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PDF UC62LV0256 Data sheet ( Hoja de datos )

Número de pieza UC62LV0256
Descripción Low Power CMOS SRAM 32K X8 Bits
Fabricantes ETC 
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No Preview Available ! UC62LV0256 Hoja de datos, Descripción, Manual

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Low Power CMOS SRAM
32K X8 Bits
UC62LV0256
-35/-55/-70
Features:
• Vcc operation voltage : 2.0V ~ 3.6V
• Low power consumption :
10mA (Max.) operating current
0.1uA (Typ.) CMOS standby current
• High Speed Access time :
35ns (Max.) at Vcc = 2.7V
55ns (Max.) at Vcc = 2.7V
70ns (Max.) at Vcc = 2.0V
• Automatic power down when chip is deselected
• Three state outputs and TTL compatible
• Data retention supply voltage as low as 1.2V
• Easy expansion with CE\ and OE\ options
PRODUCT FAMILY
Product
Family
Operating
Temperature
Vcc Range
UC62LV0256BC
UC62LV0256CC
UC62LV0256DC
UC62LV0256EC
UC62LV0256AC
UC62LV0256BI
UC62LV0256CI
UC62LV0256DI
UC62LV0256EI
UC62LV0256AI
0 ~ 70
~ 85
2.0V ~ 3.6V
2.0V ~ 3.6V
Speed
(ns)
Vcc=2.7V
-35/ -55/ -70
-35/ -55/ -70
Description
The UC62LV0256 is a high performance, very low power
CMOS Static Random Access Memory organized as 32,768
words by 8 bits and operates from a wide range of 2.0V to
3.6V supply voltage. Advanced CMOS technology and circuit
techniques provide both high speed and low power features
with a typical CMOS standby current of 1uA and maximum
access time of 70ns in 2.0V operation.
Easy memory expansion is provided enable (CE), and
active LOW output enable (OE) and three-state output
drivers.
The UC62LV0256 has an automatic power down feature,
reducing the power consumption significantly when chip is
deselected.
The UC62LV0256 is available in the JEDEC standard 28 pin
330mil Plastic SOP, 300mil Plastic SOJ, 600mil Plastic DIP
and 8mmx13.4mm TSOP (normal type).
Power Consumption
STANDBY VCC=3.6V Operating (Max)
Vcc=3.0V 35ns
55ns
70ns
0.1uA
17mA
13mA
10mA
0.1uA
17mA
13mA
10mA
Package
Type
SOP-28
TSOP-28
PDIP-28
SOJ-28
DICE
SOP-28
TSOP-28
PDIP-28
SOJ-28
DICE
PIN CONFIGURATIONS
A14
A12
A7
A6
A5
A4
A3
A2
A1
A0
DQ0
DQ1
DQ2
GND
1 28
2 27
3 UC62LV0256BI 26
4 UC62LV0256DI 25
5 UC62LV0256EI 24
6 UC62LV0256BC 23
UC62LV0256DC
7 UC62LV0256EC 22
8 21
9 20
10 19
11 18
12 17
13 16
14 15
VCC
WE
A13
A8
A9
A11
OE
A10
CE
DQ7
DQ6
DQ5
DQ4
DQ3
OE
A11
A9
A8
A13
WE
VCC
A14
A12
A7
A6
A5
A4
A3
1
2
3
4
5
6
7
8
9
10
11
12
13
14
UC62LV0256CC
UC62LV0256CI
28 A10
27 CE
26 DQ7
25 DQ6
24 DQ5
23 DQ4
22 DQ3
21 GND
20 DQ2
19 DQ1
18 DQ0
17 A0
16 A1
15 A2
BLOCK DIAGRAM
CE
WE
OE
ROW
Address
COL
Address
CE
WE
OE
MEMORY ARRAY
32K X 8 Bits
COLUMN DECODER
SENSE AMPLIFIER
&
WRITE DRIVER
X8
I/O BUFFER
U-Chip Technology Corp. LTD.
Reserves the right to modify document contents without notice.
Revision 2.0
PAGE 1

1 page




UC62LV0256 pdf
www.DataSheet4U.com
Low Power CMOS SRAM
32K X8 Bits
SWITCHING WAVEFORMS (READ CYCLE)
READ CYCLE1 (1,2,4)
ADDRESS
DOUT
tRC
tOH tAA
UC62LV0256
-35/-55/-70
tOH
READ CYCLE2 (1,3,4)
CE
DOUT
READ CYCLE3 (1,4)
tCLZ(5)
ADDRESS
OE
CE
DOUT
tOLZ
tCLZ(5)
tCE
tRC
tAA
tOE
tCE
tCHZ(5)
tOH
tOHZ(1,5)
tCHZ(5)
NOTES:
1. WE\ is high in read cycle.
2. Device is continuously selected when CE\ = VIL
3. Address valid prior to or coincident with CE\ transition low.
4. OE\ = VIL.
5. Transition is measured ±500mV from steady state with CL=5pF as shown in Figure 1B. The
parameter is guaranteed but not 100% tested.
U-Chip Technology Corp. LTD.
Reserves the right to modify document contents without notice.
Revision 2.0
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