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PDF ISL8200M Data sheet ( Hoja de datos )
| Número de pieza | ISL8200M | |
| Descripción | Complete Current Share 10A DC/DC Power Module | |
| Fabricantes | Intersil Corporation | |
| Logotipo |  |
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DATASHEETNROETCROEMCMOEMNMDEIESNDLD8RE2ED0P0FLAOAMRCENMEEWNDTEPSAIGRTNS
Complete Current Share 10A DC/DC Power Module
ISL8200M
The ISL8200M is a simple and easy to use high power,
current-sharing DC\DC power module for Datacom\Telecom\
FPGA power hungry applications. All that is needed is the
ISL8200M, a few passive components and one VOUT setting
resistor to have a complete 10A design ready for market.
The ease of use virtually eliminates the design and
manufacturing risks while dramatically improving time to
market.
Need more output current? Parallel up to six ISL8200M
modules to scale up to a 60A solution (see Figure 6 on
page 10).
The simplicity of the ISL8200M is in its "Off The Shelf",
unassisted implementation versus a discrete implementation.
Patented current sharing in multi-phase operation greatly
reduces ripple currents, BOM cost and complexity. For
example, parallel 2 for 20A and up to 6 for 60A. The output
voltage can be precisely regulated to as low as 0.6V with ±1%
output voltage regulation over line, load, and temperature
variations.
The ISL8200M’s thermally enhanced, compact QFN package,
operates at full load and over temperature, without requiring
forced air cooling. It's so thin it can even fit on the back side of
the PCB. Easy access to all pins with few external components,
reduces the PCB design to a component layer and a simple
ground layer.
Features
• Complete switch mode power supply in one package
• Patented current share architecture reduces layout sensitivity
when modules are paralleled
• Programmable phase shift (1- to 6-phase)
• Extremely low profile (2.2mm height)
• Input voltage range +4.5V to +20V at 10A, current share up to
60A
• A single resistor sets VOUT from +0.6V to +6V
• Output overvoltage, overcurrent and over-temperature
protection and undervoltage indication
• RoHS compliant
Applications
• Servers, Telecom and Datacom applications
• Industrial and medical equipment
• Point of load regulation
Related Literature
• AN1655 ISL8200MEVAL1PHZ Evaluation Board User’s
Guide
• iSim Model - (See Product Information page at
www.intersil.com/products/ISL8200M
• AN1786 Reducing the Switching Frequency of the
ISL8200M and ISL8200AM Power Modules
Complete Functional Schematic
VIN RANGE
4.5V TO 20V
VIN
PVIN
VEN EN
FF
VOUT
VOUT RANGE
0.6V TO 6.0V
ISL8200M
POWER MODULE
VOUT_SET
VSEN_REM-
RSET
ISHARE
PGND1
10F
5k
NOTE: For input voltage higher than 4.5V, VIN can be tied to PVIN directly
(see Figure 22 for details).
FIGURE 1. COMPLETE 10A DESIGN, JUST SELECT RSET FOR THE
DESIRED VOUT
ISL8200M Package
2.2mm
15mm
15mm
FIGURE 2. THE 2.2mm HEIGHT IS IDEAL FOR THE BACKSIDE OF
PCBS WHEN SPACE AND HEIGHT IS A PREMIUM
June 9, 2015
FN6727.2
1 CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 1-888-468-3774 |Copyright Intersil Americas LLC 2009, 2010, 2015. All Rights Reserved
Intersil (and design) is a trademark owned by Intersil Corporation or one of its subsidiaries.
All other trademarks mentioned are the property of their respective owners.
1 page  
ISL8200M
Pin Descriptions (Continued)
PIN # PIN NAME
PIN DESCRIPTION
23 NC Not internal connected
PD1 Phase Thermal Pad Used for both the PHASE pin (Pin # 16) and for heat removal connecting to heat dissipation layers using Vias. Connect this
pad to a copper island on the PCB board with the same shape as the PHASE thermal pad. This pad is electrically connected
to the PHASE pin.
PD2 PVIN Thermal Pad Used for both the PVIN pin (Pin # 17) and for heat removal connecting to heat dissipation layers using Vias. Connect this pad
to a copper island on the PCB board with the same shape as the PVIN thermal pad. This pad is electrically connected to the
PVIN pin.
PD3 PGND Thermal Pad Used for both the PGND pin (Pin # 18) and for heat removal connecting to heat dissipation layers using Vias. Connect this
pad to a copper island on the PCB board with the same shape as the PGND thermal pad. This pad is electrically connected
to the PGND pin.
PD4 VOUT Thermal Pad Used for both the VOUT pin (Pin # 19) and for heat removal connecting to heat dissipation layers using Vias. Connect this pad
to a copper island on the PCB board with the same shape as the VOUT thermal pad.Tthis pad is electrically connected to the
VOUT pin.
Typical Application Circuits
PVIN
GROUND
ISFETDRV1
PVIN
VIN
FF
EN
FSYNC_IN
CLKOUT
ISHARE_BUS
ISFETDRV
ISL8200M
Set R1 and R2 such that
0.8V ≤ VEN ≤ 5.0V
Do not tie EN directly to a power source
VOUT
VOUT_SET
VSEN_REM-
PGOOD
PH_CNTRL
VCC
RSET
2.2k
PGOOD
VCC
VOUT
RSET can change VOUT
Refer to Table 1
VOUT
GROUND
FIGURE 3. SINGLE PHASE 10A 1.2V OUTPUT CIRCUIT
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FN6727.2
June 9, 2015
5 Page 
ISL8200M
Typical Performance Characteristics (Continued)
Transient Response Performance TA = +25°C, PVIN = VIN = 12V, CIN = 220µFx1, 10µF/Ceramic x 2, COUT = 47µF/Ceramic x 8
IOUT = 0A to 5A, Current slew rate = 2.5A/µs
VOUT
IOUT
VIN = 12V
VOUT = 1.5V
IOUT = 0A to 5A
VOUT
IOUT
VIN = 12V
VOUT = 1.8V
IOUT = 0A to 5A
FIGURE 10. 1.5V TRANSIENT RESPONSE
VOUT
IOUT
VIN = 12V
VOUT = 2.5V
IOUT = 0A to 5A
FIGURE 11. 1.8V TRANSIENT RESPONSE
VOUT
IOUT
VIN = 12V
VOUT = 3.3V
IOUT = 0A to 5A
FIGURE 12. 2.5V TRANSIENT RESPONSE
FIGURE 13. 3.3V TRANSIENT RESPONSE
Submit Document Feedback 11
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June 9, 2015
11 Page | ||
| Páginas | Total 25 Páginas | |
| PDF Descargar | [ Datasheet ISL8200M.PDF ] | |
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