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F1047B の電気的特性と機能

F1047BのメーカーはOsram Opto Semiconductorsです、この部品の機能は「Infrared Emitting Diode Chip」です。


製品の詳細 ( Datasheet PDF )

部品番号 F1047B
部品説明 Infrared Emitting Diode Chip
メーカ Osram Opto Semiconductors
ロゴ Osram Opto Semiconductors ロゴ 




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F1047B Datasheet, F1047B PDF,ピン配置, 機能
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GaAlAs-Infrarot-Lumineszenzdiode (880 nm)
GaAlAs Infrared Emitting Diode (880 nm)
F 1047A
F 1047B
Vorläufige Daten / Preliminary Data
Wesentliche Merkmale
• Typ. Gesamtleistung: 22 mW @ 100 mA im
TOPLED® Gehäuse
Chipgröße 300 x 300 µm2
GaAlAs-LED mit sehr hohem Wirkungsgrad
Hohe Zuverlässigkeit
Hohe Impulsbelastbarkeit
Gute spektrale Anpassung an
Si-Fotoempfänger
Vorderseitenmetallisierung: Aluminium
Rückseitenmetallisierung: Goldlegierung
Lieferung: vereinzelt auf Folie
Features
Typ. total radiant power: 22 mW @ 100 mA in
TOPLED® package.
Chipsize: 300 x 300 µm²
Very highly efficient GaAlAs LED
High reliability
High pulse handling capability
Good spectral match to silicon photodetectors
Frontside metallization: aluminum
Backside metallization: gold alloy
Delivery: diced on foil
Anwendungen
IIR-Fernsteuerung von Fernseh-, Rundfunk-
und Videogeräten, Lichtdimmern
Gerätefernsteuerungen für Gleich- und
Wechsellichtbetrieb
Lichtschranken bis 500 kHz
Sensorik
Diskrete Optokoppler
Applications
IR remote control for hifi and TV sets, video
tape recorder, dimmers
Remote control for steady and varying
intensity
Light-reflection switches (max. 500 kHz)
Sensor technology
Discrete optocouplers
Typ
Type
F 1047A
F 1047B
Bestellnummer
Ordering Code
Q67220-C1386
on request
Beschreibung
Description
Infrarot emittierender Chip, Oberseite Kathodenanschluss
Infrared emitting die, top side cathode connection
Infrarot emittierender Chip, Oberseite Kathodenanschluss,
Oberfläche aufgerauht.
Infrared emitting die, top side cathode connection, surface
frosted
2003-04-11
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F1047B pdf, ピン配列
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F 1047A, F 1047B
Mechanische Werte
Mechanical values
Bezeichnung
Parameter
Symbol
Symbol
Wert
Value1)
Einheit
Unit
min. typ.
max.
Chipkantenlänge (x-Richtung)
Length of chip edge (x-direction)
Lx
0.28 0.30
0.32 mm
Chipkantenlänge (y-Richtung)
Length of chip edge (y-direction)
Ly
0.28 0.30
0.32 mm
Durchmesser des Wafers
Diameter of the wafer
D 48 mm
Chiphöhe
Die height
H 210 µm
Bondpaddurchmesser
Diameter of bondpad
d 130 µm
Weitere Informationen
Additional information2)
Vorderseitenmetallisierung
Metallization frontside
Aluminium
Aluminum
Rückseitenmetallisierung
Metallization backside
Goldlegierung
Au-Alloy
Trennverfahren
Dicing
Sägen
Sawing
Verbindung Chip - Träger
Die bonding
Kleben
Glueing
1) Typical (refered to as typ.) data are defined as long-term production mean values and are only given for information.
This is not a specified value
2) All chips are checked according to the following procedure and the OSRAM OS specification of the visual inspection
A63501-Q0013-N001-*-76G3:The visual inspection shall be made in accordance to the "specification of the visual
inspection" as referenced.The visual inspection of chip backside is performed by eye for 100% of the area of each
wafer. If decisions (good/bad) are not possible additional a stereo microscope with incident light with 40x-80x
magnification is used. Areas > ¼ cm² which have an amount of more than 5% failed dies will be marked manually with
pen.The visual inspection of chip frontside is performed by a stereo microscope with incident light with 40x-80x
magnification for 100% of the area of each wafer.Areas greater than 5x5 mm² and with a failure density higher than
25% are marked by pen and inked around. Areas with failure density higher than 10% each failure die is inked
individually.The inked area from backside must be transfered to frontside and has to be marked manually with pen and
inked around.The quality inspection (final visual inspection) is performed by production. An additional visual
inspection step as special release procedure by QM after the final visual inspection is not installed.
2003-04-11
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F1047B 電子部品, 半導体
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Maßzeichnung
Chip Outlines
F 1047A, F 1047B
n-contact
p-contact
GMOY6031
Maße werden als typische1) Werte wie folgt angegeben: mm (inch) / Dimensions are specified as typical1) values as
follows: mm (inch).
Published by OSRAM Opto Semiconductors GmbH
Wernerwerkstrasse 2, D-93049 Regensburg
© All Rights Reserved.
Attention please!
The information generally describes the type of component and shall not be considered as assured characteristics or
detailed specification.
Terms of delivery and rights to change design reserved. Due to technical requirements components may contain
dangerous substances. For information on the types in question please contact our sales organization.
Handling and Storage Conditions:
The hermetically sealed shipment lot shall be opened under temperature and moisture controlled cleanroom
environment only. Customer has to follow the according rules for disposition of material that can be hazardous for
humans and environment.
Packing
Chips are placed on a blue foil, which is fixed in a yellow frame of 5diameter.
For shipment the wafers of a shipment lot are arranged to stacks. The top and bottom of the stack is covered by a
dummy disk to protect the top and bottom wafer from damage. The whole package is fixed by rubber strings and
hermetically sealed in a plastic bag for storage and shipment. Please use the recycling operators known to you. We can
also help you get in touch with your nearest sales office. By agreement we will take packing material back, if it is
sorted. You will have to bear the costs of transport. For packing material that is returned to us unsorted or which we are
not obliged to accept, we shall have to invoice you for any costs incurred.
Further Conditions:
If not otherwise arranged, the General Conditions for the supply of products and services of the electrical and
electronics industryapply for any shipment, just as the Supplier Addendum " Chip business" to the General Conditions
for the supply of products and services of the electrical and electronics industry. If these documents are not familiar to
you, please request them at our nearest sales office.
Components used in life-support devices or systems must be expressly authorized by us for such purpose!
Critical components2), may only be used in life-support devices or systems3) with the express written approval of
OSRAM OS.
1) Typical (refered to as typ.) data are defined as long-term production mean values and are only given for information.
This is not a specified value.
2)A critical component is a component used in a life-support device or system whose failure can reasonably be expected to
cause the failure of that life-support device or system, or to affect its safety or effectiveness of that device or system.
3)Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain
and sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered.
2003-04-11
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共有リンク

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部品番号部品説明メーカ
F1047A

Infrared Emitting Diode Chip

Osram Opto Semiconductors
Osram Opto Semiconductors
F1047B

Infrared Emitting Diode Chip

Osram Opto Semiconductors
Osram Opto Semiconductors


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