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Número de pieza | UPG2035T5F | |
Descripción | BROADBAND GaAs MMIC DPDT SWITCH | |
Fabricantes | CEL | |
Logotipo | ||
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DATA SHEET
NEC's BROADBAND
GaAs MMIC DPDT SWITCH UPG2035T5F
FOR 2.4 GHz AND 5 GHz WLAN
FEATURES
• OPERATING FREQUENCY:
2.4 to 2.5 GHz and 4.9 to 6.0 GHz (specified)
2.0 to 6.0 GHz Broadband Operation (unspecified)
• LOW INSERTION LOSS:
0.8 dB TYP. @ 2.4 to 2.5 GHz
1.2 dB TYP. @ 4.9 to 6.0 GHz
• POWER HANDLING:
Pin (1 dB) = +31 dBm TYP. @ 2.4 to 2.5 GHz
+30 dBm TYP. @ 4.9 to 6.0 GHz
• CONTROL VOLTAGE:
+3.0 V / 0 V (Dual control)
• HIGH ISOLATION:
INPUT to OUTPUT = 34 dB TYP. @ 2.4 to 2.5 GHz
INPUT to OUTPUT = 33 dB TYP. @ 4.9 to 6.0 GHz
TX to RX, ANT1 to ANT2 = 24 dB TYP. @ 2.4 to 2.5 GHz
TX to RX, ANT1 to ANT2 = 22 dB TYP. @ 4.9 to 6.0 GHz
• INPUT/OUTPUT RETURN LOSS:
15 dB TYP.
• SWITCHING SPEED:
50 ns @ tRISE/tFALL (10/90% RF)
• 12-PIN PLASTIC QFN PACKAGE:
(3.0 × 3.0 × 0.75 mm)
• Pb FREE
DESCRIPTION
NEC's UPG2035T5F is a GaAs MMIC DPDT switch
for 2.4 GHz and 5 GHz dualband Wireless LAN.
The UPG2035T5F features low insertion loss, high
isolation, and dualband operation.
APPLICATIONS
• 802.11a+b/g WIRELESS LAN
• 2.0 TO 6.0 GHz T/R SWITCHING
• 2.0 TO 6.0 GHz ANTENNA DIVERSITY SWITCHING
ORDERING INFORMATION
PART NUMBER ORDER NUMBER
PACKAGE
UPG2035T5F-E2-A UPG2035T5F-E2-A 12-pin plastic QFN
(Pb-Free)
MARKING
2035
SUPPLYING FORM
• Embossed tape 8 mm wide
• Pin 1 indicates roll-in direction of tape
• Qty 3 kpcs/reel
Remark To order evaluation samples, contact your nearby sales office.
Part number for sample order: UPG2035T5F-A
California Eastern Laboratories
1 page UPG2035T5F
ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD
CRF
Cbypass
CRF
Cbypass
CRF
CRF
USING THE NEC EVALUATION BOARD
SYMBOL
FORM
RATING
PART NUMBER
CRF
Cbypass
−
−
−
Chip Capacitor
Chip Capacitor
PC Terminal
RF Connector
PWB
4 pF
1 000 pF
−
−
−
GRM1552C1H4R0CZ01B
GRM155B11H102KA01B
A2-2PA-2.54DSA
142-0721-821
RO4003 (t = 0.51 mm)
MANUFACTURER
muRata
muRata
Hirose
Johnson
Rogers
5 Page UPG2035T5F
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered and mounted under the following recommended conditions. For soldering
methods and conditions other than those recommended below, contact your nearby sales office.
Soldering Method
Infrared Reflow
Wave Soldering
Partial Heating
Soldering Conditions
Peak temperature (package surface temperature)
Time at peak temperature
Time at temperature of 220°C or higher
Preheating time at 120 to 180°C
Maximum number of reflow processes
Maximum chlorine content of rosin flux (% mass)
: 260°C or below
: 10 seconds or less
: 60 seconds or less
: 120±30 seconds
: 3 times
: 0.2%(Wt.) or below
Peak temperature (molten solder temperature)
: 260°C or below
Time at peak temperature
: 10 seconds or less
Preheating temperature (package surface temperature) : 120°C or below
Maximum number of flow processes
: 1 time
Maximum chlorine content of rosin flux (% mass)
: 0.2%(Wt.) or below
Peak temperature (pin temperature)
Soldering time (per side of device)
Maximum chlorine content of rosin flux (% mass)
: 350°C or below
: 3 seconds or less
: 0.2%(Wt.) or below
Condition Symbol
IR260
WS260
HS350
Caution
Do not use different soldering methods together (except for partial heating).
Life Support Applications
These NEC products are not intended for use in life support devices, appliances, or systems where the malfunction of these products can reasonably
be expected to result in personal injury. The customers of CEL using or selling these products for use in such applications do so at their own risk and
agree to fully indemnify CEL for all damages resulting from such improper use or sale.
05/04/2005
A Business Partner of NEC Compound Semiconductor Devices, Ltd.
11 Page |
Páginas | Total 12 Páginas | |
PDF Descargar | [ Datasheet UPG2035T5F.PDF ] |
Número de pieza | Descripción | Fabricantes |
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