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PDF IS64WV12816DBLS Data sheet ( Hoja de datos )

Número de pieza IS64WV12816DBLS
Descripción 128K x 16 HIGH SPEED ASYNCHRONOUS CMOS STATIC RAM
Fabricantes Integrated Silicon Solution 
Logotipo Integrated Silicon Solution Logotipo



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IS61WV12816DALL/DALS
IS61WV12816DBLL/DBLS
IS64WV12816DBLL/DBLS
www.DataSheet4U.com
128K x 16 HIGH SPEED ASYNCHRONOUS
CMOS STATIC RAM
MAY 2008
FEATURES
HIGH SPEED: (IS61/64WV12816DALL/DBLL)
• High-speed access time: 8, 10, 12, 20 ns
• Low Active Power: 135 mW (typical)
• Low Standby Power: 12 μW (typical)
CMOS standby
LOW POWER: (IS61/64WV12816DALS/DBLS)
• High-speed access time: 25, 35 ns
• Low Active Power: 55 mW (typical)
• Low Standby Power: 12 μW (typical)
CMOS standby
• Single power supply
— VDD 1.65V to 2.2V (IS61WV12816DAxx)
— VDD 2.4V to 3.6V (IS61/64WV12816DBxx)
• Fully static operation: no clock or refresh
required
• Three state outputs
• Data control for upper and lower bytes
• Industrial and Automotive temperature support
• Lead-free available
DESCRIPTION
The ISSI IS61WV12816DAxx/DBxx and IS64WV12816DBxx
are high-speed, 2,097,152-bit static RAMs organized as
131,072 words by 16 bits. It is fabricated using ISSI's high-
performance CMOS technology. This highly reliable pro-
cess coupled with innovative circuit design techniques,
yields high-performance and low power consumption de-
vices.
When CE is HIGH (deselected), the device assumes a
standby mode at which the power dissipation can be
reduced down with CMOS input levels.
Easy memory expansion is provided by using Chip Enable
and Output Enable inputs, CE and OE. The active LOW
Write Enable (WE) controls both writing and reading of the
memory. A data byte allows Upper Byte (UB) and Lower
Byte (LB) access.
The IS61WV12816DAxx/DBxx and IS64WV12816DBxx are
packaged in the JEDEC standard 44-pin TSOP Type II and
48-pin Mini BGA (6mm x 8mm).
FUNCTIONAL BLOCK DIAGRAM
A0-A16
DECODER
128K x 16
MEMORY ARRAY
VDD
GND
I/O0-I/O7
Lower Byte
I/O8-I/O15
Upper Byte
I/O
DATA
CIRCUIT
COLUMN I/O
CE
OE
WE
CONTROL
CIRCUIT
UB
LB
Copyright © 2006 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time
without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to
obtain the latest version of this device specification before relying on any published information and before placing orders for products.
Integrated Silicon Solution, Inc. — www.issi.com
Rev. C
05/01/08
1

1 page




IS64WV12816DBLS pdf
IS61WV12816DALL/DALS, IS61WV12816DBLL/DBLS,
IS64WV12816DBLL/DBLS
www.DataSheet4U.com
AC TEST CONDITIONS
Parameter
Input Pulse Level
Input Rise and Fall Times
Input and Output Timing
and Reference Level (VRef)
OutputLoad
R1 ( Ω )
R2 ( Ω )
VTM (V)
Unit
(2.4V-3.6V)
0.4V to VDD - 0.3V
1V/ ns
VDD /2
See Figures 1 and 2
1909
1105
3.0V
Unit
(3.3V + 5%)
0.4V to VDD - 0.3V
1V/ ns
VDD + 0.05
2
See Figures 1 and 2
317
351
3.3V
Unit
(1.65V-2.2V)
0.4V to VDD - 0.3V
1V/ ns
0.9V
See Figures 1 and 2
13500
10800
1.8V
AC TEST LOADS
OUTPUT
ZO = 50Ω
50Ω
VDD/2
30 pF
Including
jig and
scope
Figure 1.
VTM
R1
OUTPUT
5 pF
Including
jig and
scope
Figure 2.
R2
1
2
3
4
5
6
7
8
9
10
11
12
Integrated Silicon Solution, Inc. — www.issi.com
Rev. C
05/01/08
5

5 Page





IS64WV12816DBLS arduino
IS61WV12816DALL/DALS, IS61WV12816DBLL/DBLS,
IS64WV12816DBLL/DBLS
www.DataSheet4U.com
AC WAVEFORMS
READ CYCLE NO. 1(1,2) (Address Controlled) (CE = OE = VIL, UB or LB = VIL)
1
ADDRESS
DOUT
t RC
PREVIOUS DATA VALID
t OHA
t AA
t OHA
DATA VALID
READ1.eps
2
3
4
READ CYCLE NO. 2(1,3)
ADDRESS
OE
CE
LB, UB
tLZCE
DOUT
tLZB
HIGH-Z
tRC
tAA tOHA
tDOE
tLZOE
tACE
tHZOE
tHZCE
tBA tRC
tHZB
DATA VALID
VDD
Supply
Current
tPU
50%
Notes:
1. WE is HIGH for a Read Cycle.
2. The device is continuously selected. OE, CE, UB, or LB = VIL.
3. Address is valid prior to or coincident with CE LOW transition.
tPD
50%
ICC
ISB
UB_CEDR2.eps
5
6
7
8
9
10
11
12
Integrated Silicon Solution, Inc. — www.issi.com
Rev. C
05/01/08
11

11 Page







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