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IR130CSP PDF Datasheet ( 特性, スペック, ピン接続図 )

部品番号 IR130CSP
部品説明 Flipky
メーカ International Rectifier
ロゴ International Rectifier ロゴ 



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IR130CSP Datasheet, IR130CSP PDF,ピン配置, 機能
www.DataSheet4U.com FlipkyTM
Features
z Ultra Low VF per Footprint Area
z Low Thermal Resistance
z One-fifth Footprint of SMA
z Super Low Profile (<.8mm)
z Available Tested on Tape & Reel
Bulletin I0182J 08/05
IR130CSP
1 Amp
FlipkyTM
Major Ratings and Characteristics
Characteristics
IR130CPS Units
IF(AV) Rectangular waveform
1.0
A
VRRM
IFSM @ tp = 5 µs sine
VF @ 1.0 Apk, TJ=125°C
30
220
0.33
V
A
V
TJ range
- 55 to 150
°C
Description
True chip-scale packaging is available from International
Rectifier. The IR130CPS surface-mount Schottky recti-
fier has been designed for applications requiring low
forward drop and very small foot prints on PC boards.
Typical applications are in disk drives, switching power
supplies, converters, free-wheeling diodes, battery
charging, and reverse battery protection.
z Small foot print, surface mountable
z Low forward voltage drop
z High frequency operation
z Guard ring for enhanced ruggedness and long term
reliability
The FlipkyTM package, is one-fifth the footprint of a
comparable SMA package and has a profile of less then
.8mm. Combined with the low thermal resistance of the
die level device, this makes the FlipkyTM the best device
for application where printed circuit board space is at a
premium and in extremely thin application environments
such as battery packs, cell phones and PCMCIA cards.
www.irf.com
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