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NJL5901RのメーカーはNew Japan Radioです、この部品の機能は「COBP PHOTO REFLECTOR」です。 |
部品番号 | NJL5901R |
| |
部品説明 | COBP PHOTO REFLECTOR | ||
メーカ | New Japan Radio | ||
ロゴ | |||
このページの下部にプレビューとNJL5901Rダウンロード(pdfファイル)リンクがあります。 Total 7 pages
NJL5901R
www.DataSheet4U.com
COBP PHOTO REFLECTOR
GENERAL DESCRIPTION
NJL5901R is the compact surface mount type photo reflector in which Lead(Pb) – free reflow soldering is possible. It is
possible to perform reflow soldering temperature 260°C and 2 times. NJL5901R has realized the high output current and the
high S/N ratio combining a high output infrared LED and a high sensitivity Si photo-transister.
FEATURES
• Pb free solder re-flowing permitted(260°C, 2times)
• Miniature, thin, surface mount 1.6mm × 2.4mm × 0.8mm
• Built-in visible light cut-off filter
• High output, high S/N ratio
OUTLINE (typ.)
2.4
1.47
(0.73)
C
(0.33)
A
Unit : mm
0.1
0.65
0.1
0.2 0.65
APPLICATIONS
• Detecting the location of CD/DVD optical pickup head
• Detecting the location of lens for DSC and Cellular
Phone’s camera module
• End detection of VCR tape
• Rotation detection of various motors
E
PT CENTER
K
LED CENTER
A:anode
K:cathode
C:collector
E:emitter
ABSOLUTE MAXIMUM RATINGS (Ta=25°C)
PARAMETER
SYMBOL
Emitter
Forward Current (Continuous)
Reverse Voltage (Continuous)
Power Dissipation
IF
VR
PD
Detector
Collector-Emitter Voltage
Emitter-Collector Voltage
Collector Current
Collector Power Dissipation
VCEO
VECO
IC
PC
Coupled
Total Power Dissipation
Operating Temperature
Storage Temperature
Reflow Soldering Temperature
Ptot
Topr
Tstg
Tsol
RATINGS
30
6
45
16
6
10
25
60
-20 to +85
-40 to +85
260
UNIT
mA
V
mW
V
V
mA
mW
mW
°C
°C
°C
0.1 0.65
0.65
0.1
0.85 0.7 0.85
PCB Pattern
ELECTRO-OPTICAL CHARACTERISTICS (Ta=25°C)
PARAMETER
SYMBOL
TEST CONDITION
MIN TYP MAX UNIT
Emitter
Forward Voltage
Reverse Current
Capacitance
VF IF=4mA
IR VR=6V
Ct VR=0V,f=1MHz
— — 1.4 V
— — 10 µA
— 25 — pF
Detector
Dark Current
Collector-Emitter Voltage
ICEO VCE=10V
VCEO IC=100µA
— — 0.2 µA
16 — — V
Coupled
Output Current
IO IF=4mA,VCE=2V,d=0.7mm
120 — 380 µA
Operating Dark Current *1 ICEOD IF=4mA,VCE=2V
— — 2 µA
Rise Time
tr IO=100µA,VCE=2V,RL=1KΩ,d=0.7mm — 30 — µs
Fall Time
tf IO=100µA,VCE=2V,RL=1KΩ,d=0.7mm — 30 — µs
*1 Icoed may increase according to the periphery situation of the surface mounted product.
-1-
1 Page Power Dissipation vs. Temperature
100
90
80
70
60
50
Total Power
40
Dissipation
30
20
Collector Power
10
Dissipation
0
0 20 40 60 80
Ambient Temperature Ta(°C)
TYPICAL CHARACTERISTICS
Forward Voltage vs. Forward Current
100
100
10
1
012
Forward Voltage VF(V)
Dark Current vs. Temperature
10000
1000
100
10
1
0.1
Vce=10V
0.01
0.001
-40
-20 0 20 40 60 80
Ambient Temperature Ta(°C)
100
NJL5901R
www.DataSheet4U.com
Forward Current vs. Temperature
50
45
40
35
30
25
20
15
10
5
0
0
20 40 60 80
Ambient Temperature Ta(°C)
100
Forward Voltage vs. Temperature
1.6
1.4
IF=30mA
1.2
IF=4mA
1
0.8
-40
-20 0 20 40 60 80
Ambient Temperature Ta(°C)
100
Operating Dark Current vs. Temperature
10
1
0.1
IF=4mA,Vce=2V
0.01
-40
-20 0 20 40 60 80
Ambient Temperature Ta(°C)
100
-3-
3Pages PRECAUTION FOR HANDLING
NJL5901R
www.DataSheet4U.com
1. Soldering to actual circuit board
Soldering condition
The surface temperature of plastic package is lower than 260 °C.
Soldering Method
1) Reflow Method
Soldering to be done within twice under the recommended condition mentioned below
260°C
230°C
220°C
180°C
150°C
f
e
d
a : Temperature ramping rate
b : Pre-heating temperature
time
c : Temperature ramping rate
d : 220°C or higher time
e : 230°C or higher time
f : Peak temperature
g : Temperature ramping rate
: 1 to 4°C/s
: 150 to 180°C
: 60 to 120s
: 1 to 4°C /s
: Shorter than 60s
: Shorter than 40s
: Lower than 260°C
: 1 to 6°C /s
The temperature of the surface of mold package
Room
Temp.
a bc
g
2) Reflow Method (In case of infrared heating)
The temperature profile is same as the above
Avoid direct irradiation to the plastic package because it may absorb the Infrared Radiation and its surface
temperature will be higher than the lead.
3) The other method
Avoid rapid heating up like dipping the devices directly into the melting solder or vapor phase method (VPS).
Solder the device in short time as soon as possible.
If the device is heated and kept in high temperature for longer time, its reliability would be affected.
2. Cleaning
Avoid washing the device after soldering by reflow method.
3. Attention in handling
1) Treat not to touch the lens surface.
2) Avoid dust and any other foreign materials on the lens surface such as paint, bonding material, etc.
4. Storage
Mount the device as soon as possible after opening the envelope. In order to prevent from degradation by the moisture at
the reflow process, the device is contained in deaeration packaging.
-6-
6 Page | |||
ページ | 合計 : 7 ページ | ||
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