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IS42VS16100C1 の電気的特性と機能

IS42VS16100C1のメーカーはIntegrated Silicon Solutionです、この部品の機能は「512K Words x 16 Bits x 2 Banks (16-MBIT) SYNCHRONOUS DYNAMIC RAM」です。


製品の詳細 ( Datasheet PDF )

部品番号 IS42VS16100C1
部品説明 512K Words x 16 Bits x 2 Banks (16-MBIT) SYNCHRONOUS DYNAMIC RAM
メーカ Integrated Silicon Solution
ロゴ Integrated Silicon Solution ロゴ 




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IS42VS16100C1 Datasheet, IS42VS16100C1 PDF,ピン配置, 機能
IS42VS16100C1
ISSI®
www.DataSheet4U.com
512K Words x 16 Bits x 2 Banks (16-MBIT)
SYNCHRONOUS DYNAMIC RAM
ADVANCED INFORMATION
APRIL 2005
FEATURES
DESCRIPTION
• Clock frequency: 100 MHz
• Fully synchronous; all signals referenced to a
positive clock edge
• Two banks can be operated simultaneously and
independently
• Dual internal bank controlled by A11
(bank select)
• Single 1.8V power supply
ISSI’s 16Mb Synchronous DRAM IS42VS16100C1 is
organized as a 524,288-word x 16-bit x 2-bank for
improved performance. The synchronous DRAMs
achieve high-speed data transfer using pipeline
architecture. All inputs and outputs signals refer to the
rising edge of the clock input.
PIN CONFIGURATIONS
50-Pin TSOP (Type II)
• LVTTL interface
• Programmable burst length
– (1, 2, 4, 8, full page)
• Programmable burst sequence:
Sequential/Interleave
• 2048 refresh cycles every 32 ms
• Random column address every clock cycle
• Programmable CAS latency (2, 3 clocks)
• Burst read/write and burst read/single write
operations capability
• Burst termination by burst stop and
precharge command
• Byte controlled by LDQM and UDQM
• Package 400-mil 50-pin TSOP II
• Lead-free package option
VDD
DQ0
DQ1
GNDQ
DQ2
DQ3
VDDQ
DQ4
DQ5
GNDQ
DQ6
DQ7
VDDQ
LDQM
WE
CAS
RAS
CS
A11
A10
A0
A1
A2
A3
VDD
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
50 GND
49 DQ15
48 IDQ14
47 GNDQ
46 DQ13
45 DQ12
44 VDDQ
43 DQ11
42 DQ10
41 GNDQ
40 DQ9
39 DQ8
38 VDDQ
37 NC
36 UDQM
35 CLK
34 CKE
33 NC
32 A9
31 A8
30 A7
29 A6
28 A5
27 A4
26 GND
PIN DESCRIPTIONS
A0-A11
A0-A10
A11
A0-A7
DQ0 to DQ15
CLK
CKE
CS
RAS
Address Input
Row Address Input
Bank Select Address
Column Address Input
Data DQ
System Clock Input
Clock Enable
Chip Select
Row Address Strobe Command
CAS
WE
LDQM
UDQM
VDD
GND
VDDQ
GNDQ
NC
Column Address Strobe Command
Write Enable
Lower Bye, Input/Output Mask
Upper Bye, Input/Output Mask
Power
Ground
Power Supply for DQ Pin
Ground for DQ Pin
No Connection
Copyright © 2005 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time
without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to
obtain the latest version of this device specification before relying on any published information and before placing orders for products.
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774
Rev. 00A
04/15/05
1

1 Page





IS42VS16100C1 pdf, ピン配列
IS42VS16100C1
FUNCTIONAL BLOCK DIAGRAM
ISSI ®
www.DataSheet4U.com
CLK
CKE
CS COMMAND
RAS DECODER
CAS &
WE CLOCK
A11 GENERATOR
MODE
REGISTER
11
A10
A9
REFRESH
SELF
A8
CONTROLLER
REFRESH
A7 CONTROLLER
A6
A5 REFRESH
A4 COUNTER
A3
A2
A1
A0
ROW
ADDRESS
11 LATCH
ROW
ADDRESS
BUFFER
11
11
MEMORY CELL
ARRAY
2048
BANK 0
SENSE AMP I/O GATE
256
8
COLUMN DECODER
8
256
SENSE AMP I/O GATE
ROW
ADDRESS
11 BUFFER
11
MEMORY CELL
ARRAY
2048
BANK 1
DATA IN
BUFFER
16 16
LDQM,
UDQM
DQ 0-15
DATA OUT
BUFFER
16 16
VDD/VDDQ
GND/GNDQ
S16BLK.eps
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774
Rev. 00A
04/15/05
3


3Pages


IS42VS16100C1 電子部品, 半導体
IS42VS16100C1
ISSI ®
www.DataSheet4U.com
DC ELECTRICAL CHARACTERISTICS (Recommended Operation Conditions unless otherwise noted.)
Symbol Parameter
Test Condition
Min. Max. Unit
ICC1 Operating Current(1,2)
One Bank Operation,
Burst Length=1
tRC tRC (min.)
IOUT = 0mA
CAS Latency = 3
CAS Latency = 2
— 35 mA
— 40
ICC2P
Precharge Standby Current
(In Power-Down Mode)
CKE VIL (MAX)
tCK = 10 ns
— 0.3 mA
ICC2PS Precharge Standby Current
(In Power-Down Mode)
CKE VIL (MAX)
CLK VIL (MAX)
tCK =
— 0.3 mA
ICC2N
Active Standby Current(3)
(In Non Power-Down Mode)
CKE VIH (MIN)
CS VIH (MIN),
tCK = 10 ns
— 6 mA
ICC2NS Active Standby Current
(In Non Power-Down Mode)
CKE VIH (MIN)
Inputs are stable
tCK =
— 2 mA
ICC3P
Active Standby Current
(In Non Power-Down Mode)
CKE VIL (MAX)
tCK = 10 ns
— 6 mA
ICC3PS Active Standby Current
(In Non Power-Down Mode)
CKE VIL (MAX)
CLK VIL (MAX)
tCK =
— 5 mA
ICC3N
Active Standby Current(3)
(In Non Power-Down Mode)
CKE VIH (MIN)
CS VIH (MIN)
tCK = 10 ns
— 12 mA
ICC3NS
Active Standby Current
(In Non Power-Down Mode)
Inputs are stable
CKE VIH (MIN)
CLK VIL (MAX)
tCK =
— 10 mA
ICC4 Operating Current
(In Burst Mode)(1,3)
tCK = tCK (MIN)
IOUT = 0mA
CAS latency = 2, 3 — 50 mA
Page Burst
4 Banks activated
ICC5 Auto-Refresh Current
tRC = tRC (MIN)
CAS latency = 2, 3 — 40 mA
ICC6 Self-Refresh Current
CKE 0.2V
— 170 µA
Notes:
1. These are the values at the minimum cycle time. Since the currents are transient, these values decrease as the cycle time
increases. Also note that a bypass capacitor of at least 0.01 µF should be inserted between VDD and Vss for each memory
chip to suppress power supply voltage noise (voltage drops) due to these transient currents.
2. Icc1 and Icc4 depend on the output load. The maximum values for Icc1 and Icc4 are obtained with the output open state.
3. Inputs changed once every two clocks.
6 Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774
Rev. 00A
04/15/05

6 Page



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部品番号部品説明メーカ
IS42VS16100C1

512K Words x 16 Bits x 2 Banks (16-MBIT) SYNCHRONOUS DYNAMIC RAM

Integrated Silicon Solution
Integrated Silicon Solution


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