DataSheet.es    


PDF AT52BC3221AT Data sheet ( Hoja de datos )

Número de pieza AT52BC3221AT
Descripción 32-Mbit Flash 8-Mbit PSRAM Stack Memory
Fabricantes ATMEL Corporation 
Logotipo ATMEL Corporation Logotipo



Hay una vista previa y un enlace de descarga de AT52BC3221AT (archivo pdf) en la parte inferior de esta página.


Total 30 Páginas

No Preview Available ! AT52BC3221AT Hoja de datos, Descripción, Manual

Features
32-Mbit Flash and 4-Mbit/8-Mbit PSRAM
Single 66-ball (8 mm x 10 mm x 1.2 mm) CBGA Package
2.7V to 3.3V Operating Voltage
Flash
32-megabit (2M x 16)
2.7V to 3.3V Read/Write
Access Time – 70 ns
Sector Erase Architecture
– Sixty-three 32K Word Sectors with Individual Write Lockout
– Eight 4K Word Sectors with Individual Write Lockout
Fast Word Program Time – 15 µs
Suspend/Resume Feature for Erase and Program
– Supports Reading and Programming from Any Sector by Suspending Erase of a
Different Sector
– Supports Reading Any Word by Suspending Programming of Any Other Word
Low-power Operation
– 12 mA Active
– 13 µA Standby
Data Polling, Toggle Bit, Ready/Busy for End of Program Detection
VPP Pin for Write Protection and Accelerated Program/Erase Operations
RESET Input for Device Initialization
Sector Lockdown Support
Top or Bottom Boot Block Configuration Available
128-bit Protection Register
Minimum 100,000 Erase Cycles
PSRAM
8-megabit (512K x 16)
2.7V to 3.3V VCC
70 ns Access Time
Extended Temperature Range
ISB0 < 10 µA when Deep Power-Down
www.DataSheet4U.com
32-Mbit Flash +
8-Mbit PSRAM
Stack Memory
AT52BC3221A
AT52BC3221AT
Preliminary
Device Number
AT52BC3221A
AT52BC3221AT
Flash Boot
Location
Bottom
Top
Flash Plane
Configuration
32M (2M x 16)
32M (2M x 16)
PSRAM
Configuration
8M (512K x 16)
8M (512K x 16)
Rev. 3466A–STKD–11/04
1

1 page




AT52BC3221AT pdf
Device
Operation
3466A–STKD–11/04
AT52BC3221A(T)
www.DataSheet4U.com
READ: The 32-Mbit Flash memory is accessed like an EPROM. When CE and OE are low
and WE is high, the data stored at the memory location determined by the address pins are
asserted on the outputs. The outputs are put in the high impedance state whenever CE or OE
is high. This dual-line control gives designers flexibility in preventing bus contention.
COMMAND SEQUENCES: When the device is first powered on, it will be reset to the read or
standby mode, depending upon the state of the control line inputs. In order to perform other
device functions, a series of command sequences are entered into the device. The command
sequences are shown in the “Command Definition in Hex” table on page 12 (I/O8 - I/O15 are
don’t care inputs for the command codes). The command sequences are written by applying a
low pulse on the WE or CE input with CE or WE low (respectively) and OE high. The address
is latched on the falling edge of CE or WE, whichever occurs last. The data is latched by the
first rising edge of CE or WE. Standard microprocessor write timings are used. The address
locations used in the command sequences are not affected by entering the command
sequences.
RESET: A RESET input pin is provided to ease some system applications. When RESET is at
a logic high level, the device is in its standard operating mode. A low level on the RESET input
halts the present device operation and puts the outputs of the device in a high impedance
state. When a high level is reasserted on the RESET pin, the device returns to the read or
standby mode, depending upon the state of the control inputs.
ERASURE: Before a word can be reprogrammed, it must be erased. The erased state of
memory bits is a logical “1”. The entire device can be erased by using the Chip Erase com-
mand or individual sectors can be erased by using the Sector Erase command.
CHIP ERASE: The entire device can be erased at one time by using the six-byte chip erase
software code. After the chip erase has been initiated, the device will internally time the erase
operation so that no external clocks are required. The maximum time to erase the chip is tEC.
If the sector lockdown has been enabled, the chip erase will not erase the data in the sector
that has been locked out; it will erase only the unprotected sectors. After the chip erase, the
device will return to the read or standby mode.
SECTOR ERASE: As an alternative to a full chip erase, the device is organized into 71 sec-
tors (SA0 - SA70) that can be individually erased. The Sector Erase command is a six-bus
cycle operation. The sector address is latched on the falling WE edge of the sixth cycle while
the 30H data input command is latched on the rising edge of WE. The sector erase starts after
the rising edge of WE of the sixth cycle. The erase operation is internally controlled; it will
automatically time to completion. The maximum time to erase a sector is tSEC. When the sec-
tor programming lockdown feature is not enabled, the sector will erase (from the same Sector
Erase command). An attempt to erase a sector that has been protected will result in the oper-
ation terminating immediately.
WORD PROGRAMMING: Once a memory block is erased, it is programmed (to a logical “0”)
on a word-by-word basis. Programming is accomplished via the internal device command reg-
ister and is a four-bus cycle operation. The device will automatically generate the required
internal program pulses.
Any commands written to the chip during the embedded programming cycle will be ignored. If
a hardware reset happens during programming, the data at the location being programmed
will be corrupted. Please note that a data “0” cannot be programmed back to a “1”; only erase
operations can convert “0”s to “1”s. Programming is completed after the specified tBP cycle
time. The Data Polling feature or the Toggle Bit feature may be used to indicate the end of a
program cycle. If the erase/program status bit is a “1”, the device was not able to verify that the
erase or program operation was performed successfully.
5

5 Page





AT52BC3221AT arduino
AT52BC3221A(T)
www.DataSheet4U.com
Status Bit Table
Status Bit
I/O7
I/O7
I/O6
I/O5(1)
I/O3(2)
I/O2 RDY/BUSY
Configuration Register
00
01
00/01
00/01
00/01
00/01
00/01
Programming
I/O7 0 TOGGLE 0 0 1 0
Erasing
0 0 TOGGLE 0 0 TOGGLE 0
Erase Suspended & Read
Erasing Sector
1
1
1
0
0 TOGGLE 1
Erase Suspended & Read
Non-erasing Sector
DATA
DATA
DATA
DATA
DATA
DATA
1
Erase Suspended &
Program Non-erasing Sector
I/O7
0 TOGGLE 0
0 TOGGLE 0
Notes: 1. I/O5 switches to a “1” when a program or an erase operation has exceeded the maximum time limits or when a program or
sector erase operation is performed on a protected sector.
2. I/O3 switches to a “1” when the VPP level is not high enough to successfully perform program and erase operations.
3466A–STKD–11/04
11

11 Page







PáginasTotal 30 Páginas
PDF Descargar[ Datasheet AT52BC3221AT.PDF ]




Hoja de datos destacado

Número de piezaDescripciónFabricantes
AT52BC3221A32-Mbit Flash 8-Mbit PSRAM Stack MemoryATMEL Corporation
ATMEL Corporation
AT52BC3221AT32-Mbit Flash 8-Mbit PSRAM Stack MemoryATMEL Corporation
ATMEL Corporation

Número de piezaDescripciónFabricantes
SLA6805M

High Voltage 3 phase Motor Driver IC.

Sanken
Sanken
SDC1742

12- and 14-Bit Hybrid Synchro / Resolver-to-Digital Converters.

Analog Devices
Analog Devices


DataSheet.es es una pagina web que funciona como un repositorio de manuales o hoja de datos de muchos de los productos más populares,
permitiéndote verlos en linea o descargarlos en PDF.


DataSheet.es    |   2020   |  Privacy Policy  |  Contacto  |  Buscar