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Número de pieza | UPC2721GV | |
Descripción | SILICON MMIC L BAND DOWNCONVERTER | |
Fabricantes | CEL | |
Logotipo | ||
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UPC2721GV
SILICON MMIC
L BAND DOWNCONVERTER
FEATURES
• WIDE BAND OPERATION UP TO 2.5 GHz
• INTERNAL BALANCED AMPLIFIER FOR VCO
• SINGLE ENDED PUSH-PULL IF AMPLIFIER
• 5 V SINGLE SUPPLY VOLTAGE:
ICC = 30 to 35 mA
• LOW CURRENT DISSIPATION
• TAPE AND REEL PACKAGING OPTION AVAILABLE
DESCRIPTION
The UPC2721GV is a L-Band frequency converter manufac-
tured using the NESAT III MMIC process. This product con-
sists of a double balanced mixer, local oscillator, IF preampli-
fier, and constant voltage generator. It is available in a 8 pin
SSOP package. This device is designed for low cost cellular
radios, GPS receivers, PCS, and UHF TV tuner applications.
The UPC2721 output amplifier is a single-end push-pull ampli-
fier designed for operation into a 50 Ω load.
NEC's stringent quality assurance and test procedures ensure
the highest reliability and performance.
INTERNAL BLOCK DIAGRAM
OSC base
(bypass) 1
OSC base
(feedback)
2
OSC collector
(coupling)
3
OSC
OSC
BUFFER
8 RFIN1
RFIN2
7 (bypass)
6 GND
VCC 4 REG.
MIX
IF
AMP
5 IFOUT
ELECTRICAL CHARACTERISTICS (TA = 25°C, VCC = 5 V, PLO = -10 dBm)
PART NUMBER
PACKAGE OUTLINE
UPC2721GV
S08
SYMBOLS
PARAMETERS AND CONDITIONS
UNITS MIN TYP
ICC Circuit Current
mA 29 38
fRF RF Frequency Range
GHz
0.9
fIF IF Frequency Range
MHz
50
CG Conversion Gain2
fRF = 900 to 2000MHz,fIF = 50 to 400 MHz
fIF = 400 to 400 MHz
dB 18 21
dB 22
dB 19.5
PSAT
Saturated Output Power2
fRF = 800 to 2000 MHz, fIF = 400 MHz
dBm
dBm
2
7
7
NF Noise FigurefRF = 900 MHz, fIF = 400 MHz,
fRF = 2.0 GHz, fIF = 400 MHz
dB 9
dB 11
IP3 SSB Third Order Intercept Point, f1 = 900 MHz, f2 = 938 MHz
f1 = 2.0 GHz, f2 = 2.038 GHz
dBm
dBm
+10
+8.5
Notes:
1. Mounted on a 50 x 50 x 1.6 mm thick glass epoxy board with double sided copper.
2. Minimum and maximum specifications for CG and PSAT are measured at fRF = 900 MHz and 2.0 GHz and at fIF = 402.8 MHz.
MAX
45.5
2.0
600
24
13
15
The information in this document is subject to change without notice. Before using this document, please confirm
that this is the latest version.
Date Published: June 28, 2005
1 page OUTLINE DIMENSIONS (Units in mm)
UPC2721GV
PACKAGE OUTLINE S08
8 765
2721
XXX
N
Detail of Lead End
123
3.0 MAX
1.5±0.1
1.8 MAX
4
0.15+-00..1005
0.1 ± 0.1
0.65
+0.10
0.3 -0.05
0.575 MAX
3
+7˚
-3˚
4.94 ± 0.2
3.2±0.1
0.5 ± 0.2
0.87±0.2
UPC2721GV
LEAD CONNECTIONS
1. OSC-Base (Bypass)
2. OSC-Base (Feed back)
3. OSC-Collector (Coupling)
4. VCC
5. IF OUT
6. GND
7. RFIN2
8. RFIN1
Notes: Package will be marked as 2721 as shown.
All dimensions are typical unless otherwise specified.
Lead Material: Alloy 42
Lead Plating: Lead tin alloy
ORDERING INFORMATION (Solder Contains Lead)
PART NUMBER
QTY
UPC2721GV-E1
1000/Reel
ORDERING INFORMATION (Pb-Free)
PART NUMBER
QTY
UPC2721GV-E1-A
1000/Reel
Life Support Applications
These NEC products are not intended for use in life support devices, appliances, or systems where the malfunction of these products can reasonably
be expected to result in personal injury. The customers of CEL using or selling these products for use in such applications do so at their own risk and
agree to fully indemnify CEL for all damages resulting from such improper use or sale.
A Business Partner of NEC Compound Semiconductor Devices, Ltd.
5 Page |
Páginas | Total 6 Páginas | |
PDF Descargar | [ Datasheet UPC2721GV.PDF ] |
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