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IS42S16400F PDF Datasheet ( 特性, スペック, ピン接続図 )

部品番号 IS42S16400F
部品説明 1 Meg Bits x 16 Bits x 4 Banks (64-MBIT) SYNCHRONOUS DYNAMIC RAM
メーカ Integrated Silicon Solution
ロゴ Integrated Silicon Solution ロゴ 



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IS42S16400F Datasheet, IS42S16400F PDF,ピン配置, 機能
IS42S16400F
IS45S16400F
1 Meg Bits x 16 Bits x 4 Banks (64-MBIT)
SYNCHRONOUS DYNAMIC RAM
www.DataSheet4U.com
NOVEMBER 2009
FEATURES
Clock frequency: 200, 166, 143, 133 MHz
• Fully synchronous; all signals referenced to a
positive clock edge
• Internal bank for hiding row access/precharge
• Single 3.3V power supply
• LVTTL interface
• Programmable burst length
– (1, 2, 4, 8, full page)
• Programmable burst sequence:
Sequential/Interleave
• Self refresh modes
• Auto refresh (CBR)
• 4096 refresh cycles every 64 ms (Com, Ind, A1
grade) or 16ms (A2 grade)
• Random column address every clock cycle
• Programmable CAS latency (2, 3 clocks)
• Burst read/write and burst read/single write
operations capability
• Burst termination by burst stop and precharge
command
OPTIONS
• Package:
54-pin TSOP II
54-ball FBGA (8mm x 8mm)
• Operating Temperature Range
Commercial (0oC to +70oC)
Industrial (-40oC to +85oC)
Automotive Grade A1 (-40oC to +85oC)
Automotive Grade A2 (-40oC to +105oC)
OVERVIEW
ISSI's 64Mb Synchronous DRAM is organized as 1,048,576
bits x 16-bit x 4-bank for improved performance. The
synchronous DRAMs achieve high-speed data transfer
using pipeline architecture. All inputs and outputs signals
refer to the rising edge of the clock input.
KEY TIMING PARAMETERS
Parameter
Clk Cycle Time
CAS Latency = 3
CAS Latency = 2
Clk Frequency
CAS Latency = 3
CAS Latency = 2
Access Time from Clock
CAS Latency = 3
CAS Latency = 2
-5 -6
5 6
7.5 7.5
200 166
133 133
5 5.4
6 6
-7 Unit
7 ns
7.5 ns
143 Mhz
133 Mhz
5.4 ns
6 ns
ADDRESS TABLE
Parameter
4M x 16
Configuration
1M x 16 x 4
banks
Refresh Count
Com./Ind.
A1
A2
4K/64ms
4K/64ms
4K/16ms
Row Addresses
A0-A11
Column Addresses
A0-A7
Bank Address Pins
BA0, BA1
Auto Precharge Pins
A10/AP
Copyright © 2006 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time without notice. ISSI assumes no
liability arising out of the application or use of any information, products or services described herein. Customers are advised to obtain the latest version of this device specification before relying on
any published information and before placing orders for products.
Integrated Silicon Solution, Inc. — www.issi.com
Rev. F
11/09/09
1

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