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UPD70F3702 の電気的特性と機能

UPD70F3702のメーカーはNEC Electronicsです、この部品の機能は「32-Bit Single-Chip Microcontrollers」です。


製品の詳細 ( Datasheet PDF )

部品番号 UPD70F3702
部品説明 32-Bit Single-Chip Microcontrollers
メーカ NEC Electronics
ロゴ NEC Electronics ロゴ 




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UPD70F3702 Datasheet, UPD70F3702 PDF,ピン配置, 機能
Preliminary User’s Manual
www.DataSheet4U.com
V850ES/HF2
32-Bit Single-Chip Microcontrollers
Hardware
µPD70F3702
µPD70F3703
µPD70F3704
Document No. U17719EJ1V0UD00 (1st edition)
Date Published December 2005 N CP(K)
Printed in Japan
2005

1 Page





UPD70F3702 pdf, ピン配列
NOTES FOR CMOS DEVICES
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1 VOLTAGE APPLICATION WAVEFORM AT INPUT PIN
Waveform distortion due to input noise or a reflected wave may cause malfunction. If the input of the
CMOS device stays in the area between VIL (MAX) and VIH (MIN) due to noise, etc., the device may
malfunction. Take care to prevent chattering noise from entering the device when the input level is fixed,
and also in the transition period when the input level passes through the area between VIL (MAX) and
VIH (MIN).
2 HANDLING OF UNUSED INPUT PINS
Unconnected CMOS device inputs can be cause of malfunction. If an input pin is unconnected, it is
possible that an internal input level may be generated due to noise, etc., causing malfunction. CMOS
devices behave differently than Bipolar or NMOS devices. Input levels of CMOS devices must be fixed
high or low by using pull-up or pull-down circuitry. Each unused pin should be connected to VDD or GND
via a resistor if there is a possibility that it will be an output pin. All handling related to unused pins must
be judged separately for each device and according to related specifications governing the device.
3 PRECAUTION AGAINST ESD
A strong electric field, when exposed to a MOS device, can cause destruction of the gate oxide and
ultimately degrade the device operation. Steps must be taken to stop generation of static electricity as
much as possible, and quickly dissipate it when it has occurred. Environmental control must be
adequate. When it is dry, a humidifier should be used. It is recommended to avoid using insulators that
easily build up static electricity. Semiconductor devices must be stored and transported in an anti-static
container, static shielding bag or conductive material. All test and measurement tools including work
benches and floors should be grounded. The operator should be grounded using a wrist strap.
Semiconductor devices must not be touched with bare hands. Similar precautions need to be taken for
PW boards with mounted semiconductor devices.
4 STATUS BEFORE INITIALIZATION
Power-on does not necessarily define the initial status of a MOS device. Immediately after the power
source is turned ON, devices with reset functions have not yet been initialized. Hence, power-on does
not guarantee output pin levels, I/O settings or contents of registers. A device is not initialized until the
reset signal is received. A reset operation must be executed immediately after power-on for devices
with reset functions.
5 POWER ON/OFF SEQUENCE
In the case of a device that uses different power supplies for the internal operation and external
interface, as a rule, switch on the external power supply after switching on the internal power supply.
When switching the power supply off, as a rule, switch off the external power supply and then the
internal power supply. Use of the reverse power on/off sequences may result in the application of an
overvoltage to the internal elements of the device, causing malfunction and degradation of internal
elements due to the passage of an abnormal current.
The correct power on/off sequence must be judged separately for each device and according to related
specifications governing the device.
6 INPUT OF SIGNAL DURING POWER OFF STATE
Do not input signals or an I/O pull-up power supply while the device is not powered. The current
injection that results from input of such a signal or I/O pull-up power supply may cause malfunction and
the abnormal current that passes in the device at this time may cause degradation of internal elements.
Input of signals during the power off state must be judged separately for each device and according to
related specifications governing the device.
Preliminary User’s Manual U17719EJ1V0UD
3


3Pages


UPD70F3702 電子部品, 半導体
Conventions
Data significance:
Active low representation:
Memory map address:
Note:
Caution:
Remark:
Numeric representation:
Prefix indicating power of 2
(address space, memory
capacity):
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Higher digits on the left and lower digits on the right
xxx (overscore over pin or signal name)
Higher addresses on the top and lower addresses on
the bottom
Footnote for item marked with Note in the text
Information requiring particular attention
Supplementary information
Binary ... xxxx or xxxxB
Decimal ... xxxx
Hexadecimal ... xxxxH
K (kilo): 210 = 1,024
M (mega): 220 = 1,0242
G (giga): 230 = 1,0243
6 Preliminary User’s Manual U17719EJ1V0UD

6 Page



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共有リンク

Link :


部品番号部品説明メーカ
UPD70F3700

32-Bit Single-Chip Microcontrollers

NEC Electronics
NEC Electronics
UPD70F3701

32-Bit Single-Chip Microcontrollers

NEC Electronics
NEC Electronics
UPD70F3702

32-Bit Single-Chip Microcontrollers

NEC Electronics
NEC Electronics
UPD70F3703

32-Bit Single-Chip Microcontrollers

NEC Electronics
NEC Electronics


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