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UPD78F0883 の電気的特性と機能

UPD78F0883のメーカーはNECです、この部品の機能は「(UPD78F088x) 8-Bit Single-Chip Microcontrollers」です。


製品の詳細 ( Datasheet PDF )

部品番号 UPD78F0883
部品説明 (UPD78F088x) 8-Bit Single-Chip Microcontrollers
メーカ NEC
ロゴ NEC ロゴ 




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UPD78F0883 Datasheet, UPD78F0883 PDF,ピン配置, 機能
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User’s Manual
78K0/FC2
8-Bit Single-Chip Microcontrollers
μPD78F0881(A)
μPD78F0882(A)
μPD78F0883(A)
μPD78F0884(A)
μPD78F0885(A)
μPD78F0886(A)
μPD78F0881(A2)
μPD78F0882(A2)
μPD78F0883(A2)
μPD78F0884(A2)
μPD78F0885(A2)
μPD78F0886(A2)
The 78K0/FC2 has an on-chip debug function.
Do not use this product for mass production after the on-chip debug function has been used because its reliability cannot
be guaranteed, due to issues with respect to the number of times the flash memory can be rewritten. NEC Electronics
does not accept complaints concerning when use this product for mass production after the on-chip debug function has
been used.
Document No. U17555EJ3V0UD00 (3rd edition)
Date Published October 2006 NS CP(K)
Printed in Japan
2005

1 Page





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NOTES FOR CMOS DEVICES
1 VOLTAGE APPLICATION WAVEFORM AT INPUT PIN
Waveform distortion due to input noise or a reflected wave may cause malfunction. If the input of the
CMOS device stays in the area between VIL (MAX) and VIH (MIN) due to noise, etc., the device may
malfunction. Take care to prevent chattering noise from entering the device when the input level is fixed,
and also in the transition period when the input level passes through the area between VIL (MAX) and
VIH (MIN).
2 HANDLING OF UNUSED INPUT PINS
Unconnected CMOS device inputs can be cause of malfunction. If an input pin is unconnected, it is
possible that an internal input level may be generated due to noise, etc., causing malfunction. CMOS
devices behave differently than Bipolar or NMOS devices. Input levels of CMOS devices must be fixed
high or low by using pull-up or pull-down circuitry. Each unused pin should be connected to VDD or GND
via a resistor if there is a possibility that it will be an output pin. All handling related to unused pins must
be judged separately for each device and according to related specifications governing the device.
3 PRECAUTION AGAINST ESD
A strong electric field, when exposed to a MOS device, can cause destruction of the gate oxide and
ultimately degrade the device operation. Steps must be taken to stop generation of static electricity as
much as possible, and quickly dissipate it when it has occurred. Environmental control must be
adequate. When it is dry, a humidifier should be used. It is recommended to avoid using insulators that
easily build up static electricity. Semiconductor devices must be stored and transported in an anti-static
container, static shielding bag or conductive material. All test and measurement tools including work
benches and floors should be grounded. The operator should be grounded using a wrist strap.
Semiconductor devices must not be touched with bare hands. Similar precautions need to be taken for
PW boards with mounted semiconductor devices.
4 STATUS BEFORE INITIALIZATION
Power-on does not necessarily define the initial status of a MOS device. Immediately after the power
source is turned ON, devices with reset functions have not yet been initialized. Hence, power-on does
not guarantee output pin levels, I/O settings or contents of registers. A device is not initialized until the
reset signal is received. A reset operation must be executed immediately after power-on for devices
with reset functions.
5 POWER ON/OFF SEQUENCE
In the case of a device that uses different power supplies for the internal operation and external
interface, as a rule, switch on the external power supply after switching on the internal power supply.
When switching the power supply off, as a rule, switch off the external power supply and then the
internal power supply. Use of the reverse power on/off sequences may result in the application of an
overvoltage to the internal elements of the device, causing malfunction and degradation of internal
elements due to the passage of an abnormal current.
The correct power on/off sequence must be judged separately for each device and according to related
specifications governing the device.
6 INPUT OF SIGNAL DURING POWER OFF STATE
Do not input signals or an I/O pull-up power supply while the device is not powered. The current
injection that results from input of such a signal or I/O pull-up power supply may cause malfunction and
the abnormal current that passes in the device at this time may cause degradation of internal elements.
Input of signals during the power off state must be judged separately for each device and according to
related specifications governing the device.
User’s Manual U17555EJ3V0UD
3


3Pages


UPD78F0883 電子部品, 半導体
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INTRODUCTION
Readers
Purpose
Organization
This manual is intended for user engineers who wish to understand the functions of the
78K0/FC2 and design and develop application systems and programs for these devices.
The target products are as follows.
78K0/FC2: μPD78F0881 (A), 78F0882 (A), 78F0883 (A), 78F0884 (A), 78F0885 (A),
78F0886 (A), 78F0881 (A2), 78F0882 (A2), 78F0883 (A2), 78F0884 (A2),
78F0885 (A2), 78F0886 (A2)
This manual is intended to give users an understanding of the functions described in the
Organization below.
The 78K0/FC2 manual is separated into two parts: this manual and the instructions
edition (common to the 78K/0 Series).
78K0/FC2
User’s Manual
(This Manual)
78K/0 Series
User’s Manual
Instructions
Pin functions
Internal block functions
Interrupts
Other on-chip peripheral functions
Electrical specifications
CPU functions
Instruction set
Explanation of each instruction
How to Read This Manual It is assumed that the readers of this manual have general knowledge of electrical
engineering, logic circuits, and microcontrollers.
When using this manual as the manual for (A) and (A2) grade products:
Only the quality grade differs between (A) grade products and (A2) grade
products.
Read the part number as follows.
μPD78F0881μPD78F0881 (A), 78F0881 (A2)
μPD78F0882μPD78F0882 (A), 78F0882 (A2)
μPD78F0883μPD78F0883 (A), 78F0883 (A2)
μPD78F0884μPD78F0894 (A), 78F0894 (A2)
μPD78F0885μPD78F0885 (A), 78F0885 (A2)
μPD78F0886μPD78F0886 (A), 78F0886 (A2)
To gain a general understanding of functions:
Read this manual in the order of the CONTENTS. The mark <R> shows major
revised points.
How to interpret the register format:
For a bit number enclosed in brackets, the bit name is defined as a reserved word
in the assembler, and is already defined in the header file named sfrbit.h in the C
compiler.
To check the details of a register when you know the register name:
Refer to APPENDIX C REGISTER INDEX.
Conventions
6
Data significance:
Higher digits on the left and lower digits on the right
Active low representations: ××× (overscore over pin and signal name)
Note:
Footnote for item marked with Note in the text.
Caution:
Information requiring particular attention
Remark:
Supplementary information
Numerical representations: Binary
...×××× or ××××B
Decimal
...××××
Hexadecimal ...××××H
User’s Manual U17555EJ3V0UD

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共有リンク

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部品番号部品説明メーカ
UPD78F0881

(UPD78F088x) 8-Bit Single-Chip Microcontrollers

NEC
NEC
UPD78F0881A

(UPD78F088x) 8-Bit Single-Chip Microcontrollers

NEC
NEC
UPD78F0881A2

(UPD78F088x) 8-Bit Single-Chip Microcontrollers

NEC
NEC
UPD78F0882

(UPD78F088x) 8-Bit Single-Chip Microcontrollers

NEC
NEC


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