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UCLAMP0504T の電気的特性と機能

UCLAMP0504TのメーカーはSemtech Corporationです、この部品の機能は「Low Profile Clamp 4-Line ESD Protection」です。


製品の詳細 ( Datasheet PDF )

部品番号 UCLAMP0504T
部品説明 Low Profile Clamp 4-Line ESD Protection
メーカ Semtech Corporation
ロゴ Semtech Corporation ロゴ 




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UCLAMP0504T Datasheet, UCLAMP0504T PDF,ピン配置, 機能
PROTECTION PRODUCTS - MicroClamp®
Description
The μClamp® series of TVS arrays are designed to pro-
tect sensitive electronics from damage or latch-up due
to ESD. It is designed to replace single line devices such
as multilayer varistors (MLVs) in space constrained ap-
plications such as cell phones, notebook computers, and
other portable electronics. It features large cross-sec-
tional area junctions for conducting high transient cur-
rents. TVS diodes offer desirable characteristics for
board level protection including fast response time, low
operating and clamping voltage, and no device degrada-
tion.
The μClamp®0504T is in a 6-pin SLP1313P6T package.
It measures 1.3 x 1.3 mm with a nominal height of only
0.4mm. The leads are spaced at a pitch of 0.4mm
and are finished with lead-free NiPdAu. Each device
features four TVS diodes with an operating voltage of
5 volts and a maximum loading capacitance of only
10pF.
They may be used to meet the ESD immunity require-
ments of IEC 61000-4-2, Level 4 (±15kV air, ±8kV
contact discharge). The combination of small size and
high ESD surge capability makes them ideal for use in
portable applications such as cellular phones, digital
cameras, and notebook computers.
uClamp0504T
Low Profile μClamp®
4-Line EwwSwD.DatPaSrheoett4eU.ccotmion
Features
‹ Transient protection for data lines to
IEC 61000-4-2 (ESD) ±15kV (air), ±8kV (contact)
IEC 61000-4-4 (EFT) 40A (tp = 5/50ns)
Cable Discharge Event (CDE)
‹ Ultra-small package
‹ Protects four data lines
‹ Low clamping voltage
‹ Working voltage: 5V
‹ Low capacitance (10pF)
‹ Solid-state silicon-avalanche technology
Mechanical Characteristics
‹ SLP1313P6T package
‹ Pb-Free, Halogen Free, RoHS/WEEE Compliant
‹ Nominal Dimensions: 1.3 x 1.3 x 0.4 mm
‹ Lead Finish: NiPdAu
‹ Molding compound flammability rating: UL 94V-0
‹ Marking : Marking code
‹ Packaging : Tape and Reel
Applications
‹ Cellular Handsets & Accessories
‹ Notebooks & Handhelds
‹ mp3 Players
‹ Cordless Phones
‹ Portable Instrumentation
‹ Digital Cameras
‹ Peripherals
Dimensions
Schematic
1.30
123
134 6
1.30
65
4
0.40 BSC
0.40
Nominal Dimensions (mm)
(SLP1313P6T Bottom View)
Revision 10/07/2009
Center Tab (GND)
Note: Pin 2 and 5 are N.C.
1
www.semtech.com

1 Page





UCLAMP0504T pdf, ピン配列
PROTECTION PRODUCTS
Typical Characteristics
Non-Repetitive Peak Pulse Power vs. Pulse Time
10
1
0.1
0.01
0.1
1 10
Pulse Duration - tp (us)
100
Clamping Voltage vs. Peak Pulse Current
15
10
5 Waveform
Parameters:
tr = 8μs
td = 20μs
0
0 0.5 1 1.5 2 2.5 3
Peak Pulse Current - IPP (A)
Normalized Junction Capacitance vs. Reverse Voltage
uClamp0504T
www.DataSheet4U.com
110
100
90
80
70
60
50
40
30
20
10
0
0
Power Derating Curve
25 50 75 100 125
Ambient Temperature - TA (oC)
150
Forward Voltage vs. Forward Current
8
7
6
5
4
3
Waveform
2 Parameters:
tr = 8μs
1 td = 20μs
0
0 1 2 3 4 5 6 7 8 9 10 11 12 13 14
Forward Current - IF (A)
ESD Clamping
(8kV Contact per IEC 61000-4-2)
1.1
1
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
0
123
Reverse Voltage - VR (V)
© 2009 Semtech Corp.
f = 1 MHz
45
Note: Data is taken with a 10x attenuator
3
www.semtech.com


3Pages


UCLAMP0504T 電子部品, 半導体
PROTECTION PRODUCTS
Outline Drawing - SLP1313P6T
uClamp0504T
www.DataSheet4U.com
A
PIN 1
INDICATOR
(LASER MARK)
aaa C
A2
E1
D
A1
B
E
A SEATING
PLANE
C
DIMENSIONS
DIM
INCHES
MIN NOM MAX
MILLIMETERS
MIN NOM MAX
A .015 .016 .017 0.37 0.40 0.43
A1 0.00 .001 .002 0.00 0.03 0.05
A2 (.005)
(0.13)
b .006 .008 .010 0.15 0.20 0.25
D .047 .051 .055 1.20 1.30 1.40
D1 .035 .039 .043 0.90 1.00 1.10
E .047 .051 .055 1.20 1.30 1.40
E1 .008 .012 .016 0.20 0.30 0.40
e .016 BSC
0.40 BSC
L .008 .010 .012 0.20 0.25 0.30
N6
6
aaa .003
0.08
bbb .004
0.10
D1
12
LxN
E/2
N bxN
e bbb C A B
D/2
NOTES:
1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
2. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS.
Land Pattern - SLP1313P6T
P
(C) H
X
GZ
Y
K
DIMENSIONS
DIM INCHES
MILLIMETERS
C (.050)
G .027
H .012
K .039
P .016
X .008
Y .023
Z .073
(1.27)
0.69
0.30
1.00
0.40
0.20
0.58
1.85
NOTES:
1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
2. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY.
CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR
COMPANY'S MANUFACTURING GUIDELINES ARE MET.
3. THERMAL VIAS IN THE LAND PATTERN OF THE EXPOSED PAD
SHALL BE CONNECTED TO A SYSTEM GROUND PLANE.
FAILURE TO DO SO MAY COMPROMISE THE THERMAL AND/OR
FUNCTIONAL PERFORMANCE OF THE DEVICE.
© 2009 Semtech Corp.
6
www.semtech.com

6 Page



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共有リンク

Link :


部品番号部品説明メーカ
UCLAMP0504A

4-Line ESD protection Array

Semtech Corporation
Semtech Corporation
UCLAMP0504T

Low Profile Clamp 4-Line ESD Protection

Semtech Corporation
Semtech Corporation


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