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IRHM8230 の電気的特性と機能

IRHM8230のメーカーはInternational Rectifierです、この部品の機能は「(IRHM7230 / IRHM8230) REPETITIVE AVALANCHE AND dv/dt RATED HEXFET TRANSISTOR」です。


製品の詳細 ( Datasheet PDF )

部品番号 IRHM8230
部品説明 (IRHM7230 / IRHM8230) REPETITIVE AVALANCHE AND dv/dt RATED HEXFET TRANSISTOR
メーカ International Rectifier
ロゴ International Rectifier ロゴ 




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IRHM8230 Datasheet, IRHM8230 PDF,ピン配置, 機能
www.datasheet4u.com
PD - 90713C
REPETITIVE AVALANCHE AND dv/dt RATED
HEXFET® TRANSISTOR
IRHM7230
IRHM8230
N CHANNEL
MEGA HARD RAD
200Volt, 0.40, MEGA RAD HARD HEXFET
International Rectifier’s RAD HARD technology
HEXFETs demonstrate excellent threshold voltage
stability and breakdown voltage stability at total
radiaition doses as high as 1x106 Rads(Si). Under
identical pre- and post-irradiation test conditions, In-
ternational Rectifier’s RAD HARD HEXFETs retain
identical electrical specifications up to 1 x 105 Rads
(Si) total dose. No compensation in gate drive circuitry
is required. These devices are also capable of surviv-
ing transient ionization pulses as high as 1 x 1012 Rads
(Si)/Sec, and return to normal operation within a few
microseconds. Since the RAD HARD process utilizes
International Rectifier’s patented HEXFET technology,
the user can expect the highest quality and reliability
in the industry.
RAD HARD HEXFET transistors also feature all of
the well-established advantages of MOSFETs, such
as voltage control, very fast switching, ease of paral-
leling and temperature stability of the electrical pa-
rameters. They are well-suited for applications such
as switching power supplies, motor controls, invert-
ers, choppers, audio amplifiers and high-energy
pulse circuits in space and weapons environments.
Absolute Maximum Ratings 
Product Summary
Part Number
BVDSS
IRHM7230
200V
IRHM8230
200V
RDS(on)
0.40Ω
0.40Ω
ID
9.0A
9.0A
Features:
n Radiation Hardened up to 1 x 106 Rads (Si)
n Single Event Burnout (SEB) Hardened
n Single Event Gate Rupture (SEGR) Hardened
n Gamma Dot (Flash X-Ray) Hardened
n Neutron Tolerant
n Identical Pre- and Post-Electrical Test Conditions
n Repetitive Avalanche Rating
n Dynamic dv/dt Rating
n Simple Drive Requirements
n Ease of Paralleling
n Hermetically Sealed
n Electrically Isolated
n Ceramic Eyelets
Pre-Irradiation
ID @ VGS = 12V, TC = 25°C
ID @ VGS = 12V, TC = 100°C
IDM
PD @ TC = 25°C
VGS
EAS
IAR
EAR
dv/dt
TJ
TSTG
Parameter
IRHM7230, IRHM8230 Units
Continuous Drain Current
Continuous Drain Current
9.0
6.0 A
Pulsed Drain Current ‚
36
Max. Power Dissipation
75 W
Linear Derating Factor
0.60
W/°C
Gate-to-Source Voltage
±20 V
Single Pulse Avalanche Energy ƒ
330
mJ
Avalanche Current ‚
9.0 A
Repetitive Avalanche Energy‚
7.5 mJ
Peak Diode Recovery dv/dt „
Operating Junction
Storage Temperature Range
5.0
-55 to 150
V/ns
oC
Lead Temperature
Weight
300 (0.063 in. (1.6mm) from case for 10s)
9.3 (typical)
g
www.irf.com
1
10/14/98

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IRHM8230 pdf, ピン配列
wwRwa.ddatiaasthieoent4uC.chomaracteristics
IRHM7230, IRHM8230 Devices
Radiation Performance of Rad Hard HEXFETs
International Rectifier Radiation Hardened HEXFETs
are tested to verify their hardness capability. The hard-
ness assurance program at International Rectifier
comprises three radiation environments.
Every manufacturing lot is tested in a low dose rate
(total dose) environment per MIL-STD-750, test
method 1019 condition A. International Rectifier has
imposed a standard gate condition of 12 volts per
note 6 and a VDS bias condition equal to 80% of the
device rated voltage per note 7. Pre- and post- irra-
diation limits of the devices irradiated to 1 x 105 Rads
(Si) are identical and are presented in Table 1, col-
umn 1, IRHM7230. Post-irradiation limits of the de-
vices irradiated to 1 x 106 Rads (Si) are presented in
Table 1, column 2, IRHM8230. The values in Table 1
will be met for either of the two low dose rate test
circuits that are used. Both pre- and post-irradiation
performance are tested and specified using the same
drive circuitry and test conditions in order to provide a
direct comparison.
High dose rate testing may be done on a special re-
quest basis using a dose rate up to 1 x 1012 Rads (Si)/
Sec (See Table 2).
International Rectifier radiation hardened HEXFETs
have been characterized in heavy ion Single Event
Effects (SEE) environments. Single Event Effects char-
acterization is shown in Table 3.
Table 1. Low Dose Rate † ‡
Parameter
IRHM7230 IRHM8230
100K Rads (Si) 1000K Rads (Si) Units
Min Max Min Max
Test Conditions ‰
BVDSS
VGS(th)
Drain-to-Source Breakdown Voltage 200 — 200 —
Gate Threshold Voltage …
2.0 4.0 1.25 4.5
V
VGS = 0V, ID = 1.0mA
VGS = VDS, ID = 1.0mA
IGSS
IGSS
Gate-to-Source Leakage Forward — 100 — 100 nA
Gate-to-Source Leakage Reverse — -100 — -100
VGS = 20V
VGS = -20 V
IDSS
Zero Gate Voltage Drain Current
— 25 — 25 µA VDS=0.8 x Max Rating, VGS =0V
RDS(on)1 Static Drain-to-Source …
On-State Resistance One
— 0.40 — 0.53
VGS = 12V, ID = 6A
VSD Diode Forward Voltage …
— 1.6 — 1.6 V TC = 25°C, IS = 9A, VGS = 0V
Table 2. High Dose Rate ˆ
Parameter
VDSS Drain-to-Source Voltage
IPP
di/dt
L1
1011 Rads (Si)/sec 1012 Rads (Si)/sec
Min Typ Max Min Typ Max Units
Test Conditions
— — 160 — — 160 V Applied drain-to-source voltage during
gamma-dot
— 20 — — 20 — A Peak radiation induced photo-current
— — 160 — — 8.0 A/µsec Rate of rise of photo-current
1.0 — — 20 — — µH Circuit inductance required to limit di/dt
Table 3. Single Event Effects
LET (Si)
Ion (MeV/mg/cm2)
Cu 28
Fluence
(ions/cm2)
3x 105
Range
(µm)
~43
VDSBias
(V)
180
VGS Bias
(V)
-5
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3


3Pages


IRHM8230 電子部品, 半導体
wwIRw.HdaMtas7h2e3et04u,.IcRomHM8230 Devices
Note: Bias Conditions during radiation: VGS = 12 Vdc, VDS = 0 Vdc
Radiation Characterstics
Fig 10. Typical Output Characteristics
Pre-Irradiation
Fig 11. Typical Output Characteristics
Post-Irradiation 100K Rads (Si)
Fig 12. Typical Output Characteristics
Post-Irradiation 300K Rads (Si)
6
Fig 13. Typical Output Characteristics
Post-Irradiation 1 Mega Rads(Si)
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部品番号部品説明メーカ
IRHM8230

(IRHM7230 / IRHM8230) REPETITIVE AVALANCHE AND dv/dt RATED HEXFET TRANSISTOR

International Rectifier
International Rectifier


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