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PDF IXDF402 Data sheet ( Hoja de datos )

Número de pieza IXDF402
Descripción (IXDx402) 2 Ampere Dual Low-Side Ultrafast MOSFET Drivers
Fabricantes IXYS Corporation 
Logotipo IXYS Corporation Logotipo



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No Preview Available ! IXDF402 Hoja de datos, Descripción, Manual

IXDN402 / IXDI402 / IXDF402
2 Ampere Dual Low-Side Ultrafast MOSFET Drivers
Features
• Built using the advantages and compatibility
of CMOS and IXYS HDMOSTM processes
• Latch-Up Protected Over Entire
Operating Range
• High Peak Output Current: 2A Peak
• Wide Operating Range: 4.5V to 25V
www.DataSheHeti4gUh.cComapacitive Load
Drive Capability: 1000pF in <10ns
• Matched Rise And Fall Times
• Low Propagation Delay Time
• Low Output Impedance
• Low Supply Current
• Two Drivers in Single Chip
Applications
• Driving MOSFETs and IGBTs
• Motor Controls
• Line Drivers
• Pulse Generators
• Local Power ON/OFF Switch
• Switch Mode Power Supplies (SMPS)
• DC to DC Converters
• Pulse Transformer Driver
• Class D Switching Amplifiers
General Description
The IXDN402/IXDI402/IXDF402 consists of two 2 Amp
CMOS high speed MOSFET drivers. Each output can
source and sink 2A of peak current while producing voltage
rise and fall times of less than 15ns to drive the latest IXYS
MOSFETs & IGBTs. The input of the driver is TTL or CMOS
compatible and is fully immune to latch up over the entire
operating range. A patent-pending circuit virtually eliminates
cross conduction and current shoot-through. Improved
speed and drive capabilities are further enhanced by very
low and matched rise and fall times.
The IXDN402 is configured as a dual non-inverting gate
driver, the IXDI402 as a dual inverting gate driver, and the
IXDF402 as a dual inverting + non-inverting gate driver.
The IXDN402/IXDI402/IXDF402 family are available in the
standard 8 pin P-DIP (PI), SOP-8 (SIA) and SOP-16 (SIA-
16) packages. For enhanced thermal performance, the
SOP-8 and SOP-16 are also available with an exposed
grounded backmetal package as the SI and SI-16 respec-
tively.
Ordering Information
Part Number
Package Type
Temp. Range
IXDN402PI
IXDN402SI
IXDN402SIA
IXDN402SI-16
8-Pin PDIP
8-Pin SOIC with Grounded Backmetal
8-Pin SOIC
16-Pin SOIC with Grounded Backmetal
-55°C to
+125°C
IXDN402SIA-16 16-Pin SOIC
IXDI402PI
8-Pin PDIP
IXDI402SI
IXDI402SIA
IXDI402SI-16
8-Pin SOIC with Grounded Backmetal
8-Pin SOIC
16-Pin SOIC with Grounded Backmetal
-55°C to
+125°C
IXDI402SIA-16 16-Pin SOIC
IXDF402PI
8-Pin PDIP
IXDF402SI
IXDF402SIA
IXDF402SI-16
IXDF402SIA-16
8-Pin SOIC with Grounded Backmetal
8-Pin SOIC
16-Pin SOIC with Grounded Backmetal
16-Pin SOIC
-55°C to
+125°C
NOTE: Mounting or solder tabs on all packages are connected to ground
Configuration
Dual Non
Inverting
Dual Inverting
Inverting + Non
Inverting
Copyright © IXYS CORPORATION 2002
First Release

1 page




IXDF402 pdf
IXDN402 / IXDI402 / IXDF402
Fig. 3
90
Typical Performance Characteristics
Output Rise Time vs. Supply Voltage
CL = 100pF to 6800pF
Fig. 4
60
Output Fall Time vs. Supply Voltage
CL = 100pF to 6800pF
80
70
60
50
40
30
www.Data2S0 heet4U.com
10
0
8
Fig. 5
12
10 12 14 16
Supply Voltage (V)
Output RiseAndFall Times vs. CaseTemperature
CL=1000pF, Vcc =18V
6800 pF
3900 pF
2200 pF
1000 pF
470 pF
100 pF
18
50
40
30
20
10
0
8
Fig. 6
90
10 12 14 16
Supply Voltage (V)
Output Rise Times vs. Load Capacitance
10
tR
80
70
8
tF
6
60
50
40
4 30
20
2
10
0
-60 -40 -20
0 20 40 60 80 100 120 140
Temperature (C)
0
0 1000 2000 3000 4000 5000 6000
Load Capacitance (pF)
6800 pF
3900 pF
2200 pF
1000 pF
470 pF
100 pF
18
8V
10V
12V
14V
16V
18V
7000
Fig. 7
50
45
40
35
30
25
20
15
10
5
0
0
Output Fall Times vs. Load Capacitance
8V
10V
12V
1146VV
18V
1000
2000
3000
4000
5000
6000
7000
Load Capacitance (pF)
Fig. 8
3.5
3.3
3.1
2.9
2.7
2.5
2.3
2.1
1.9
1.7
1.5
-60 -40 -20
Max/ MinInput vs. Temperature
CL = 1000 pF Vcc = 18V
MinimumInput High
MaximumInput Low
0 20 40 60 80 100 120 140
Temperature (C)
5

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