2/AN8
RB3/AN9/CCP2(1)
RB4/KBI0/AN11
RB5/KBI1/PGM
RB6/KBI2/PGC
RB7/KBI3/PGD
OSC1(3)
OSC2(3)
T1OSI
T1OSO
MCLR(2)
VDD, VSS
Instruction
Decode and
Control
State Machine
Control Signals
8
PRODH PRODL
Internal
Oscillator
Block
INTRC
Oscillator
8 MHz
Oscillator
Single-Supply
Programming
In-Circuit
Debugger
Power-up
Timer
Oscillator
Start-up Timer
Power-on
Reset
Watchdog
Timer
Brown-out
Reset
Fail-Safe
Clock Monitor
3
BITOP
8
8 x 8 Multiply
8
W
88
8
ALU<8>
8
8
Precision
Band Gap
Reference
PORTC
PORTE
RC0/T1OSO/T13CKI
RC1/T1OSI/CCP2(1)
RC2/CCP1
RC3/SCK/SCL
RC4/SDI/SDA
RC5/SDO
RC6/TX/CK
RC7/RX/DT
MCLR/VPP/RE3(2)
BOR
HLVD
Timer0
Timer1
Timer2
Timer3
Comparator
CCP1
CCP2
MSSP
EUSART
ADC
10-bit
Note
1:
2:
3:
CCP2 is multiplexed with RC1 when Configuration bit, CCP2MX, is set, or RB3 when CCP2MX is not set.
RE3 is only available when MCLR functionality is disabled.
OSC1/CLKI and OSC2/CLKO are only available in select oscillator modes and when these pins are not being used as digital I/O.
Refer to Section 2.0 “Oscillator Configurations” for additional information.
© 2009 Microchip Technology Inc.
DS39636D-page 13
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