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Número de pieza | UCLAMP0505A | |
Descripción | 5-Line ESD protection Array | |
Fabricantes | Semtech Corporation | |
Logotipo | ||
Hay una vista previa y un enlace de descarga de UCLAMP0505A (archivo pdf) en la parte inferior de esta página. Total 8 Páginas | ||
No Preview Available ! PROTECTION PRODUCTS - MicroClampTM
Description
The µClampTM series of TVS arrays are designed to pro-
tect sensitive electronics from damage or latch-up due
to ESD. They are designed for use in applications where
board space is at a premium. Each device requires less
than 2.9mm2 of PCB area and will protect up to five lines.
They are unidirectional devices and may be used on lines
where the signal polarities are above ground.
TVS diodes are solid-state devices designed specifically
for transient suppression. They feature large cross-sec-
tional area junctions for conducting high transient cur-
rents. They offer desirable characteristics for board level
protection including fast response time, low operating
and clamping voltage, and no device degradation.
The uClampTM0505A may be used to meet the immunity
requirements of IEC 61000-4-2, level 4. The small SC89
package makes them ideal for use in portable electron-
ics such as cell phones, PDA’s, notebook computers, and
digital cameras. These devices feature a lead-free, matte
tin lead finish. They are compatible with both lead free
and SnPb assembly techniques.
uClamp0505A
µClampTM
5-Line ESD prwowwt.eDactatSihoeent4UA.cormray
Features
Transient protection for data lines to
IEC 61000-4-2 (ESD) ±15kV (air), ±8kV (contact)
IEC 61000-4-4 (EFT) 40A (5/50ns)
Protects five I/O lines
Ultra-small SC-89 package (1.7 x 1.7 x 0.6mm)
requires less than 2.9mm2 of PCB area
Working voltage: 5V
Low leakage current
Low operating and clamping voltages
Solid-state silicon-avalanche technology
Mechanical Characteristics
SC-89 (SOT-666) package
Molding compound flammability rating: UL 94V-0
Marking : Marking Code and pin 1 indicator
Weight: 2.9mg (typical)
Lead Finish: Matte Tin
Packaging : Tape and Reel per EIA 481
Applications
Cellular Handsets & Accessories
Cordless Phones
Personal Digital Assistants (PDA’s)
Notebooks & Handhelds
Portable Instrumentation
Digital Cameras
Peripherals
MP3 Players
Dimensions
Schematic & PIN Configuration
1.70
0.50
0.30
1.25 1.70
0.60
Maximum Dimensions (mm)
Revision 06/23/04
1
SC-89 (Top View)
www.semtech.com
1 page PROTECTION PRODUCTS
Applications Information
Device Connection for Protection of Five Data Lines
These devices are designed to protect up to five
unidirectional data lines. The device is connected as
follows:
1. Unidirectional protection of five I/O lines is
achieved by connecting pins 1, 3, 4, 5, and 6 to
the data lines. Pin 2 is connected to ground. The
ground connection should be made directly to the
ground plane for best results. The path length is
kept as short as possible to reduce the effects of
parasitic inductance in the board traces.
Circuit Board Layout Recommendations for Suppres-
sion of ESD.
Good circuit board layout is critical for the suppression
of ESD induced transients. The following guidelines are
recommended:
z Place the TVS near the input terminals or connec-
tors to restrict transient coupling.
z Minimize the path length between the TVS and the
protected line.
z Minimize all conductive loops including power and
ground loops.
z The ESD transient return path to ground should be
kept as short as possible.
z Never run critical signals near board edges.
z Use ground planes whenever possible.
Matte Tin Lead Finish
Matte tin has become the industry standard lead-free
replacement for SnPb lead finishes. A matte tin finish
is composed of 100% tin solder with large grains.
Since the solder volume on the leads is small com-
pared to the solder paste volume that is placed on the
land pattern of the PCB, the reflow profile will be
determined by the requirements of the solder paste.
Therefore, these devices are compatible with both
lead-free and SnPb assembly techniques. In addition,
unlike other lead-free compositions, matte tin does not
have any added alloys that can cause degradation of
the solder joint.
uClamp0505A
www.DataSheet4U.com
Circuit Diagram
134 56
2
Protection of Five Unidirectional Lines
2004 Semtech Corp.
5
www.semtech.com
5 Page |
Páginas | Total 8 Páginas | |
PDF Descargar | [ Datasheet UCLAMP0505A.PDF ] |
Número de pieza | Descripción | Fabricantes |
UCLAMP0505A | 5-Line ESD protection Array | Semtech Corporation |
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