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PDF HSMP-3810 Data sheet ( Hoja de datos )
| Número de pieza | HSMP-3810 | |
| Descripción | (HSMP-38xx / HSMP-48xx) Surface Mount PIN Diodes | |
| Fabricantes | Agilent | |
| Logotipo |  |
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Surface Mount PIN Diodes
Technical Data
HSMP-38XX and
HSMP-48XX Series
Features
• Diodes Optimized for:
Low Current Switching
Low Distortion Attenuating
Ultra-Low Distortion
Switching
Microwave Frequency
Operation
• Surface Mount SOT-23 and
SOT-143 Packages
Single and Dual Versions
Tape and Reel Options
Available
• Low Failure in Time (FIT)
Rate[1]
Note:
1. For more information see the
Surface Mount PIN Reliability Data
Sheet.
Description/Applications
The HSMP-380X and HSMP-381X
series are specifically designed for
low distortion attenuator applica-
tions. The HSMP-382X series is
optimized for switching applica-
tions where ultra-low resistance is
required. The HSMP-3880 switch-
ing diode is an ultra low distortion
device optimized for higher power
applications from 50 MHz to
1.5 GHz. The HSMP-389X series is
optimized for switching applica-
tions where low resistance at low
current and low capacitance are
required. The HSMP-48XX series
are special products featuring
ultra low parasitic inductance in
the SOT-23 package, specifically
designed for use at frequencies
which are much higher than the
upper limit for conventional
SOT-23 PIN diodes. The
HSMP-4810 diode is a low distor-
tion attenuating PIN designed for
operation to 3 GHz. The
HSMP-4820 diode is ideal for
limiting and low inductance
switching applications up to
1.5 GHz. The HSMP-4890 is
optimized for low current switch-
ing applications up to 3 GHz.
The HSMP-386X series of general
purpose PIN diodes are designed
for two classes of applications.
The first is attenuators where
current consumption is the most
important design consideration.
The second application for this
series of diodes is in switches
where low cost is the driving
issue for the designer.
The HSMP-386X series Total
Capacitance (CT) and Total
Resistance (RT) are typical
specifications. For applications
that require guaranteed perfor-
mance, the general purpose
HSMP-383X series is recom-
mended. For low distortion
Package Lead Code
Identification
SINGLE
#0
SERIES
COMMON
ANODE
#2
COMMON
CATHODE
#3
UNCONNECTED
PAIR
#4
DUAL ANODE
#5
DUAL CATHODE
#A #B
attenuators, the HSMP-380X or
-381X series are recommended.
For high performance switching
applications, the HSMP-389X
series is recommended.
A SPICE model is not available
for PIN diodes as SPICE does not
provide for a key PIN diode
characteristic, carrier lifetime.
1 page  
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5
Typical Parameters (continued)
1000
HSMP-3830
100
VR = 5V
VR = 10V
VR = 20V
1000
900
800
700
600
500
400
300
200
VR = 5 V
VR = 10 V
VR = 20 V
10
10 20 30
FORWARD CURRENT (mA)
Figure 10. Reverse Recovery Time vs.
Forward Current for Various Reverse
Voltage. HSMP-3830 Series.
100
HSMP-3800
10
100
10 15 20 25 30
FORWARD CURRENT (mA)
Figure 11. Typical Reverse Recovery
Time vs. Reverse Voltage. HSMP-3880
Series.
100
HSMP-3810
HSMP-4810
10
200
160
VR = –2 V
120
80
VR = –5 V
40
VR = –10 V
0
10 15
20 25
30
FORWARD CURRENT (mA)
Figure 12. Typical Reverse Recovery
Time vs. Reverse Voltage. HSMP-3890
Series.
100
HSMP-382X
HSMP-482X
10
1 11
0.1
0.01
0
125°C 25°C –50°C
0.2 0.4 0.6 0.8 1.0 1.2
VF – FORWARD VOLTAGE (mA)
Figure 13. Forward Current vs.
Forward Voltage. HSMP-3800 Series.
0.1
0.01
0
125°C 25°C –50°C
0.2 0.4 0.6 0.8 1.0 1.2
VF – FORWARD VOLTAGE (mA)
Figure 14. Forward Current vs.
Forward Voltage. HSMP-3810 and
HSMP-4810 Series.
0.1
0.01
0
125°C 25°C –50°C
0.2 0.4 0.6 0.8 1.0 1.2
VF – FORWARD VOLTAGE (mA)
Figure 15. Forward Current vs.
Forward Voltage. HSMP-3820 and
HSMP-4820 Series.
100
HSMP-3830
10
1
0.1
0.01
0
125°C 25°C –50°C
0.2 0.4 0.6 0.8 1.0 1.2
VF – FORWARD VOLTAGE (mA)
Figure 16. Forward Current vs.
Forward Voltage. HSMP-3830 Series.
100
10
1
0.1
125°C 25°C –55°C
0.01
0 0.2 0.4 0.6 0.8 1.0 1.2
VF – FORWARD CURRENT (mA)
Figure 17. Forward Current vs.
Forward Voltage. HSMP-3880 Series.
100
10
1
0.1
0.01
0
125°C 25°C
–55°C
0.2 0.4 0.6 0.8 1.0 1.2
VF – FORWARD VOLTAGE (mA)
Figure 18. Forward Current vs.
Forward Voltage. HSMP-3890 and
HSMP-4890 Series.
5 Page 
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11
Package Dimensions
Outline 23 (SOT-23)
1.02 (0.040)
0.89 (0.035)
PACKAGE
MARKING
CODE (XX)
0.50 (0.024)
0.45 (0.018)
0.54 (0.021)
0.37 (0.015)
DATE CODE (X)
3
XXX
12
2.04 (0.080)
1.78 (0.070)
TOP VIEW
1.40 (0.055)
1.20 (0.047)
2.65 (0.104)
2.10 (0.083)
3.06 (0.120)
2.80 (0.110)
0.152 (0.006)
0.066 (0.003)
1.02 (0.041)
0.85 (0.033)
0.10 (0.004)
0.013 (0.0005)
SIDE VIEW
0.69 (0.027)
0.45 (0.018)
END VIEW
DIMENSIONS ARE IN MILLIMETERS (INCHES)
Outline 143 (SOT-143)
PACKAGE
MARKING
CODE (XX)
EC
XXX
0.92 (0.036)
0.78 (0.031)
DATE CODE (X)
1.40 (0.055)
1.20 (0.047)
2.65 (0.104)
2.10 (0.083)
BE
0.60 (0.024)
0.45 (0.018)
2.04 (0.080)
1.78 (0.070)
3.06 (0.120)
2.80 (0.110)
0.54 (0.021)
0.37 (0.015)
0.15 (0.006)
0.09 (0.003)
1.04 (0.041)
0.85 (0.033)
0.10 (0.004)
0.013 (0.0005)
DIMENSIONS ARE IN MILLIMETERS (INCHES)
PC Board Footprints
SOT-23
0.037
0.95
0.037
0.95
0.035
0.9
DIMENSIONS IN
inches
mm
0.079
2.0
0.031
0.8
SOT-143
0.69 (0.027)
0.45 (0.018)
0.112
2.85
0.079
2
0.033
0.85
0.075
1.9
0.071
1.8
0.041 0.108
1.05 2.75
0.033
0.85
0.047 0.031 0.033
1.2 0.8 0.85
DIMENSIONS IN
inches
mm
Package Characteristics
Lead Material ...................................................................................... Alloy 42
Lead Finish ............................................................................ Tin-Lead 85-15%
Maximum Soldering Temperature .............................. 260°C for 5 seconds
Minimum Lead Strength .......................................................... 2 pounds pull
Typical Package Inductance .................................................................. 2 nH
Typical Package Capacitance .............................. 0.08 pF (opposite leads)
11 Page | ||
| Páginas | Total 12 Páginas | |
| PDF Descargar | [ Datasheet HSMP-3810.PDF ] | |
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